Abstract: An air velocity control unit includes first bars fixed using a frame. Second bars are disposed below the first bars. The second bars are alternatively arranged between the first bars. The second bars are connected with each other. The unit further includes a control member for moving the second bars upwardly and downwardly to control the air velocity. A connecting member connects the second bars to the control member. Clean air flows into a clean room by a controllable velocity in accordance with the upward and downward movement of the second bars.

Abstract: A fluid sampling apparatus and associated fluid analyzer sample process fluids used in semiconductor manufacturing at a plurality of measurement points. The fluid sampling apparatus includes a first nozzle assembly having a plurality of outlet nozzles. The plurality of outlet nozzles are connected to lines supplying the process fluids. A second nozzle assembly is installed above the first nozzle assembly and includes an inlet nozzle connected to an apparatus for measuring a contamination level of the process fluids. A motor is connected to the second nozzle assembly to align a selected outlet nozzle with the inlet nozzle. A pneumatic cylinder is coupled to the first nozzle assembly to connect the selected outlet nozzle with the inlet nozzle. In this manner, it is possible to measure the contamination level of process fluids supplied at a plurality of measurement points by using a single measuring apparatus.

Abstract: An air velocity control unit includes first bars fixed using a frame. Second bars are disposed below the first bars. The second bars are alternatively arranged between the first bars. The second bars are connected with each other. The unit further includes a control member for moving the second bars upwardly and downwardly to control the air velocity. A connecting member connects the second bars to the control member. Clean air flows into a clean room by a controllable velocity in accordance with the upward and downward movement of the second bars.

Abstract: A fluid sampling apparatus and associated fluid analyzer sample process fluids used in semiconductor manufacturing at a plurality of measurement points. The fluid sampling apparatus includes a first nozzle assembly having a plurality of outlet nozzles. The plurality of outlet nozzles are connected to lines supplying the process fluids. A second nozzle assembly is installed above the first nozzle assembly and includes an inlet nozzle connected to an apparatus for measuring a contamination level of the process fluids. A motor is connected to the second nozzle assembly to align a selected outlet nozzle with the inlet nozzle. A pneumatic cylinder is coupled to the first nozzle assembly to connect the selected outlet nozzle with the inlet nozzle. In this manner, it is possible to measure the contamination level of process fluids supplied at a plurality of measurement points by using a single measuring apparatus.

Abstract: A photo process system for semiconductor wafers prevents air from flowing across the top of a baking region to produce a stable downward laminar air flow in front of baking units disposed at several levels in the baking region. The baking region is located on one side of a housing, and a coating unit for coating a wafer with a photoresist is located on the other side of the housing. The housing has a clean air entrance and air filters at an upper portion thereof, and a clean air discharge opening at the very bottom thereof. An air flow containment dam prevents clean air entering the housing from flowing horizontally at the top of the baking region. Such a horizontal flow of air would otherwise produce turbulence severely affecting the ability of the air to flow downward across the front of the baking units and toward the discharge opening as a laminar air flow. The laminar air flow hardly passes into the baking units and thus, hardly induces temperature variations in the coated wafers that are being baked.

Abstract: A microelectronic fabrication system that includes a service area, a process area in the service area where microelectronic devices are processed, and a transfer area in the service area where microelectronic devices are transferred to and from the process area, is cleaned by maintaining higher pressure in the process area than in the transfer area, to thereby reduce particle flow from the transfer area to the process area. It has been found that conventional microelectronic fabrication system cleaning methods and systems can allow air to flow backward to the wafer process area. By allowing backward flow of air to the wafer process area, air may be induced from a place where a lower degree of cleanliness is maintained to a place where a higher degree of cleanliness should be maintained. Due to the backward flow of air, particles contained in the transfer area, that may be generated by the transfer system, may flow onto the wafer that is being processed in the process area.