Patents by Inventor Woo Seok Chin
Woo Seok Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10985310Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.Type: GrantFiled: February 1, 2019Date of Patent: April 20, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Park, Woo-seok Chin, Ji-yeon Jung
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Publication number: 20190165249Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.Type: ApplicationFiled: February 1, 2019Publication date: May 30, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin PARK, Woo-seok CHIN, Ji-yeon JUNG
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Patent number: 10230039Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.Type: GrantFiled: October 16, 2017Date of Patent: March 12, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Park, Woo-seok Chin, Ji-yeon Jung
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Publication number: 20180040803Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.Type: ApplicationFiled: October 16, 2017Publication date: February 8, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin PARK, Woo-seok CHIN, Ji-yeon JUNG
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Patent number: 9818928Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.Type: GrantFiled: August 23, 2013Date of Patent: November 14, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Park, Woo-seok Chin, Ji-yeon Jung
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Patent number: 9247423Abstract: A system and method for protecting private information by using a near field communication (NFC) tag is provided. A method of making a call by using a telephone number received from a near field communication (NFC) tag in a device includes: receiving from the NFC tag a telephone number and call limit information related to the telephone number according to an approach to the NFC tag; determining whether a call to a target device having the received telephone number is limited based on the call limit information; and limiting a call to the target device based on the determination.Type: GrantFiled: November 1, 2013Date of Patent: January 26, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Woo-seok Chin, Jin Park
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Publication number: 20140120877Abstract: A system and method for protecting private information by using a near field communication (NFC) tag is provided. A method of making a call by using a telephone number received from a near field communication (NFC) tag in a device includes: receiving from the NFC tag a telephone number and call limit information related to the telephone number according to an approach to the NFC tag; determining whether a call to a target device having the received telephone number is limited based on the call limit information; and limiting a call to the target device based on the determination.Type: ApplicationFiled: November 1, 2013Publication date: May 1, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Woo-seok CHIN, Jin PARK
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Publication number: 20140055394Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.Type: ApplicationFiled: August 23, 2013Publication date: February 27, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin PARK, Woo-seok CHIN, Ji-yeon JUNG
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Patent number: 7589457Abstract: A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.Type: GrantFiled: May 22, 2007Date of Patent: September 15, 2009Assignee: Korea Advanced Institute of Science and TechnologyInventors: Dai-Gil Lee, Hui-Yun Hwang, Woo-Seok Chin, Seung-Min Lee, Byung-Chul Kim, Jae-Wook Kwon, Soon-Ho Yoon
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Publication number: 20080280659Abstract: A sliding apparatus of a sliding type portable terminal allows a sliding housing of the sliding type portable terminal to slide in two directions. The sliding apparatus of a sliding type portable terminal includes a main housing including a fixing member and a sliding housing slidably coupled with the main housing. The sliding housing includes a guide part that is engages with the fixing member to guide the sliding housing along a curved path on the main housing in a left direction and a right direction about a central axis of the fixing member.Type: ApplicationFiled: May 6, 2008Publication date: November 13, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung-Taek OH, Woo-Seok CHIN, Shin-Chul KANG, Young-Ki KIM
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Patent number: 7414213Abstract: Disclosed is a manufacturing method of a keypad for a mobile phone and the keypad manufactured thereby, in which a vacuum deposition layer and a cellophane paper are attached to a lower surface of a key in the keypad.Type: GrantFiled: August 8, 2007Date of Patent: August 19, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Wook Hwang, Young-Ki Kim, Shin-Chul Kang, Hyun-Jung Jeong, Chang-Youn Hwang, Woo-Seok Chin, Yoon-Hee Lee
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Publication number: 20080111280Abstract: A temperature control system for a mold includes a circulation pipe provided in the mold, a heating water circulation section to provide heating water to the circulation pipe to pre-heat the mold, a cooling water circulation section to provide cooling water to the circulation pipe to cool the mold, and a compressed air circulation section to provide compressed air to the circulation pipe to eject remaining heating water or cooling water within the circulation pipe. The compressed air circulation section is adapted to supply the compressed air to the circulation pipe to eject remaining fluid within the circulation pipe before heating water or cooling water is provided to the circulation pipe.Type: ApplicationFiled: November 13, 2007Publication date: May 15, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ick-Sung CHOE, Young-Ki KIM, Shin-Chul KANG, Woo-Seok CHIN, Chang-Youn HWANG
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Publication number: 20080035460Abstract: Disclosed is a manufacturing method of a keypad for a mobile phone and the keypad manufactured thereby, in which a vacuum deposition layer and a cellophane paper are attached to a lower surface of a key in the keypad.Type: ApplicationFiled: August 8, 2007Publication date: February 14, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong-Wook HWANG, Young-Ki KIM, Shin-Chul KANG, Hyun-Jung JEONG, Chang-Youn HWANG, Woo-Seok CHIN, Yoon-Hee LEE
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Publication number: 20070214623Abstract: A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.Type: ApplicationFiled: May 22, 2007Publication date: September 20, 2007Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: DAI-GIL LEE, HUI-YUN HWANG, WOO-SEOK CHIN, SEUNG-MIN LEE, BYUNG-CHUL KIM, JAE-WOOK KWON, SOON-HO YOON
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Publication number: 20040173272Abstract: The present invention relates to a method for repairing and reinforcing an underground pipe. The method of the present invention comprises the steps of inserting an inner mold made of flexible material through the interior of a reinforcing element including a fiber preform surrounded by impermeable inner and outer tubes made of the flexible material and combining the inner mold with the reinforcing element; positioning a combined element, which includes the reinforcing element and the inner mold, into the underground pipe to be repaired and reinforced; injecting and expanding the inner mold with and by high temperature fluid, and brining the reinforcing element into close contact with an inner wall of the underground pipe; injecting the reinforcing element with thermosetting resin; and removing the inner mold after the thermosetting resin has been cured.Type: ApplicationFiled: February 9, 2004Publication date: September 9, 2004Applicants: Korea Advanced Institute of Science and Technology (KR), Ae Kwon YOOInventors: Ae Kwon Yoo, Woo Seok Chin, Jae Wook Kwon, Dai Gil Lee
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Patent number: 6382876Abstract: A method of repairing or reinforcing worn-out underground buried drainpipes by a resin transfer molding process using both flexible tubes and bagging films is disclosed. In the method of this invention, a reinforcement is primarily inserted into a desired position within a target worn-out drainpipe buried underground. The reinforcement consists of a fiber preform internally having a flexible tube, such as a silicon tube, axially extending along the central axis of the preform and wrapped with an adhesive-coated flexible film as a bagging film to provide protection from sewage or underground water. The flexible tube is, thereafter, expanded to bring the fiber preform into close contact with the interior surface of the target drainpipe. The opposite ends of the reinforcement are sealed with two lids. Thereafter, thermosetting resin is transferred into the fiber preform, thus allowing the fiber preform to be impregnated with the thermosetting resin.Type: GrantFiled: January 18, 2001Date of Patent: May 7, 2002Assignee: Korea Advanced Institute of Science and TechnologyInventors: Dai Gil Lee, Jae Wook Kwon, Woo Seok Chin, Ae Kwon Yoo
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Publication number: 20020009334Abstract: A method of repairing or reinforcing worn-out underground buried drainpipes by a resin transfer molding process using both flexible tubes and bagging films is disclosed. In the method of this invention, a reinforcement is primarily inserted into a desired position within a target worn-out drainpipe buried underground. The reinforcement consists of a fiber preform internally having a flexible tube, such as a silicon tube, axially extending along the central axis of the preform and wrapped with an adhesive-coated flexible film as a bagging film to provide protection from sewage or underground water. The flexible tube is, thereafter, expanded to bring the fiber preform into close contact with the interior surface of the target drainpipe. The opposite ends of the reinforcement are sealed with two lids. Thereafter, thermosetting resin is transferred into the fiber preform, thus allowing the fiber preform to be impregnated with the thermosetting resin.Type: ApplicationFiled: January 18, 2001Publication date: January 24, 2002Applicant: Korea Advanced Institute of Science and TechnologyInventors: Dai Gil Lee, Jae Wook Kwon, Woo Seok Chin, Ae Kwon Yoo