Abstract: The present invention relates to a method for manufacturing an angle and curvature detection sensor, and the sensor and, more specifically, to: a method for manufacturing a thin-film transistor array-based backplane by a roll-to-roll gravure printing process and manufacturing a sensor for measuring an angle change and a degree of curvature of the X axis and the Y axis by using the backplane; and the sensor. The method for manufacturing an angle and curvature detection sensor, according to an embodiment of the present invention, comprises the steps of: manufacturing a thin-film transistor backplane by a roll-to-roll gravure printing process; forming a protective layer on the thin-film transistor backplane by printing; forming a sealed space by adhering a flexible plastic case onto the upper part of the protective layer by means of an adhesive; and filling the sealed space with a first liquid and injecting a second liquid.

Abstract: A refrigerator planar heating element is arranged inside a refrigerator to radiate heat. The refrigerator planar heating element includes a defrosting planar heating element including a first substrate having one surface on which a first pattern for radiating heat is printed with conductive ink, a second substrate having one surface on which a second pattern for radiating heat and having the same form as the pattern of the first substrate is printed with conductive ink, and an adhesive layer performing bonding such that the patterns of the first substrate and the second substrate are overlapped in a vertical direction. The invention has heating performance more excellent than that of conventional heating elements, and applies an inverse current patterning technique so as to make a current flow in opposite directions at both surfaces of a substrate, thereby effectively shielding electromagnetic waves.

Abstract: The present invention relates to a method for manufacturing an angle and curvature detection sensor, and the sensor and, more specifically, to: a method for manufacturing a thin-film transistor array-based backplane by a roll-to-roll gravure printing process and manufacturing a sensor for measuring an angle change and a degree of curvature of the X axis and the Y axis by using the backplane; and the sensor. The method for manufacturing an angle and curvature detection sensor, according to an embodiment of the present invention, comprises the steps of: manufacturing a thin-film transistor backplane by a roll-to-roll gravure printing process; forming a protective layer on the thin-film transistor backplane by printing; forming a sealed space by adhering a flexible plastic case onto the upper part of the protective layer by means of an adhesive; and filling the sealed space with a first liquid and injecting a second liquid.

Abstract: A wafer test apparatus includes a probe station comprising a probe card that contacts a wafer positioned on a chuck during a wafer test. A test head is disposed on the probe card and tests electrical characteristics of a semiconductor chip positioned on the wafer. A probe card horizontality adjustment unit is positioned between the test head and the probe card and adjusts horizontality of the probe card during the wafer test.

Abstract: A wafer transfer robot includes a robot transfer mechanism including a robot axis member and a robot arm member connected to the robot axis member, a robot hand connected to the robot arm member of the robot transfer mechanism and configured to transfer a wafer by using the robot transfer mechanism, a vertical displacement sensor installed in an upper side of the robot hand, and a plurality of horizontal displacement sensors installed in the upper side of the robot hand and separate from each other along a virtual line that is perpendicular to bilaterally symmetric axis of the robot hand.

Abstract: A wafer test apparatus includes a probe station comprising a probe card that contacts a wafer positioned on a chuck during a wafer test. A test head is disposed on the probe card and tests electrical characteristics of a semiconductor chip positioned on the wafer. A probe card horizontality adjustment unit is positioned between the test head and the probe card and adjusts horizontality of the probe card during the wafer test.

Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.

Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.

Abstract: A method for transporting semiconductor wafers in semiconductor factory automation system, includes the steps of: a) processing a lot of semiconductor wafers to be contained in a semiconductor wafer cassette in a process equipment; b) sending a cassette transportation request from the process equipment to a cell management server when the process equipment has processed the lot of semiconductor wafers; c) generating a transportation instruction in response to the cassette transportation request; and d) if the semiconductor wafer cassette is transported from the process equipment to a stocker by an automatic guide vehicle (AGV), simultaneously activating the AGV and the stocker by simultaneously sending the transportation instruction to the AGV and the stocker. The method in accordance with the present invention can reduce a time taken to transport the semiconductor wafers.

Abstract: A method for resetting a process recipe in a semiconductor factory automation (FA) system, includes the steps of: a) sending the process recipe and a lot identifier inputted from an operator to a process equipment, wherein the process recipe represents a set of semiconductor process conditions corresponding to a lot of semiconductor wafers and the lot identifier corresponds to the lot of semiconductor wafers; b) processing the lot of semiconductor wafers according to the process recipe; c) measuring the processed lot of semiconductor wafers to generate semiconductor measurement data; d) writing the semiconductor measurement data to a trace file, wherein the trace file includes the process recipe, the semiconductor measurement data and the lot identifier; e) retrieving the semiconductor measurement data contained in the trace file in response to a retrieval command inputted from the operator; and f) resetting the process recipe in response to a reset command inputted from the operator if the process recipe is