Patents by Inventor Woo-Jeong Cho

Woo-Jeong Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091730
    Abstract: The present invention relates to the stabilization of an effective ingredient by using a mineral material. In the present invention, the effective ingredient can be stably supported using the mineral material, and a microcapsule obtained by the manufacturing method according to the present invention, when discharged to nature, causes no environmental problems due to encapsulation ingredients thereof being the same as soil ingredients, and thus can avoid micro-plastic issues.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 21, 2024
    Applicants: LG HOUSEHOLD & HEALTH CARE LTD., IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Jun Seok YEOM, Eun Chul CHO, Ji Won LIM, Hyo Jin BONG, Seon A JEONG, No Jin PARK, Woo Sun SHIM
  • Patent number: 7772103
    Abstract: In a method of forming a wire structure, first active regions and second active regions are formed on a substrate. Each of the first active regions has a first sidewall of a positive slope and a second sidewall opposed to the first sidewall. The second active regions are arranged along a first direction. An isolation layer is between the first active regions and the second active regions. A first mask is formed on the first active regions, the second active regions and the isolation layer. The first mask has an opening exposing the first sidewall and extending along the first direction. The first active regions, the second active regions and the isolation layer are etched using the first mask to form a groove extending along the first direction and to form a fence having a height substantially higher than a bottom face of the groove. A wire is formed to fill the groove. A contact is formed on the wire. The contact is disposed toward the second active regions from the fence.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: August 10, 2010
    Assignee: Samsung Electronics Co. Ltd
    Inventors: Ho-Jun Yi, Yong-Il Kim, Bong-Soo Kim, Dae-Young Jang, Woo-Jeong Cho
  • Publication number: 20090035930
    Abstract: In a method of forming a wire structure, first active regions and second active regions are formed on a substrate. Each of the first active regions has a first sidewall of a positive slope and a second sidewall opposed to the first sidewall. The second active regions are arranged along a first direction. An isolation layer is between the first active regions and the second active regions. A first mask is formed on the first active regions, the second active regions and the isolation layer. The first mask has an opening exposing the first sidewall and extending along the first direction. The first active regions, the second active regions and the isolation layer are etched using the first mask to form a groove extending along the first direction and to form a fence having a height substantially higher than a bottom face of the groove. A wire is formed to fill the groove. A contact is formed on the wire. The contact is disposed toward the second active regions from the fence.
    Type: Application
    Filed: June 26, 2008
    Publication date: February 5, 2009
    Inventors: Ho-Jun Yi, Yong-ll Kim, Bong-Soo Kim, Dae-Young Jang, Woo-Jeong Cho