Patents by Inventor Woo-Beom Choi

Woo-Beom Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240158248
    Abstract: The present disclosure relates to a method for recovering ammonia, the method comprising (a) preparing a gas containing ammonia,(b) supplying the gas containing ammonia to a mixed solution of an aqueous solution of sulfuric acid and a antisolvent of ammonium sulfate, to obtain ammonium sulfate crystals, and (c) separating the ammonium sulfate crystals from the mixed solution, wherein a volume ratio of the antisolvent of ammonium sulfate to the aqueous solution of sulfuric acid is greater than 1.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 16, 2024
    Inventors: Yong Ju CHOI, Jae Beom PARK, Woo Ram LEE
  • Patent number: 6197139
    Abstract: An electrostatic thermal bonding method for bonding a pair of glass substrates, is capable of solving the problems such as a contamination of a device and incomplete vacuum packaging due to gas generated during the bonding of glass substrates utilizing a conventional epoxy or frit. The electrostatic thermal bonding method uses a silicon-glass bonding mechanism. First, a silicon thin film is deposited on a metal thin film formed on a side of one glass substrate, and the two glass substrates are brought face to face with each other by bringing the silicon thin film into contact with the surface of the other glass substrate. A predetermined direct current voltage is applied between the metal thin film and the other glass substrate under a predetermined temperature, thereby the bonding between glass substrates is performed. In the glass-glass bonding method utilizing the silicon thin film, the direct current voltage in the range of 0 to 1000V is applied under a bonding temperature between 100 to 500° C.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: March 6, 2001
    Assignee: Korea Institute of Science & Tech.
    Inventors: Byeong-Kwon Ju, Myung-Hwan Oh, Woo-Beom Choi
  • Patent number: 6007397
    Abstract: In the present invention, the vacuum packaging of a field emission display (FED) is achieved in a high vacuum apparatus using a glass-to-glass bonding. The apparatus may eliminate the problems encountered in the conventional art in which a ventilation tube is used, so that vacuum degree of the interior of panels of the FED is affected (decreased) by the gases generated in sealing the ventilation tube. Furthermore, in the prior art, a part of the ventilation tube remains on the panel of the FED for thereby increasing the thickness of the panels, and the ventilating of gases is not effectively performed by the extension of the tube and a big size hole.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: December 28, 1999
    Assignee: Korea Institute of Science and Technology
    Inventors: Byeong Kwon Ju, Woo Beom Choi, Myung Hwan Oh