Patents by Inventor Woo Seong Jeon

Woo Seong Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cucurbituril derivative-bonded solid substrate and biochip using the same
    Patent number: 7867391
    Abstract: The present disclosure provides a cucurbituril derivative-bonded solid substrate in which cucurbituril derivatives of Formula 1 are covalently bonded to a modified solid substrate of Formula 2. The cucurbituril derivative provides functional groups which can be used to link biomaterials to the substrate. Protein chips, gene chips, and sensors for biomaterial assays having the cucurbituril derivative-bonded solid substrate are also provided.
    Type: Grant
    Filed: July 5, 2004
    Date of Patent: January 11, 2011
    Assignee: Postech Foundation
    Inventors: Kimoon Kim, Jin Koo Kang, Woo Seong Jeon, Sang Yong Jon, Selvapalam Narayanan, Dong Hyun Oh, Kangkyun Baek
  • Rotaxane compound, rotaxane-bonded solid substrate, and biochip using the same
    Patent number: 7611888
    Abstract: The present disclosure provides a rotaxane compound that can be used to separate molecules within a linkage layer formed on a solid substrate of a biochip by a predetermined distance. The compound is represented by Formula 1, in which a compound of Formula 3 vertically passes through a cavity of cucurbituril or its derivative of Formula 2. It further provides gene chips, protein chips and sensors for biomaterial assays which use the rotaxane molecules to allow biomaterials to be immobilized on a linkage layer such that they are regularly spaced apart from each other by a predetermined distance.
    Type: Grant
    Filed: July 5, 2004
    Date of Patent: November 3, 2009
    Assignee: Postech Foundation
    Inventors: Kimoon Kim, Jin Koo Kang, Woo Seong Jeon, Miran Noh, Dongwoo Kim, Kangkyun Baek