Abstract: Disclosed are a curable polysiloxane composition for an optical device including at least one kind of a first siloxane compound represented by Chemical Formula 1, at least one kind of a second siloxane compound having hydrogen bound to silicon (Si—H) at the terminal end, and at least one kind of a third siloxane compound having an alkenyl group bound to silicon (Si-Vi) at the terminal end, an encapsulating material obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulating material. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(L1-O)D2(L2-O)D3(R6R7SiO2/2)D4(L3-O-L4-O)D5(R8SiO2/2—Y1—SiO2/2R9)D6(R10R11Si—Y2)D7(R12SiO3/2)T1(R13SiO3/2)T2(SiO3/2—Y3—SiO3/2)T3(SiO4/2)Q1??[Chemical Formula 1] In Chemical Formula 1, R1 to R13, Y1 to Y3, M1, D1 to D7, T1 to T3 and Q1 are the same as defined in the specification.

Abstract: Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.

Abstract: A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:

Abstract: A siloxane monomer obtained from a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2, an encapsulant composition including the siloxane monomer, an encapsulant obtained by curing the encapsulant composition, and an electronic device including the encapsulant are disclosed.

Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.

Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a solvent, wherein the silicon-containing polymer has a total sum of Si—H integral values in a 1H-NMR spectrum of less than or equal to about 12. The sum of the Si—H integral values is calculated under conditions described in the specification.

Abstract: Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si—H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

Abstract: A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.

Abstract: A rinse solution for a silica thin film includes trimethylbenzene, diethylbenzene, indane, indene, tert-butyl toluene, methylnaphthalene, a mixture including an aromatic hydrocarbon having 12 or more carbon atoms, a mixture including an aliphatic hydrocarbon having 12 or more carbon atoms, a mixture including a hetero hydrocarbon compound including a phenyl group and an oxygen atom, or a combination thereof.

Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

Abstract: A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:

Abstract: A curable organic polysiloxane composition includes (A) an amide compound represented by Chemical Formula 1, (B) at least one first siloxane compound including a silicon-bonded alkenyl group (Si-Vi) and including a moiety represented by Chemical Formula 2, and (C) at least one second siloxane compound having a silicon-bonded hydrogen (Si—H): where R, R1, R2, l, m, and n are as defined in the specification.

Abstract: Disclosed are a curable polysiloxane composition for an optical device including at least one kind of a first siloxane compound represented by Chemical Formula 1, at least one kind of a second siloxane compound having hydrogen bound to silicon (Si—H) at the terminal end, and at least one kind of a third siloxane compound having an alkenyl group bound to silicon (Si-Vi) at the terminal end, an encapsulating material obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulating material. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(L1-O)D2(L2-O)D3(R6R7SiO2/2)D4(L3-O-L4-O)D5(R8SiO2/2—Y1—SiO2/2R9)D6(R10R11Si—Y2)D7(R12SiO3/2)T1(R13SiO3/2)T2(SiO3/2—Y3—SiO3/2)T3(SiO4/2)Q1 ??[Chemical Formula 1] In Chemical Formula 1, R1 to R13, Y1 to Y3, M1, D1 to D7, T1 to T3 and Q1 are the same as defined in the specification.

Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Abstract: A siloxane monomer obtained from a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2, an encapsulant composition including the siloxane monomer, an encapsulant obtained by curing the encapsulant composition, and an electronic device including the encapsulant are disclosed.

Abstract: A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.

Abstract: Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si—H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Abstract: Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.