Patents by Inventor Woo Soon Whang

Woo Soon Whang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered electronic component and board having the same mounted thereon
    Patent number: 11257623
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 ?m or more.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: February 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Tae Kim, Beom Seock Oh, Tai Won Choi, Woo Soon Whang, Byoung Woo Kim, Yong Won Seo
  • MULTILAYERED ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    Publication number: 20210217559
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 ?m or more.
    Type: Application
    Filed: June 25, 2020
    Publication date: July 15, 2021
    Inventors: Hyun Tae Kim, Beom Seock Oh, Tai Won Choi, Woo Soon Whang, Byoung Woo Kim, Yong Won Seo