Abstract: Provided is a method for forming an electronic package, comprising: providing a substrate comprising a first set of conductive pads at which a set of terminals of a first electronic component are to be mounted, respectively; forming solder paste on each of the first set of conductive pads, wherein the solder paste exposes a portion of a surface of a conductive pad that is facing away from the others of the first set of conductive pads but does not substantially expose another portion of the surface of the conductive pad that is facing towards the others of the first set of conductive pads; placing the first electronic component on the substrate with the set of terminals of the first electronic component aligned with the first set of conductive pads; reflowing the solder paste on the first set of conductive pads to secure the first electronic component onto the substrate.

Abstract: A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface; disposing the substrate strip on a first carrier; attaching a first electronic component onto the first mounting surface; disposing the substrate strip on a second carrier with a plurality of cavities, the first electronic component is received within one of the plurality of cavities; attaching a second electronic component onto the second mounting surface; singulating the substrate assemblies from each other; and bending the flexible link to form an angle between the first substrate and the second substrate.

Abstract: A semiconductor device has an interconnect substrate and an electrical component disposed over the substrate. A first carrier including a window is disposed over the interconnect substrate with the electrical component disposed within the window. A second carrier is disposed over the first carrier with a plurality of posts extending through the first carrier. The substrate is disposed over a third carrier. The posts may extend through the first carrier outside a footprint of the substrate. Alternatively, at least one of the posts extend through an opening in the substrate and the remaining posts are outside the footprint of the substrate. A plurality of pins extends from the second carrier to a dummy area of the substrate. Openings can be formed in a surface of the second carrier. The combination of first carrier, second carrier, and third carrier constitutes a mesh jig to support the strip of electrical components.