Abstract: A capacitor structure includes a semiconductor substrate, a first well, a second well, a first electrode, a second electrode, a first choke impedance element and a second choke impedance element. The semiconductor substrate includes an outer well having a first conductivity type. The first well is disposed in the outer well and has a second conductivity type. The second well is disposed in the first well and has the first conductivity type. At least portions of the first and second electrodes contact the second well. The first choke impedance element is connected between the second well and a ground voltage. The second choke impedance element is connected between the first well and a power supply voltage.

Abstract: A transceiver includes a first mixer, a noise reduction circuit, a first amplifier, a second amplifier and an input/output (I/O) port. The first mixer receives first data and a first clock signal, and generates a first signal to be transmitted to an external device based on the first data and the first clock signal. The noise reduction circuit provides the first clock signal to the first mixer. The first amplifier amplifies the first signal received from the first mixer. The second amplifier amplifies a second signal received from the external device. The I/O port is shared by the first amplifier and the second amplifier, and is configured to output the amplified first signal and receive the second signal. The noise reduction circuit activates the first clock signal during an activation time interval for the first data, and deactivates the first clock signal during a deactivation time interval for the first data.

Abstract: An integrated circuit (IC) die stack is disclosed that routes signals and/or power around at least one active base die to die(s) above the at least one base die by using an interconnection interposer and at least one passive pass-through die. Through-silicon vias (TSV) and bond-pad vias (BPV) in the interconnection interposer and passive pass-through die(s) are used for signal connections between the base die, die(s) stacked above the base die and IC die stack substrate. Integration of complex electronic systems on a chip (SoC) can be inexpensively and quickly created using state of the art, off-the-shelf and unmodified IC devices.

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.

Abstract: Disclosed is a transmission radio frequency (RF) circuit including a transmission mixer configured to receive an intermediate frequency (IF) signal and up-convert the IF signal into an RF signal, a driving amplifier configured to amplify the RF signal, and an LLC filter electrically connected to a differential output of the transmission mixer and a differential input of the driving amplifier, the LLC filter comprising a first inductor connecting a first node of the differential output of the transmission mixer to a first intermediate node, a second inductor connecting a second node of the differential output of the transmission mixer to a second intermediate node, a third inductor connecting the first intermediate node to the second intermediate node, and a capacitor in parallel with the third inductor.

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.

Abstract: Disclosed is a transmission radio frequency (RF) circuit including a transmission mixer configured to receive an intermediate frequency (IF) signal and up-convert the IF signal into an RF signal, a driving amplifier configured to amplify the RF signal, and an LLC filter electrically connected to a differential output of the transmission mixer and a differential input of the driving amplifier, the LLC filter comprising a first inductor connecting a first node of the differential output of the transmission mixer to a first intermediate node, a second inductor connecting a second node of the differential output of the transmission mixer to a second intermediate node, a third inductor connecting the first intermediate node to the second intermediate node, and a capacitor in parallel with the third inductor.

Abstract: A switching transformer includes a drive amplifier configured to output an input signal by amplifying a source signal, a primary circuit including a set of primary inductors, a primary switch, and a first primary connecting wire, the set of primary inductors being configured to receive the input signal at a first primary input/output terminal, the primary switch being configured to adjust an inductance of the set of primary inductors based on a first switching operation, and the first primary connecting wire being configured to electrically connect the first primary input/output terminal to an end of the primary switch, and a secondary circuit configured to mutually electrically couple to the first primary connecting wire and at least one primary inductor among the set of primary inductors.

Abstract: A fully differential amplifier includes: an input stage comprising a first amplification circuit and a second amplification circuit, one of which is configured to generate a push signal and the other of which is configured to generate a pull signal, each by amplifying a differential input signal; an output stage for generating a differential output signal based on the push signal and the pull signal; and a feedback circuit for providing common mode feedback to the first amplification circuit based on the differential output signal, wherein the second amplification circuit may include a passive network for setting a common mode voltage of the push signal or the pull signal.

Abstract: A switching transformer includes a drive amplifier configured to output an input signal by amplifying a source signal, a primary circuit including a set of primary inductors, a primary switch, and a first primary connecting wire, the set of primary inductors being configured to receive the input signal at a first primary input/output terminal, the primary switch being configured to adjust an inductance of the set of primary inductors based on a first switching operation, and the first primary connecting wire being configured to electrically connect the first primary input/output terminal to an end of the primary switch, and a secondary circuit configured to mutually electrically couple to the first primary connecting wire and at least one primary inductor among the set of primary inductors.

Abstract: A fully differential amplifier includes: an input stage comprising a first amplification circuit and a second amplification circuit, one of which is configured to generate a push signal and the other of which is configured to generate a pull signal, each by amplifying a differential input signal; an output stage for generating a differential output signal based on the push signal and the pull signal; and a feedback circuit for providing common mode feedback to the first amplification circuit based on the differential output signal, wherein the second amplification circuit may include a passive network for setting a common mode voltage of the push signal or the pull signal.