Patents by Inventor Woo Hyuck Chang

Woo Hyuck Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8808837
    Abstract: A flexible film is provided. The flexible film includes a dielectric film, a metal layer disposed on the dielectric film, and at least one hole formed through the dielectric film and the metal layer. Therefore, it is possible to facilitate the alignment of circuit patterns on a flexible film with an electrode of a panel of a display device or a circuit of a driving unit of a display device.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: August 19, 2014
    Assignee: LG Electronics Inc.
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Patent number: 7936066
    Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:3 to 1:10. Therefore, it is possible to improve the peel strength, dimension stability, and tensile strength of a flexible film by limiting the ratio of the thicknesses of a dielectric film and a metal layer of the flexible film.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: May 3, 2011
    Assignee: LG Electronics Inc.
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090169773
    Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the water absorbency of the dielectric film is about 0.01-3.5%. The flexible film is robust against humidity variations and can efficiently transmit image signals having a high scan rate.
    Type: Application
    Filed: May 23, 2008
    Publication date: July 2, 2009
    Inventors: Sang Gon LEE, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090167638
    Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the dielectric film has a thermal expansion coefficient of about 3 to 25 ppm/° C. The flexible film is robust against temperature variations and has excellent thermal resistance and excellent dimension stability.
    Type: Application
    Filed: May 22, 2008
    Publication date: July 2, 2009
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090166070
    Abstract: A flexible film is provided. The flexible film includes a dielectric film, a first metal layer, which is formed on the dielectric film, and a second metal layer, which is formed on the first metal layer, wherein the surface of the dielectric film is modified so as to provide a haze of 2-25%. Therefore, it is possible to improve the peel strength of a dielectric film with respect to a metal layer and facilitate the testing of circuit patterns on a flexible film.
    Type: Application
    Filed: May 22, 2008
    Publication date: July 2, 2009
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090167735
    Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:1.5 to 1:10. The flexible film has excellent plating, adhesive strength, thermal resistance, folding endurance and chemical resistance properties.
    Type: Application
    Filed: May 22, 2008
    Publication date: July 2, 2009
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090169916
    Abstract: Provided is a flexible film which includes a dielectric film, a metal layer formed on the dielectric film, circuit patterns formed on the metal layer, and a tin-based bonding layer formed on the circuit patterns. Thus, it is possible to improve the reliability, thermal resistance, and dimension stability of a flexible film and enhance the adhesion between circuit patterns and an integrated circuit (IC) of a flexible film and between circuit patterns and circuit electrodes of a display device.
    Type: Application
    Filed: May 22, 2008
    Publication date: July 2, 2009
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090166860
    Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:3 to 1:10. Therefore, it is possible to improve the peel strength, dimension stability, and tensile strength of a flexible film by limiting the ratio of the thicknesses of a dielectric film and a metal layer of the flexible film.
    Type: Application
    Filed: May 22, 2008
    Publication date: July 2, 2009
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang
  • Publication number: 20090162607
    Abstract: A flexible film is provided. The flexible film includes a dielectric film, a metal layer disposed on the dielectric film, and at least one hole formed through the dielectric film and the metal layer. Therefore, it is possible to facilitate the alignment of circuit patterns on a flexible film with an electrode of a panel of a display device or a circuit of a driving unit of a display device.
    Type: Application
    Filed: May 22, 2008
    Publication date: June 25, 2009
    Inventors: Sang Gon Lee, Dae Sung Kim, Woo Hyuck Chang