Patents by Inventor Wonkwon Shin

Wonkwon Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR PROCESSING WAFER EDGE PORTION
    Publication number: 20130005056
    Abstract: Provided is a method for processing a wafer edge portion using photolithograph equipment. The method includes placing a wafer on a support plate, inspecting a bead removal state of an edge portion of the wafer placed on the support plate, and exposing the edge portion of the wafer placed on the support plate to light. The inspecting of the bead removal state is performed by capturing first images from the wafer placed on the support plate and inspecting the first images.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: SEMES CO., LTD.
    Inventors: Duk Sik Kim, Wonkwon Shin