Patents by Inventor Woo-seung JUNG

Woo-seung JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer having bevel portion
    Patent number: 10553677
    Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a wafer body including a first surface and a second surface opposite the first surface; and a bevel portion disposed along an outer circumference of the wafer body and including an inclined surface, an outermost point, a first surface end portion connecting the bevel portion to the first surface and a second surface end portion connecting the bevel portion to the second surface. A first bevel angle between a first tangential direction of the inclined surface and the first surface corresponds to a capillary force of a fluid on the first surface, and a first bevel length between the first surface end portion and the outermost point along a first direction substantially parallel to the first surface corresponds to a first surface flatness.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: February 4, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yeon-sook Kim, In-ji Lee, Doek-gil Ko, Woo-seung Jung
  • SEMICONDUCTOR WAFER HAVING BEVEL PORTION
    Publication number: 20190198613
    Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a wafer body including a first surface and a second surface opposite the first surface; and a bevel portion disposed along an outer circumference of the wafer body and including an inclined surface, an outermost point, a first surface end portion connecting the bevel portion to the first surface and a second surface end portion connecting the bevel portion to the second surface. A first bevel angle between a first tangential direction of the inclined surface and the first surface corresponds to a capillary force of a fluid on the first surface, and a first bevel length between the first surface end portion and the outermost point along a first direction substantially parallel to the first surface corresponds to a first surface flatness.
    Type: Application
    Filed: July 13, 2018
    Publication date: June 27, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yeon-sook KIM, In-ji LEE, Doek-gil KO, Woo-seung JUNG