Patents by Inventor Wonuk Yoon

Wonuk Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240399532
    Abstract: A polishing head of a CMP apparatus may include a head block, a distribution block and a segmentation type head module. The head block may configured to be positioned over a substrate. The distribution block may be rotatably connected to a lower surface of the head block with respect to a vertical direction. A plurality of pressure lines may be connected to the distribution block and configured to flow a working fluid therethrough. The segmentation type head module may be connected to the lower surface of the distribution block. The segmentation type head module may be configured to rotate with respect to the vertical direction together with the distribution block. The segmentation type head module may be configured to locally pressurize the substrate using the working fluid provided through the pressure lines.
    Type: Application
    Filed: November 30, 2023
    Publication date: December 5, 2024
    Inventors: Junyoung Choi, Wonuk Yoon, Jaemook Kang, Keonwoo Kim, Sungyong Park, Hoseop Choi, Seonmin Yun, Jitae Lee