Abstract: Provided is a vaccine composition for preventing respiratory syncytial virus (RSV) infection, which is in the form of a liposome formulation including a RSV antigen, monophosphoryl lipid A (MLA), and/or a cobalt-porphyrin-phospholipid (CoPoP) conjugate. The vaccine composition exhibits excellent vaccine efficacy from a RSV antigen with enhanced immunogenicity and a combination of immune adjuvants for enhancing immune activity and antigen presentation.

Abstract: A positive electrode active material for a secondary battery includes a lithium composite transition metal oxide including nickel (Ni), cobalt (Co), and manganese (Mn), wherein the lithium composite transition metal oxide has a layered crystal structure of space group R3m, includes the nickel (Ni) in an amount of 60 mol % or less based on a total amount of transition metals, includes the cobalt (Co) in an amount greater than an amount of the manganese (Mn), and is composed of single particles.

Abstract: Disclosed herein are an air cleaning and disinfection robot and a method of operating the same. The air cleaning and disinfection robot includes a driving unit configured to move autonomously in a target space, a plurality of air conditioning modules configured to manage air quality in the target space and detachably provided on the driving unit, a station on which the plurality of air conditioning modules are mounted, a docking unit configured to couple and separate the driving unit and each of the air conditioning modules to and from each other, and a detection unit configured to detect an operation environment of the target space, wherein the driving unit, based on information obtained by the detection unit, may selectively couple to and move with any one of the plurality of air conditioning modules.

Abstract: A method for controlling an electric heater of a vehicular heating, ventilation, and air conditioning (HVAC) system includes turning on the electric heater; determining whether an ambient air temperature of a vehicle is higher than or equal to a threshold ambient air temperature, and a battery temperature is lower than or equal to a threshold battery temperature; determining whether battery efficiency is lower than or equal to threshold efficiency when the ambient air temperature of the vehicle is higher than or equal to the threshold ambient air temperature, and the battery temperature is lower than or equal to the threshold battery temperature; and turning off the electric heater when the battery efficiency is lower than or equal to the threshold efficiency, wherein the electric heater is configured to receive electric energy from the battery.

Abstract: The present invention relates to a method for manufacturing an angle and curvature detection sensor, and the sensor and, more specifically, to: a method for manufacturing a thin-film transistor array-based backplane by a roll-to-roll gravure printing process and manufacturing a sensor for measuring an angle change and a degree of curvature of the X axis and the Y axis by using the backplane; and the sensor. The method for manufacturing an angle and curvature detection sensor, according to an embodiment of the present invention, comprises the steps of: manufacturing a thin-film transistor backplane by a roll-to-roll gravure printing process; forming a protective layer on the thin-film transistor backplane by printing; forming a sealed space by adhering a flexible plastic case onto the upper part of the protective layer by means of an adhesive; and filling the sealed space with a first liquid and injecting a second liquid.

Abstract: A refrigerator planar heating element is arranged inside a refrigerator to radiate heat. The refrigerator planar heating element includes a defrosting planar heating element including a first substrate having one surface on which a first pattern for radiating heat is printed with conductive ink, a second substrate having one surface on which a second pattern for radiating heat and having the same form as the pattern of the first substrate is printed with conductive ink, and an adhesive layer performing bonding such that the patterns of the first substrate and the second substrate are overlapped in a vertical direction. The invention has heating performance more excellent than that of conventional heating elements, and applies an inverse current patterning technique so as to make a current flow in opposite directions at both surfaces of a substrate, thereby effectively shielding electromagnetic waves.

Abstract: The present invention relates to a method for manufacturing an angle and curvature detection sensor, and the sensor and, more specifically, to: a method for manufacturing a thin-film transistor array-based backplane by a roll-to-roll gravure printing process and manufacturing a sensor for measuring an angle change and a degree of curvature of the X axis and the Y axis by using the backplane; and the sensor. The method for manufacturing an angle and curvature detection sensor, according to an embodiment of the present invention, comprises the steps of: manufacturing a thin-film transistor backplane by a roll-to-roll gravure printing process; forming a protective layer on the thin-film transistor backplane by printing; forming a sealed space by adhering a flexible plastic case onto the upper part of the protective layer by means of an adhesive; and filling the sealed space with a first liquid and injecting a second liquid.

Abstract: A wafer test apparatus includes a probe station comprising a probe card that contacts a wafer positioned on a chuck during a wafer test. A test head is disposed on the probe card and tests electrical characteristics of a semiconductor chip positioned on the wafer. A probe card horizontality adjustment unit is positioned between the test head and the probe card and adjusts horizontality of the probe card during the wafer test.

Abstract: A wafer transfer robot includes a robot transfer mechanism including a robot axis member and a robot arm member connected to the robot axis member, a robot hand connected to the robot arm member of the robot transfer mechanism and configured to transfer a wafer by using the robot transfer mechanism, a vertical displacement sensor installed in an upper side of the robot hand, and a plurality of horizontal displacement sensors installed in the upper side of the robot hand and separate from each other along a virtual line that is perpendicular to bilaterally symmetric axis of the robot hand.

Abstract: A wafer test apparatus includes a probe station comprising a probe card that contacts a wafer positioned on a chuck during a wafer test. A test head is disposed on the probe card and tests electrical characteristics of a semiconductor chip positioned on the wafer. A probe card horizontality adjustment unit is positioned between the test head and the probe card and adjusts horizontality of the probe card during the wafer test.

Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.

Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.

Abstract: A method for transporting semiconductor wafers in semiconductor factory automation system, includes the steps of: a) processing a lot of semiconductor wafers to be contained in a semiconductor wafer cassette in a process equipment; b) sending a cassette transportation request from the process equipment to a cell management server when the process equipment has processed the lot of semiconductor wafers; c) generating a transportation instruction in response to the cassette transportation request; and d) if the semiconductor wafer cassette is transported from the process equipment to a stocker by an automatic guide vehicle (AGV), simultaneously activating the AGV and the stocker by simultaneously sending the transportation instruction to the AGV and the stocker. The method in accordance with the present invention can reduce a time taken to transport the semiconductor wafers.

Abstract: A method for resetting a process recipe in a semiconductor factory automation (FA) system, includes the steps of: a) sending the process recipe and a lot identifier inputted from an operator to a process equipment, wherein the process recipe represents a set of semiconductor process conditions corresponding to a lot of semiconductor wafers and the lot identifier corresponds to the lot of semiconductor wafers; b) processing the lot of semiconductor wafers according to the process recipe; c) measuring the processed lot of semiconductor wafers to generate semiconductor measurement data; d) writing the semiconductor measurement data to a trace file, wherein the trace file includes the process recipe, the semiconductor measurement data and the lot identifier; e) retrieving the semiconductor measurement data contained in the trace file in response to a retrieval command inputted from the operator; and f) resetting the process recipe in response to a reset command inputted from the operator if the process recipe is