Patents by Inventor Won Il Lee
Won Il Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136311Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.Type: ApplicationFiled: August 15, 2023Publication date: April 25, 2024Inventors: GWANGJAE JEON, MINKI KIM, Hyungchul SHIN, WON IL LEE, HYUEKJAE LEE, Enbin JO
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Publication number: 20240072006Abstract: A semiconductor package includes a first semiconductor chip including a first main region and a first edge region, and a second semiconductor chip on the first semiconductor chip and including a second main region and a second edge region. The first semiconductor chip includes a first main pad and a first dummy pad respectively on the first main region and the first edge region on a top surface of the first semiconductor chip. The second semiconductor chip includes a first semiconductor substrate, a wiring layer below the first semiconductor substrate and including a wiring dielectric layer and wiring patterns, a second main pad and a second dummy pad respectively on the second main region and the second edge region below the wiring layer. A thickness of the wiring layer is greater on the second main region than on the second edge region.Type: ApplicationFiled: May 31, 2023Publication date: February 29, 2024Inventors: WON IL LEE, HYUNGCHUL SHIN, GWANGJAE JEON, ENBIN JO
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Publication number: 20240007761Abstract: Light field microscope-based image acquisition apparatuses and methods are provided. The light field microscope-based image acquisition apparatus includes a lenslet synthesis processing unit configured to acquire a virtual lenslet image using a multi-lenslet image group; a sub-aperture image conversion unit configured to convert the virtual lenslet image generated in the lenslet synthesis processing unit into a sub-aperture image; and a 3D conversion unit configured to convert the sub-aperture image generated in the sub-aperture image conversion unit into a focal-stack image.Type: ApplicationFiled: September 14, 2023Publication date: January 4, 2024Inventors: Won Il LEE, Young Hyeon PARK
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Publication number: 20230356652Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.Type: ApplicationFiled: April 27, 2023Publication date: November 9, 2023Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park
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Publication number: 20230238417Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Inventors: Ji-hwang KIM, Jong-bo SHIM, Sang-uk HAN, Cha-jea JO, Won-il LEE
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Patent number: 11680282Abstract: A method of testing an antibiotic susceptibility includes dispensing and cultivating sample solution into culture wells including one or more comparative wells and a plurality of antibiotic wells receiving two or more kinds of antibiotics, respectively, receiving the sample solution into a plurality of preprocessing wells each including magnetic particles and fluorescent particles that bond to one or more kinds of bacteria such that the bacteria and the magnetic particles and fluorescent particles bond to each other, receiving the sample solution into a plurality of image wells having magnetic members thereunder such that the magnetic particles bonding to the bacteria are arranged on the bottoms of the image wells, removing the sample solution from the image wells that have undergone the planarizing step, taking fluorescent images of the image wells washed in the washing step, and determining an antibiotic tolerance/susceptibility of the sample solution by analyzing the fluorescent images.Type: GrantFiled: July 28, 2021Date of Patent: June 20, 2023Assignee: ACCUNOSE CO., LTD.Inventors: Won Il Lee, Young Hyeon Park
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Patent number: 11675468Abstract: Provided is a display device including a display panel and an input sensing layer including an effective region and a non-effective region. The input sensing layer includes a plurality of sensing electrodes, a plurality of signal lines, and a plurality of input pads. The non-effective region includes a first region, a second region, and a third region, and the signal lines include first sub-lines in the first region and connected to the sensing electrodes, second sub-lines in the second region and connected to the input pads, and third sub-lines in the third region and connecting the first sub-lines and the second sub-lines. An interval between the third sub-lines in the third region is a first interval which is a constant, and the first interval is smaller than a second interval between the first sub-lines and a third interval between the second sub-lines.Type: GrantFiled: January 31, 2022Date of Patent: June 13, 2023Assignee: Samsung Display Co., Ltd.Inventors: Won-Il Lee, Hwan-Hee Jeong
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Patent number: 11637140Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.Type: GrantFiled: March 16, 2021Date of Patent: April 25, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-hwang Kim, Jong-bo Shim, Sang-uk Han, Cha-jea Jo, Won-il Lee
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Publication number: 20220308701Abstract: Provided is a display device including a display panel and an input sensing layer including an effective region and a non-effective region. The input sensing layer includes a plurality of sensing electrodes, a plurality of signal lines, and a plurality of input pads. The non-effective region includes a first region, a second region, and a third region, and the signal lines include first sub-lines in the first region and connected to the sensing electrodes, second sub-lines in the second region and connected to the input pads, and third sub-lines in the third region and connecting the first sub-lines and the second sub-lines. An interval between the third sub-lines in the third region is a first interval which is a constant, and the first interval is smaller than a second interval between the first sub-lines and a third interval between the second sub-lines.Type: ApplicationFiled: January 31, 2022Publication date: September 29, 2022Inventors: WON-IL LEE, HWAN-HEE JEONG
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Patent number: 11455049Abstract: A display device, including a display panel that displays an image; a flexible printed circuit board including an attaching part attached to one end of the display panel and a curved part extending from the attaching part and not overlapping with the display panel; a window assembly on an upper surface of the display panel; an adhesive part between the window assembly and the display panel to couple the display panel and the window assembly; and a compensating part not overlapping with the display panel, overlapping with the curved part, and on a same layer as the attaching part.Type: GrantFiled: December 20, 2019Date of Patent: September 27, 2022Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Hyeong-Cheol Ahn, Won-il Lee, Byughoon Chae
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Publication number: 20220205013Abstract: A method of testing an antibiotic susceptibility includes dispensing and cultivating sample solution into culture wells including one or more comparative wells and a plurality of antibiotic wells receiving two or more kinds of antibiotics, respectively, receiving the sample solution into a plurality of preprocessing wells each including magnetic particles and fluorescent particles that bond to one or more kinds of bacteria such that the bacteria and the magnetic particles and fluorescent particles bond to each other, receiving the sample solution into a plurality of image wells having magnetic members thereunder such that the magnetic particles bonding to the bacteria are arranged on the bottoms of the image wells, removing the sample solution from the image wells that have undergone the planarizing step, taking fluorescent images of the image wells washed in the washing step, and determining an antibiotic tolerance/susceptibility of the sample solution by analyzing the fluorescent images.Type: ApplicationFiled: July 28, 2021Publication date: June 30, 2022Inventors: Won Il LEE, Young Hyeon PARK
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Publication number: 20220121303Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.Type: ApplicationFiled: December 23, 2021Publication date: April 21, 2022Inventors: Hyeong Cheol AHN, Yang Han SON, Yun Oh NAM, Won Il LEE, Youn Hwan JUNG, So Hyun KIM
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Patent number: 11280558Abstract: A composite sheet, including: a buffer sheet; and a heat dissipation sheet on one surface of the buffer sheet. One surface of the heat dissipation sheet facing the one surface of the buffer sheet may have a smaller area than the one surface of the buffer sheet. A display device includes a display panel and a composite sheet on one surface of the display panel.Type: GrantFiled: April 8, 2020Date of Patent: March 22, 2022Assignee: Samsung Display Co., Ltd.Inventors: Won Il Lee, Min Seop Kim
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Patent number: 11216094Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.Type: GrantFiled: May 21, 2018Date of Patent: January 4, 2022Assignee: Samsung Display Co., Ltd.Inventors: Hyeong Cheol Ahn, Yang Han Son, Yun Oh Nam, Won Il Lee, Youn Hwan Jung, So Hyun Kim
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Patent number: 11133355Abstract: An input sensor includes a first pattern and a second pattern overlapping with the first pattern with an intermediate insulating layer interposed therebetween. The second pattern is disposed on the intermediate insulating layer and connected to the first pattern via a contact hole defined through the intermediate insulating layer. The first pattern includes a first mesh line extending along a reference direction, and the second pattern includes a second mesh line extending along the reference direction and overlapping with the first mesh line. An edge of the first mesh line and an edge of the second mesh line are not aligned with each other along a direction perpendicular to a line width direction and the reference direction.Type: GrantFiled: May 7, 2020Date of Patent: September 28, 2021Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jongseon Park, Hwan-Hee Jeong, Sunhwa Kim, Won-Il Lee
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Publication number: 20210202563Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.Type: ApplicationFiled: March 16, 2021Publication date: July 1, 2021Inventors: Ji-hwang KIM, Jong-bo SHIM, Sang-uk HAN, Cha-jea JO, Won-il LEE
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FLUORESCENCE IMAGING-BASED DEVICE FOR DETECTING MICROORGANISMS AND METHOD FOR MANUFACTURING THE SAME
Publication number: 20210181197Abstract: The present invention relates to a fluorescence imaging-based device for detecting microorganisms, a manufacturing method thereof, and a method for detecting microorganisms using the same. The present invention relates to a fluorescence imaging-based device for detecting microorganisms which works with minimal user control and a method for detecting microorganisms, and enables direct observation and counting very few microorganisms within a predetermined fixed detection time.Type: ApplicationFiled: December 14, 2020Publication date: June 17, 2021Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Nae Eung LEE, Won Il LEE -
Publication number: 20210157451Abstract: An input sensor including a first electrode and a second electrode, which cross each other. The first electrode includes a first main portion extending in a first direction and first sensing portions and second sensing portions, which are disposed with the first main portion therebetween in a second direction and each of which extends from the first main portion. Each of the first sensing portions and the second sensing portions includes first sub-portions extending in the first direction and first middle portions disposed between the first sub-portions and between one of the first sub-portions and the first main portion.Type: ApplicationFiled: October 22, 2020Publication date: May 27, 2021Inventors: Hwan-Hee JEONG, Sunhwa Kim, Jongseon Park, Won-il Lee
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Patent number: 11009503Abstract: A biochemical detection device with a controlled reaction incubation time includes a substrate; a probe disposed on the substrate; a dissolvable material layer disposed on the substrate, wherein the dissolvable material layer has a first opening defined therein, wherein the probe is received in the first opening; an absorbing material layer disposed on the dissolvable material layer and having a second opening defined therein, wherein the first opening communicates with the second opening and is smaller than the second opening; and a non-dissolvable material layer disposed on an inner face of the second opening of the absorbing material layer and on an exposed top face of the dissolvable material layer.Type: GrantFiled: February 15, 2019Date of Patent: May 18, 2021Assignee: Research & Business Foundation Sungkyunkwan UniversityInventors: Nae Eung Lee, Won Il Lee
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Patent number: 10991224Abstract: The present disclosure relates to a fire detection system based on AI and a fire detection method based on Ai, which detects fire by using deep learning. The fire detection system includes a camera part generating video images, an object extraction part extracting a motion object from the video images, a video image conversion part generating a first background removal image, an image division part dividing the first background removal image with a plurality of division lines, and an analyzing part generating an abnormal signal and a normal signal.Type: GrantFiled: June 5, 2020Date of Patent: April 27, 2021Assignee: CHANG SUNG ACE CO., LTD.Inventors: Yeu Yong Lee, Won Il Lee