Patents by Inventor Wonil Kim

Wonil Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12087696
    Abstract: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: September 10, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunkyoung Seo, Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee, Sanguk Han
  • Patent number: 12080691
    Abstract: A semiconductor device including an interposer including a central region and an edge region entirely surrounding the central region, wherein the interposer includes a wiring structure disposed in the first region and a metal structure disposed continuously within the entirety of the second region, a first semiconductor chip mounted in the central region and connected to the wiring structure, and a second semiconductor chip mounted in the central region adjacent to the first semiconductor chip and connected to the second wiring structure.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: September 3, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungwoo Park, Heonwoo Kim, Sangcheon Park, Wonil Lee
  • Publication number: 20240274553
    Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.
    Type: Application
    Filed: April 23, 2024
    Publication date: August 15, 2024
    Inventors: Yukyung Park, Ungcheon Kim, Wonil Lee
  • Patent number: 12062404
    Abstract: A voltage trimming circuit including: a first resistance circuit having a first resistance value determined by up codes and down codes; a second resistance circuit having a second resistance value determined by the up codes and the down codes; and a comparator to output a voltage detection signal by comparing a voltage level of a reference voltage trimming node to that of a feedback node, wherein the voltage detection signal adjusts the up and down codes, which increase the first resistance value and decrease the second resistance value when the voltage level of the reference voltage trimming node is higher than that of the feedback node, and adjusts the up and down codes, which decrease the first resistance value and increase the second resistance value when the voltage level of the reference voltage trimming node is lower than that of the feedback node.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: August 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minho Choi, Jaeseong Lim, Kyungryun Kim, Daehyun Kim, Wonil Bae, Hohyun Shin, Sanghoon Jung, Hyongryol Hwang
  • Patent number: 12039968
    Abstract: System and method for operating an always-on ASR (automatic speech recognition) system by selecting target keywords and continuously detecting the selected target keywords in voice commands in a mobile device are provided. In the mobile device, a processor is configured to collect keyword candidates, collect usage frequency data for keywords in the keyword candidates, collect situational usage frequency data for the keywords in the keyword candidates, select target keywords from the keyword candidates based on the usage frequency data and the situational usage frequency data, and detect one or more of the target keywords in a voice command using continuous detection of the target keywords.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: July 16, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Wonil Chang, Jinseok Lee, Mingu Lee, Jinkyu Lee, Byeonggeun Kim, Dooyong Sung, Jae-Won Choi, Kyu Woong Hwang
  • Publication number: 20220323330
    Abstract: The present invention relates to: a composition for wound healing, containing a metal-organic framework (MOF)as an active ingredient; and a wound dressing material comprising a hydrophilic superabsorbent polymer and the MOF, and the composition and the wound dressing material have a wound healing ability, specifically, the excellent effect of healing a wound by promoting fibroblast movement, do not significantly differ from a control group with respect to cytotoxicity, thereby exhibiting excellent safety when applied to a wound site, and have the excellent effect of having a wound recovery rate high enough to be checked with the naked eye over time.
    Type: Application
    Filed: December 11, 2020
    Publication date: October 13, 2022
    Inventors: Chan Yeong HEO, Sun-Young NAM, Jae Heon JEONG, Kyungmin CHOI, Dong-Sik SHIN, Un Jin RYU, Seongsoo KIM, Wonil KIM, Jaejin PARK, Mingi SEO
  • Patent number: 7131911
    Abstract: A slope controllable foot plate for a golf swing practice apparatus which includes a actuating oil pressure motor providing the power for controlling the slope, a transformation device for transforming the rotating driving power to linear driving power, and a slope control oil pressure cylinder for controlling the slope of the foot plate, whereby a lower height and a simplified structure of the foot plate is obtained.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: November 7, 2006
    Assignee: Golfzon Co. Ltd
    Inventor: Wonil Kim
  • Publication number: 20050153787
    Abstract: The present invention relates to the slope controllable foot plate for golf swing practice apparatus. The invention is characterized by the actuating oil pressure motor (3, 4) providing the power for controlling the slope, transformation device (5, 8, 9) for transforming rotating driving power to linear driving power, and slope control oil pressure cylinder (11, 12, 13, 14) for controlling the slope of the foot plate. By this constitution, the invention accomplishes the lower height and the simplified structure of the foot plate.
    Type: Application
    Filed: February 27, 2004
    Publication date: July 14, 2005
    Inventor: Wonil Kim