Abstract: A semiconductor package includes a semiconductor chip. The semiconductor chip includes a semiconductor substrate having a first surface and a second surface opposed to each other, an integrated circuit layer on the first surface of the semiconductor substrate, a wiring layer on the integrated circuit layer, a first pad and a second pad horizontally spaced apart from each other on the wiring layer and electrically connected to the wiring layer, a first bonding pad on the first pad and electrically connected to the first pad, a buried insulating pattern on the second pad, and a second bonding pad on the buried insulating pattern. The second bonding pad is electrically isolated from the second pad by the buried insulating pattern.

Abstract: Light field microscope-based image acquisition apparatuses and methods are provided. The light field microscope-based image acquisition apparatus includes a lenslet synthesis processing unit configured to acquire a virtual lenslet image using a multi-lenslet image group; a sub-aperture image conversion unit configured to convert the virtual lenslet image generated in the lenslet synthesis processing unit into a sub-aperture image; and a 3D conversion unit configured to convert the sub-aperture image generated in the sub-aperture image conversion unit into a focal-stack image.

Abstract: A semiconductor package includes: a semiconductor substrate; a through electrode that penetrates the semiconductor substrate; a first pad disposed on the through electrode; and a dielectric structure disposed on the semiconductor substrate, wherein a lower portion of the dielectric structure at least partially surrounds the through electrode, wherein an upper portion of the dielectric structure at least partially surrounds the first pad, wherein the dielectric structure includes: a first dielectric pattern; an etch stop pattern disposed on the first dielectric pattern; and a second dielectric pattern spaced apart from the first dielectric pattern by the etch stop pattern, wherein the first pad is in contact with the through electrode, the first dielectric pattern, the etch stop pattern, and second dielectric pattern, and wherein a top surface of the through electrode is at a level higher than a level of a top surface of the first dielectric pattern.

Abstract: A touch switch device for a vehicle and a method of manufacturing the touch switch device are proposed. The touch switch device includes an external panel that is a vehicle internal material on which symbols for selecting vehicle functions are engraved. The touch switch device also includes a switch body on which a touch electrode pattern sensing a touch to the symbol as a capacitance value is plated and to which a symbol-illuminating LED is attached and which is attached to a lower portion of the external panel. The touch switch device is configured such that a touch sensing of the touch electrode pattern is performed when the symbol of the external panel is touched, so that the vehicle function corresponding to the touched symbol is operated and, at the same time, the touched symbol is illuminated by turning on the LED.

Abstract: A semiconductor package includes: a semiconductor substrate; a through electrode that penetrates the semiconductor substrate; a first pad disposed on the through electrode; and a dielectric structure disposed on the semiconductor substrate, wherein a lower portion of the dielectric structure at least partially surrounds the through electrode, wherein an upper portion of the dielectric structure at least partially surrounds the first pad, wherein the dielectric structure includes: a first dielectric pattern; an etch stop pattern disposed on the first dielectric pattern; and a second dielectric pattern spaced apart from the first dielectric pattern by the etch stop pattern, wherein the first pad is in contact with the through electrode, the first dielectric pattern, the etch stop pattern, and second dielectric pattern, and wherein a top surface of the through electrode is at a level higher than a level of a top surface of the first dielectric pattern.

Abstract: The present invention relates to a fluorescence imaging-based device for detecting microorganisms, a manufacturing method thereof, and a method for detecting microorganisms using the same. The present invention relates to a fluorescence imaging-based device for detecting microorganisms which works with minimal user control and a method for detecting microorganisms, and enables direct observation and counting very few microorganisms within a predetermined fixed detection time.

Abstract: Provided is a semiconductor package including stacked semiconductor chips. Respective ones of the semiconductor chips include a substrate having front and rear surfaces, an interlayer dielectric layer on the front surface of the substrate, a lower protection layer on a bottom surface of the interlayer dielectric layer, lower conductive pads in the lower protection layer, an upper protection layer on the rear surface of the substrate, and upper conductive pads in the upper protection layer. The upper conductive pads of a first one of the semiconductor chips are respectively in contact with the lower conductive pads of an adjacent one of the semiconductor chips. Each of the upper protection layer and the lower protection layer has a non-uniform thickness. Ones of the lower conductive pads have respective thicknesses that are different from each other.

Abstract: According to example embodiments of the present inventive concept, a semiconductor chip includes: a semiconductor substrate including a first surface and a second surface that is opposite to the first surface; a through-via disposed in the semiconductor substrate; a first bonding pad disposed on the first surface of the semiconductor substrate and electrically connected to the through-via; a first dummy pad disposed on the first surface of the semiconductor substrate and insulated from the through-via; and a second bonding pad disposed on the second surface of the semiconductor substrate and electrically connected to the through-via, wherein a first maximum width of the first bonding pad is greater than a second maximum width in a first direction of the first dummy pad and is smaller than a third maximum width in a second direction of the first dummy pad, and wherein the first direction is substantially perpendicular to the second direction.

Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.

Abstract: A semiconductor package includes a lower semiconductor chip, a first semiconductor chip, a first through-electrode vertically penetrating the first semiconductor substrate, a first upper pad connected to the first through electrode, a first circuit layer disposed on the lower surface of the first semiconductor substrate, and a first lower pad disposed on a lower surface of the first circuit layer. A second semiconductor chip includes a second through-electrode spaced apart from the first through-electrode and vertically penetrating the second semiconductor substrate. A second upper pad is connected to the second through electrode. A second circuit layer is disposed on the lower surface of the second semiconductor substrate, and a second lower pad is connected to the second through-electrode on the lower surface of the second circuit layer through the second circuit layer and is integrally formed with the first upper pad.

Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: A semiconductor package includes a first semiconductor chip including a first main region and a first edge region, and a second semiconductor chip on the first semiconductor chip and including a second main region and a second edge region. The first semiconductor chip includes a first main pad and a first dummy pad respectively on the first main region and the first edge region on a top surface of the first semiconductor chip. The second semiconductor chip includes a first semiconductor substrate, a wiring layer below the first semiconductor substrate and including a wiring dielectric layer and wiring patterns, a second main pad and a second dummy pad respectively on the second main region and the second edge region below the wiring layer. A thickness of the wiring layer is greater on the second main region than on the second edge region.

Abstract: Light field microscope-based image acquisition apparatuses and methods are provided. The light field microscope-based image acquisition apparatus includes a lenslet synthesis processing unit configured to acquire a virtual lenslet image using a multi-lenslet image group; a sub-aperture image conversion unit configured to convert the virtual lenslet image generated in the lenslet synthesis processing unit into a sub-aperture image; and a 3D conversion unit configured to convert the sub-aperture image generated in the sub-aperture image conversion unit into a focal-stack image.

Abstract: A method of testing an antibiotic susceptibility includes dispensing and cultivating sample solution into culture wells including one or more comparative wells and a plurality of antibiotic wells receiving two or more kinds of antibiotics, respectively, receiving the sample solution into a plurality of preprocessing wells each including magnetic particles and fluorescent particles that bond to one or more kinds of bacteria such that the bacteria and the magnetic particles and fluorescent particles bond to each other, receiving the sample solution into a plurality of image wells having magnetic members thereunder such that the magnetic particles bonding to the bacteria are arranged on the bottoms of the image wells, removing the sample solution from the image wells that have undergone the planarizing step, taking fluorescent images of the image wells washed in the washing step, and determining an antibiotic tolerance/susceptibility of the sample solution by analyzing the fluorescent images.

Abstract: A method of testing an antibiotic susceptibility includes dispensing and cultivating sample solution into culture wells including one or more comparative wells and a plurality of antibiotic wells receiving two or more kinds of antibiotics, respectively, receiving the sample solution into a plurality of preprocessing wells each including magnetic particles and fluorescent particles that bond to one or more kinds of bacteria such that the bacteria and the magnetic particles and fluorescent particles bond to each other, receiving the sample solution into a plurality of image wells having magnetic members thereunder such that the magnetic particles bonding to the bacteria are arranged on the bottoms of the image wells, removing the sample solution from the image wells that have undergone the planarizing step, taking fluorescent images of the image wells washed in the washing step, and determining an antibiotic tolerance/susceptibility of the sample solution by analyzing the fluorescent images.

Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.

Abstract: A composite sheet, including: a buffer sheet; and a heat dissipation sheet on one surface of the buffer sheet. One surface of the heat dissipation sheet facing the one surface of the buffer sheet may have a smaller area than the one surface of the buffer sheet. A display device includes a display panel and a composite sheet on one surface of the display panel.

Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.

Abstract: The present invention relates to a fluorescence imaging-based device for detecting microorganisms, a manufacturing method thereof, and a method for detecting microorganisms using the same. The present invention relates to a fluorescence imaging-based device for detecting microorganisms which works with minimal user control and a method for detecting microorganisms, and enables direct observation and counting very few microorganisms within a predetermined fixed detection time.