Patents by Inventor Woo Chul NA

Woo Chul NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
    Patent number: 9896465
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Dong Hwan Lee, Min Gyum Kim, So Yoon Kim, Woo Chul Na, Yoon Man Lee, Ji Yoon Cho, Ki Hyeok Kwon, KyoungChul Bae, Eun Jung Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han
  • PHOSPHONIUM COMPOUND, PREPARATION METHOD THEREOF, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
    Publication number: 20160368937
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Application
    Filed: June 22, 2016
    Publication date: December 22, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, So Yoon KIM, Woo Chul NA, Yoon Man LEE, Ji Yoon CHO, Ki Hyeok KWON, KyoungChul BAE, Eun Jung LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • Epoxy resin composition and semiconductor apparatus prepared using the same
    Patent number: 9153513
    Abstract: An epoxy resin composition includes an inorganic filler, an epoxy resin, and a curing agent. The inorganic filler has an average particle diameter D50 from about 2 ?m to about 10 ?m, an average particle diameter D10 of about 3 ?m or less, and an average particle diameter D90 from about 6 ?m to about 15 ?m. Inorganic filler particles having a particle diameter of about 25 ?m or more constitute about 0.1 wt % or less of the inorganic filler.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: October 6, 2015
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Woo Chul Na, Seung Han
  • EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS PREPARED USING THE SAME
    Publication number: 20150021763
    Abstract: An epoxy resin composition includes an inorganic filler, an epoxy resin, and a curing agent. The inorganic filler has an average particle diameter D50 from about 2 ?m to about 10 ?m, an average particle diameter D10 of about 3 ?m or less, and an average particle diameter D90 from about 6 ?m to about 15 ?m. Inorganic filler particles having a particle diameter of about 25 ?m or more constitute about 0.1 wt % or less of the inorganic filler.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Inventors: Woo Chul NA, Seung HAN