Abstract: Disclosed is a cathode for a lithium secondary battery, which has a coating layer formed on an edge portion of a cathode plate, a method of manufacturing the cathode, and a lithium secondary battery including the cathode. The cathode includes a cathode plate and a coating layer formed at an edge portion of the cathode plate, in which the cathode plate includes a cathode current collector provided with cathode tab and a cathode active material laminated on at least one surface of the cathode current collector, and the coating layer includes a conductive polymer layer and an insulating coating layer.

Abstract: Provided are a separator coating composition for a secondary battery including inorganic particles and a silane salt compound having a specific structure, a separator using the same, and an electrochemical device including the same. Specifically, a separator coating composition for a secondary battery which implements adhesion between an inorganic material layer and a porous substrate without including an acid/polymer-based organic binder in a coating composition for forming the inorganic material layer on one or both surfaces of the porous substrate and does not need a separate dispersing agent for dispersing the inorganic particles, a separator manufactured using the same, and an electrochemical device including the separator are provided.

Abstract: An object of the present invention is to provide a heat exchanger that is structurally coupled to an endplate without a process of welding a connection member. To achieve the above-mentioned object, a heat exchanger according to the present invention may include a plurality of main plates each including a through-hole through which a heat exchange medium flows, and an outer wall formed at a periphery thereof, the plurality of main plates being stacked to constitute a heat exchanger core having a flow path formed therein, an endplate being in surface contact with the main plate disposed at an outermost side of the heat exchanger core, the endplate having one or more connection holes, and a connection member configured to be connected to an external component and at least partially inserted into the connection hole.

Abstract: A water-cooling type condenser having a core part having a refrigerant fluid channel wherein a refrigerant flows and a cooling water fluid channel wherein cooling water flows; a gas-liquid separator disposed spaced apart from one side of the core part; a penetration connector having communication holes passing through both sides thereof, one side thereof being inserted into and coupled to a refrigerant outlet formed on the core part, and the other side being inserted into and coupled to a refrigerant inlet formed on the gas-liquid separator. A non-penetration connector is blocked between both sides thereof. One side is inserted into and coupled to a coupling hole formed on the core part, and the other side is inserted into and coupled to a coupling hole formed on the gas-liquid separator. The gas-liquid separator and the refrigerant fluid channel communicate. The gas-liquid separator is fixed to the core part.

Abstract: A MEMS microphone package having improved acoustic properties, and to a packaging method, which involve adding a vent path in the packaging process to improve equilibrium between internal and external air pressure. The MEMS microphone package includes a MEMS microphone chip, in which a back plate and a diaphragm structure are formed in a body by using MEMS process techniques; a substrate for mounting the MEMS microphone chip thereon; a vent path which is formed between the MEMS microphone chip and the substrate by applying an adhesive only to a portion of the substrate and adhering the MEMS microphone chip to the substrate; and a case which is adhered to the substrate and forms a space for accommodating the MEMS microphone chip, wherein acoustic properties of the MEMS microphone package are improved as air pressure inside the MEMS microphone chip and air pressure outside the MEMS microphone chip form air equilibrium via the vent path.

Abstract: The present invention relates to a spacer-integrated diaphragm, in which spacers are integrated with the diaphragm, in order to reduce the number of components and manufacturing processes needed and remove parasitic capacitance. A characterizing feature of the spacer-integrated diaphragm of the present invention is that it has an integrated structure comprising a diaphragm of a flat conductive film, and thermally insulative spacers formed so as to protrude on peripheral portions of the diaphragm through a PSR (Photo Solder Resist) printing process. The spacers are formed with a plurality of holes to remove parasitic capacitance, the diaphragm has a rectangular flat shape with round edges, and the spacers are formed near the four edges of the rectangular flat shape.

Abstract: A multi-layer electret that can endure a high temperature so as to be processed by surface mount technology (SMT) and has ultra-high charge stability and a method of manufacturing thereof are provided. The multi-layer electret is constructed in such a manner that an FET film of 12.5 &mgr;m˜25 &mgr;m in thickness melting-adheres to a surface of a metal plate, and a PTFE film of 30 &mgr;m˜100 &mgr;m in thickness melting-adheres to the surface of the FEP film.

Abstract: A multi-layer electret that can endure a high temperature so as to be processed by surface mount technology (SMT) and has ultra-high charge stability and a method of manufacturing thereof are provided. The multi-layer electret is constructed in such a manner that an FET film of 12.5 &mgr;m˜25 &mgr;m in thickness melting-adheres to a surface of a metal plate, and a PTFE film of 30 &mgr;m˜100 &mgr;m in thickness melting-adheres to the surface of the FEP film.