Abstract: The present invention includes producing a preliminary mold (10-1 or 20-1) provided with two-dimensional patterns (111 or 211) having a shape of a microneedle array (30) therein; producing microneedle array molds (10 and 10-2 or 20 and 20-2) having a three-dimensional shape by expanding air inside the patterns (111 or 211) having a two-dimensional shape to deform the patterns (111 or 211) having the two-dimensional shape into molds having the three-dimensional shape; and after pouring a biodegradable resin into the microneedle array molds (10 and 10-2 or 20 and 20-2) and solidifying the biodegradable resin, completing the microneedle array (30) by removing the microneedle array molds (10 and 10-2 or 20 and 20-2), thereby providing a mold for production of a microneedle array and a production method of the microneedle array using the same capable of tightly suturing an affected area without inducing pain.

Abstract: The present invention includes producing a preliminary mold (10-1 or 20-1) provided with two-dimensional patterns (111 or 211) having a shape of a microneedle array (30) therein; producing microneedle array molds (10 and 10-2 or 20 and 20-2) having a three-dimensional shape by expanding air inside the patterns (111 or 211) having a two-dimensional shape to deform the patterns (111 or 211) having the two-dimensional shape into molds having the three-dimensional shape; and after pouring a biodegradable resin into the microneedle array molds (10 and 10-2 or 20 and 20-2) and solidifying the biodegradable resin, completing the microneedle array (30) by removing the microneedle array molds (10 and 10-2 or 20 and 20-2), thereby providing a mold for production of a microneedle array and a production method of the microneedle array using the same capable of tightly suturing an affected area without inducing pain.

Abstract: A neuro-probe device is provided. The neuro-probe device includes a carrier including bio-resorbable glass, and a neuro-probe mounted on the carrier.

Abstract: Systems and methods are provided for detecting surface charge on a semiconductor substrate having a sensing arrangement formed thereon. An exemplary sensing system includes the semiconductor substrate having the sensing arrangement formed thereon, and a module coupled to the sensing arrangement. The module obtains a first voltage output from the sensing arrangement when a first voltage is applied to the semiconductor substrate, obtains a second voltage output from the sensing arrangement when a second voltage is applied to the semiconductor substrate, and detects electric charge on the surface of the semiconductor substrate based on a difference between the first voltage output and the second voltage output.

Abstract: A device being a micro-system and/or a nano-system which includes a first substrate, having at least one lower electrode and at least one dielectric layer, and includes an intermediate substrate extending across a main plane of the device and including a moving portion. The intermediate substrate is attached, outside the moving portion, by molecular bonding to the first substrate. The moving portion faces at least a portion of the lower electrode. The device also includes an upper substrate, attached to the intermediate substrate. The moving portion is movable between the lower electrode and the upper substrate. The first, intermediate, and upper substrates extend in a plane parallel to the main plane of the device. The lower electrode detects a component of the movement of the moving portion perpendicular to the plane of the device.

Abstract: A guide wire arrangement is provided. The guide wire arrangement includes an elongate coil element having two opposing ends; a force transmitting element arranged at one of the two opposing ends of the coil element; a sensor assembly arranged in the coil element at a predefined distance away from the force transmitting element; and a core wire extending from the force transmitting element to the sensor element through the coil element; wherein the coil element is configured to allow the core wire to be moveable relative to the sensor assembly and the sensor assembly is configured to detect movement of the core wire relative to the sensor assembly upon force impact on the force transmitting element.

Abstract: A guide wire arrangement, a strip arrangement, a method of forming a guide wire arrangement, and a method of forming a strip arrangement are provided. The guide wire arrangement includes a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.

Abstract: A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure.

Abstract: A device (20, 90) includes sensors (28, 30) that sense different physical stimuli. A pressure sensor (28) includes a reference element (44) and a sense element (52), and an inertial sensor (30) includes a movable element (54). Fabrication (110) entails forming (112) a first substrate structure (22, 92) having a cavity (36, 100), forming a second substrate structure (24) to include the sensors (28, 30), and coupling (128) the substrate structures so that the first sensor (28) is aligned with the cavity (36, 100) and the second sensor (30) is laterally spaced apart from the first sensor (28). Forming the second structure (24) includes forming (118) the sense element (52) from a material layer (124) of the second structure (24) and following coupling (128) of the substrate structures, concurrently forming (132) the reference element (44) and the movable element (54) in a wafer substrate (122) of the second structure (24).

Abstract: A device is described of the micro-system and/or nano-system type including: a first substrate, including at least one electrode, called the lower electrode, and at least one dielectric layer, an intermediate substrate, extending across a plane, called the main plane of the device, including a moving portion, an upper substrate, attached to the intermediate substrate, where the said moving portion can be made to move between the lower electrode and the upper substrate.

Abstract: A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate has a first major surface adjacent to the first insulating layer. The insulating layer is attached to the isolated conductive region. The conductive substrate is thinned to form a second conductive layer. A second opening is formed through the second conductive layer and the first insulating layer to the isolated conductive region. The second opening is filled with a conductive plug wherein the conductive plug contacts the isolated conductive region. The second conductive region is etched to form a movable finger over the isolated conductive region. A portion of the insulating layer under the movable finger is removed.

Abstract: A microelectromechanical systems (MEMS) sensor device (20) includes a substrate (22) having sensors (24, 26) disposed on the same side (28) of the substrate (22) and laterally spaced apart from one another. The sensor (26) includes a sense element (56), and the substrate (22) includes a cavity (58) extending through the substrate (22) from the backside (30) of the substrate (22) to expose the sense element (56) to an external environment (54). The sense element (56) is movable in response to a stimulus (52) from the environment (54) due to its exposure to the environment (54) via the cavity (58). Fabrication methodology (66) entails concurrently forming the sensors (24, 26) on substrate (22) by implementing MEMS process flow, followed by creating the cavity (58) through the substrate (22) to expose the sense element (56) to the environment (54).

Abstract: According to embodiments of the present invention, an implantable device for detecting variation in fluid flow rate is provided. The implantable device includes: a substrate having an active element arrangement; a sensor arrangement having a first portion that is mechanically secured and a second portion that is freely deflectable, the sensor arrangement in electrical communication with the active element arrangement, wherein the active element arrangement is configured to detect changes in deformation of the sensor arrangement and produce an output in response to the detected changes; and at least one inductive element mechanically coupled to the substrate and in electrical communication with the active element arrangement, wherein the inductive element is adapted to power the active element arrangement through inductive coupling to an excitation source, and wherein the inductive element is adapted to transmit the output associated with the detected changes in the sensor.

Abstract: A microelectromechanical systems (MEMS) pressure sensor device (20, 62) includes a substrate structure (22, 64) having a cavity (32, 68) formed therein and a substrate structure (24) having a reference element (36) formed therein. A sense element (44) is interposed between the substrate structures (22, 24) and is spaced apart from the reference element (36). The sense element (44) is exposed to an external environment (48) via one of the cavity (68) and a plurality of openings (38) formed in the reference element (36). The sense element (44) is movable relative to the reference element (36) in response to a pressure stimulus (54) from the environment (48). Fabrication methodology (76) entails forming (78) the substrate structure (22, 64) having the cavity (32, 68), fabricating (84) the substrate structure (24) including the sense element (44), coupling (92) the substrate structures, and subsequently forming (96) the reference element (36) in the substrate structure (24).

Abstract: A device (20, 90) includes sensors (28, 30) that sense different physical stimuli. A pressure sensor (28) includes a reference element (44) and a sense element (52), and an inertial sensor (30) includes a movable element (54). Fabrication (110) entails forming (112) a first substrate structure (22, 92) having a cavity (36, 100), forming a second substrate structure (24) to include the sensors (28, 30), and coupling (128) the substrate structures so that the first sensor (28) is aligned with the cavity (36, 100) and the second sensor (30) is laterally spaced apart from the first sensor (28). Forming the second structure (24) includes forming (118) the sense element (52) from a material layer (124) of the second structure (24) and following coupling (128) of the substrate structures, concurrently forming (132) the reference element (44) and the movable element (54) in a wafer substrate (122) of the second structure (24).

Abstract: Systems and methods are provided for detecting surface charge on a semiconductor substrate having a sensing arrangement formed thereon. An exemplary sensing system includes the semiconductor substrate having the sensing arrangement formed thereon, and a module coupled to the sensing arrangement. The module obtains a first voltage output from the sensing arrangement when a first voltage is applied to the semiconductor substrate, obtains a second voltage output from the sensing arrangement when a second voltage is applied to the semiconductor substrate, and detects electric charge on the surface of the semiconductor substrate based on a difference between the first voltage output and the second voltage output.

Abstract: A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Abstract: A device (20, 90) includes sensors (28, 30) that sense different physical stimuli. A pressure sensor (28) includes a reference element (44) and a sense element (52), and an inertial sensor (30) includes a movable element (54). Fabrication (110) entails forming (112) a first substrate structure (22, 92) having a cavity (36, 100), forming a second substrate structure (24) to include the sensors (28, 30), and coupling (128) the substrate structures so that the first sensor (28) is aligned with the cavity (36, 100) and the second sensor (30) is laterally spaced apart from the first sensor (28). Forming the second structure (24) includes forming (118) the sense element (52) from a material layer (124) of the second structure (24) and following coupling (128) of the substrate structures, concurrently forming (132) the reference element (44) and the movable element (54) in a wafer substrate (122) of the second structure (24).

Abstract: A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Abstract: A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure.