Abstract: A method of fabricating a semiconductor device is provided. The method includes: loading a substrate into a substrate processing apparatus; and processing the substrate, using the substrate processing apparatus. The processing the substrate includes: providing a process gas; generating a process etchant from the process gas, using plasma ignition, the process etchant including a first etchant and a second etchant; processing the substrate, using the process etchant; identifying a composition rate of the process etchant; and controlling the processing of the substrate based on a process result according to the composition rate of the process etchant.

Abstract: A substrate processing apparatus, a substrate processing method, and a method of fabricating a semiconductor device are provided. The substrate processing method includes providing a process gas, generating a preliminary etchant, which includes a first etchant and a second etchant, from the process gas through plasma ignition, generating a process etchant by controlling a composition ratio of the preliminary etchant, and performing a selective etching of the substrate with the process etchant.

Abstract: Disclosed is a receptacle connector that can be freely positioned and that has excellent space utilization. A receptacle connector having an antenna function according to an aspect of the present invention is a receptacle connector for electrically connecting a plug connector and a circuit board and comprises a metal housing, a contact assembly, and a ceramic shell. The metal housing has an open front surface and an interior formed in a hollow shape. The contact assembly is provided with a plurality of contacts installed inside the metal housing to relay electrical signals. The ceramic shell is coupled in a shape surrounding the housing. The top surface of the ceramic shell has an antenna pattern formed thereon.

Abstract: Disclosed is a receptacle connector that can be freely positioned and that has excellent space utilization. A receptacle connector having an antenna function according to an aspect of the present invention is a receptacle connector for electrically connecting a plug connector and a circuit board and comprises a metal housing, a contact assembly, and a ceramic shell. The metal housing has an open front surface and an interior formed in a hollow shape. The contact assembly is provided with a plurality of contacts installed inside the metal housing to relay electrical signals. The ceramic shell is coupled in a shape surrounding the housing. The top surface of the ceramic shell has an antenna pattern formed thereon.

Abstract: Disclosed are a plug connector and a receptacle connector that have improved structures, and methods of manufacturing the same. A plug connector according to an embodiment of the present invention includes an upper ceramic substrate, a lower ceramic substrate, upper plug contacts, lower plug contacts, a pair of metal members, and a ceramic plug shell. The upper ceramic substrate is provided with a terminal at a lower surface thereof. The lower ceramic substrate is configured to correspond to the upper ceramic substrate and is provided with a terminal at an upper surface thereof. The upper plug contacts are coupled to the terminal of the upper ceramic substrate and each include a downwardly protruding contact portion. The lower plug contacts are coupled to the terminal of the lower ceramic substrate and each include an upwardly protruding contact portion.