Abstract: A semiconductor processing apparatus includes a storage container storing a photoresist, a supply control unit including pump devices, at least one pump controller controlling the pump devices, a system substrate connected to the pump devices and the at least one pump controller, and a bulkhead structure defining first and second space, wherein the pump devices are disposed in the first space and the at least one pump controller is disposed in the second space, and a spin coating unit including a stage on which a wafer is disposed, and a nozzle discharging the photoresist onto the wafer. The system substrate includes first and second surfaces, first connectors directly connected to a first group of pump devices, and second connectors directly connected to a second group of pump devices. Each first connector and each second connector are arranged alternately in the first direction.

Abstract: Provided is a method for processing a wafer edge portion using photolithograph equipment. The method includes placing a wafer on a support plate, inspecting a bead removal state of an edge portion of the wafer placed on the support plate, and exposing the edge portion of the wafer placed on the support plate to light. The inspecting of the bead removal state is performed by capturing first images from the wafer placed on the support plate and inspecting the first images.