Patents by Inventor Woo-Tae Park

Woo-Tae Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210059660
    Abstract: The present invention includes producing a preliminary mold (10-1 or 20-1) provided with two-dimensional patterns (111 or 211) having a shape of a microneedle array (30) therein; producing microneedle array molds (10 and 10-2 or 20 and 20-2) having a three-dimensional shape by expanding air inside the patterns (111 or 211) having a two-dimensional shape to deform the patterns (111 or 211) having the two-dimensional shape into molds having the three-dimensional shape; and after pouring a biodegradable resin into the microneedle array molds (10 and 10-2 or 20 and 20-2) and solidifying the biodegradable resin, completing the microneedle array (30) by removing the microneedle array molds (10 and 10-2 or 20 and 20-2), thereby providing a mold for production of a microneedle array and a production method of the microneedle array using the same capable of tightly suturing an affected area without inducing pain.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 4, 2021
    Inventors: Thanh-Qua Nguyen, Le Giang Tran, Woo-Tae Park
  • Patent number: 10811567
    Abstract: Embodiments is disclosed a light emitting module and a display device. The light emitting module includes, a substrate, a first lead electrode and a second lead electrode disposed on the substrate and electrically separated from each other; and at least one light emitting device disposed on the substrate, wherein the light emitting device includes a first electrode facing the first lead electrode and including a ferromagnetism material and a second electrode facing the second lead electrode and including a diamagnetism material, wherein the second lead electrode includes a diamagnetism material, and wherein the first lead electrode comprises a ferromagnetism material.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: October 20, 2020
    Assignee: LG Innotek Co., Ltd.
    Inventors: Woo Sik Lim, Hyun Joon Kim, Jae Seok Park, Jong Seok Park, Kum Tae Lee
  • Patent number: 10805050
    Abstract: Provided is a method of requesting, by a terminal, retransmission of a TB. The method may include: receiving a TB configured with K code blocks (CBs) and M code block groups (CBGs) from a base station (BS); determining whether reception of the TB is successful; and transmitting retransmission information about the TB to the BS when it is determined that the reception of the TB fails.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: October 13, 2020
    Assignee: KT CORPORATION
    Inventors: Ki-Hyeon Park, Ki-Tae Kim, Kyujin Park, Woo-jin Choi
  • Patent number: 10797399
    Abstract: A wireless power transmission system and communication system is disclosed. A wireless power transmission system and communication system according to an embodiment of the present invention comprises: a transmission part which includes a first surface wave antenna, installed in a metal wall, for transmitting and receiving an electromagnetic surface wave flowing along a surface of the metal wall, and a first monopole antenna connected to the first surface wave antenna in parallel; and a reception part which includes at least one of a second monopole antenna and a second surface wave antenna, installed in a space partitioned by the metal wall, for receiving an electromagnetic surface wave flowing along the surface of the metal wall.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 6, 2020
    Assignee: Ulsan National Institute of Science and Technology
    Inventors: Franklin Don Bien, Sai Kiran Oruganti, Sang Hyun Heo, Woo Jin Park, Seok Tae Seo, Bon Young Lee
  • Publication number: 20200263303
    Abstract: According to an embodiment of the present invention, a substrate processing apparatus includes: a chamber in which a process for a substrate is performed; a showerhead installed in the chamber to inject a reaction gas toward the substrate; and a susceptor installed below the showerhead to support the substrate. Here, the showerhead includes: a showerhead main body including an inner space to which the reaction gas is supplied from the outside and a plurality of injection holes configured to inject the reaction gas while communicating with the inner space; an inflow plate installed in the inner space to divide the inner space into an inflow space and a buffer space and including a plurality of inflow holes configured to allow the inflow space and the buffer space to communicate with each other; and a plurality of adjustment plates installed on the inflow holes in a movable manner, respectively, and configured to restrict movement of the reaction gas from the inflow space to the buffer space.
    Type: Application
    Filed: September 7, 2018
    Publication date: August 20, 2020
    Applicant: EUGENE TECHNOLOGY CO., LTD.
    Inventors: Sung Tae JE, Chan Yong PARK, Jae Ho LEE, Gil Sun JANG, Chang Hoon YUN, Han June LIM, Woo Young KANG
  • Patent number: 10612627
    Abstract: A vehicle transmission is provided that improves fuel efficiency through multiple speed stages and enhances silent drivability of a vehicle using an operating point in a low RPM range of an engine. The vehicle transmission combines three simple planetary gear units with a single compound planetary gear set or combines five simple planetary gear units to shift gears while changing rotational speeds and directions by a selective intermittence operation using rotation elements of the planetary gear units and a plurality of friction elements. Through such a shift operation, it is possible to form at least forward 10-speed or more and reverse 1-speed gear ratios for driving of the vehicle.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: April 7, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae Chang Kook, Jin Ho Kim, Seong Wook Hwang, Seong Wook Ji, Woo Churl Son, Won Min Cho, Hyun Sik Kwon, Jong Sool Park, Woo Jin Chang, Dong Hwan Hwang, Ki Tae Kim
  • Publication number: 20200091376
    Abstract: Embodiments is disclosed a light emitting module and a display device. The light emitting module includes, a substrate, a first lead electrode and a second lead electrode disposed on the substrate and electrically separated from each other; and at least one light emitting device disposed on the substrate, wherein the light emitting device includes a first electrode facing the first lead electrode and including a ferromagnetism material and a second electrode facing the second lead electrode and including a diamagnetism material, wherein the second lead electrode includes a diamagnetism material, and wherein the first lead electrode comprises a ferromagnetism material.
    Type: Application
    Filed: March 2, 2017
    Publication date: March 19, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Woo Sik LIM, Hyun Joon KIM, Jae Seok PARK, Jong Seok PARK, Kum Tae LEE
  • Patent number: 10551100
    Abstract: A refrigerator including a water intake container, in which carbonated water is produced by mixture of carbon dioxide and clean water, a first dispenser assembly, which the water intake container is attached to or detached from, and which supplies carbon dioxide and clean water to the water intake container when the water intake container is attached to the first dispenser, a dispenser lever and a second dispenser assembly which discharges clean water or ice according to manipulation of the dispenser lever, but stops the discharging of clean water or ice if the water intake container is attached to the first dispenser assembly. The refrigerator may include a dispenser lever and a processor to control an ice maker to stop operation if a command is entered through a user interface and to control the ice maker to start operation if the dispenser lever is manipulated while the ice maker stops operation.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: February 4, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Won Park, Sung Ho Cho, Kyung Tae Ko, Seung Wan Kang, Woo Sung Kim, Chang Hern Lee, Gang Hyun Kim
  • Patent number: 10395972
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes: a deep trench in a substrate; a sidewall insulating film on a side surface of the deep trench; an interlayer insulating film on the sidewall insulating film; and an air gap in the interlayer insulating film.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: August 27, 2019
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Da Soon Lee, Hyung Suk Choi, Jeong Gyu Park, Gil Ho Lee, Hyun Tae Jung, Meng An Jung, Woo Sig Min, Pil Seung Kang
  • Publication number: 20190214734
    Abstract: A wireless power transmission system and communication system is disclosed. A wireless power transmission system and communication system according to an embodiment of the present invention comprises: a transmission part which includes a first surface wave antenna, installed in a metal wall, for transmitting and receiving an electromagnetic surface wave flowing along a surface of the metal wall, and a first monopole antenna connected to the first surface wave antenna in parallel; and a reception part which includes at least one of a second monopole antenna and a second surface wave antenna, installed in a space partitioned by the metal wall, for receiving an electromagnetic surface wave flowing along the surface of the metal wall.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 11, 2019
    Applicant: Ulsan National Institute of Science and Technology
    Inventors: Franklin Don Bien, Sai Kiran Oruganti, Sang Hyun Heo, Woo Jin Park, Seok Tae Seo, Bon Young Lee
  • Publication number: 20150148644
    Abstract: A neuro-probe device is provided. The neuro-probe device includes a carrier including bio-resorbable glass, and a neuro-probe mounted on the carrier.
    Type: Application
    Filed: May 7, 2013
    Publication date: May 28, 2015
    Inventors: Kripesh Vaidyanathan, Ruiqi Lim, Riyas Katayan Fazalul Rahuman, Woo Tae Park, Anupama Vijay Govindarajan, Minkyu Je
  • Patent number: 8922227
    Abstract: Systems and methods are provided for detecting surface charge on a semiconductor substrate having a sensing arrangement formed thereon. An exemplary sensing system includes the semiconductor substrate having the sensing arrangement formed thereon, and a module coupled to the sensing arrangement. The module obtains a first voltage output from the sensing arrangement when a first voltage is applied to the semiconductor substrate, obtains a second voltage output from the sensing arrangement when a second voltage is applied to the semiconductor substrate, and detects electric charge on the surface of the semiconductor substrate based on a difference between the first voltage output and the second voltage output.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: December 30, 2014
    Assignee: Freescale Semiconductor Inc.
    Inventors: Chad S. Dawson, Bernhard H. Grote, Woo Tae Park
  • Patent number: 8692337
    Abstract: A device being a micro-system and/or a nano-system which includes a first substrate, having at least one lower electrode and at least one dielectric layer, and includes an intermediate substrate extending across a main plane of the device and including a moving portion. The intermediate substrate is attached, outside the moving portion, by molecular bonding to the first substrate. The moving portion faces at least a portion of the lower electrode. The device also includes an upper substrate, attached to the intermediate substrate. The moving portion is movable between the lower electrode and the upper substrate. The first, intermediate, and upper substrates extend in a plane parallel to the main plane of the device. The lower electrode detects a component of the movement of the moving portion perpendicular to the plane of the device.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: April 8, 2014
    Assignees: Commissariat a l'energie atomique et aux energies alternatives, FREESCALE Semiconductor Inc
    Inventors: Audrey Berthelot, Vincent Larrey, Jean-Philippe Polizzi, Marie-Hélène Vaudaine, Hemant Desai, Woo Tae Park
  • Publication number: 20130338538
    Abstract: A guide wire arrangement is provided. The guide wire arrangement includes an elongate coil element having two opposing ends; a force transmitting element arranged at one of the two opposing ends of the coil element; a sensor assembly arranged in the coil element at a predefined distance away from the force transmitting element; and a core wire extending from the force transmitting element to the sensor element through the coil element; wherein the coil element is configured to allow the core wire to be moveable relative to the sensor assembly and the sensor assembly is configured to detect movement of the core wire relative to the sensor assembly upon force impact on the force transmitting element.
    Type: Application
    Filed: April 16, 2013
    Publication date: December 19, 2013
    Inventors: Woo Tae PARK, Muhammad HAMIDULLAH, Ming-Yuan CHENG, Cairan HE, Li Shiah LIM
  • Publication number: 20130324863
    Abstract: A guide wire arrangement, a strip arrangement, a method of forming a guide wire arrangement, and a method of forming a strip arrangement are provided. The guide wire arrangement includes a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.
    Type: Application
    Filed: November 2, 2011
    Publication date: December 5, 2013
    Inventors: Daquan Yu, Woo Tae Park, Li Shiah Lim, Muhammad Hamidullah, Rama Krishna Kotlanka, Vaidyanathan Kripesh, Hanhua Feng
  • Patent number: 8511170
    Abstract: A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: August 20, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lianjun Liu, Chad S. Dawson, Bernhard H. Grote, Woo Tae Park
  • Patent number: 8487387
    Abstract: A device (20, 90) includes sensors (28, 30) that sense different physical stimuli. A pressure sensor (28) includes a reference element (44) and a sense element (52), and an inertial sensor (30) includes a movable element (54). Fabrication (110) entails forming (112) a first substrate structure (22, 92) having a cavity (36, 100), forming a second substrate structure (24) to include the sensors (28, 30), and coupling (128) the substrate structures so that the first sensor (28) is aligned with the cavity (36, 100) and the second sensor (30) is laterally spaced apart from the first sensor (28). Forming the second structure (24) includes forming (118) the sense element (52) from a material layer (124) of the second structure (24) and following coupling (128) of the substrate structures, concurrently forming (132) the reference element (44) and the movable element (54) in a wafer substrate (122) of the second structure (24).
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: July 16, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Yizhen Lin, Woo Tae Park, Mark E. Schlarmann, Hemant D. Desai
  • Publication number: 20130175643
    Abstract: A device is described of the micro-system and/or nano-system type including: a first substrate, including at least one electrode, called the lower electrode, and at least one dielectric layer, an intermediate substrate, extending across a plane, called the main plane of the device, including a moving portion, an upper substrate, attached to the intermediate substrate, where the said moving portion can be made to move between the lower electrode and the upper substrate.
    Type: Application
    Filed: July 11, 2012
    Publication date: July 11, 2013
    Applicants: FREESCALE SEMICONDUCTOR, Inc., COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Audrey Berthelot, Vincent Larrey, Jean-Philippe Polizzi, Marie-Helene Vaudaine, Hemant Desai, Woo Tae Park
  • Patent number: 8461656
    Abstract: A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate has a first major surface adjacent to the first insulating layer. The insulating layer is attached to the isolated conductive region. The conductive substrate is thinned to form a second conductive layer. A second opening is formed through the second conductive layer and the first insulating layer to the isolated conductive region. The second opening is filled with a conductive plug wherein the conductive plug contacts the isolated conductive region. The second conductive region is etched to form a movable finger over the isolated conductive region. A portion of the insulating layer under the movable finger is removed.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 11, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Woo Tae Park, Lisa H. Karlin, Lianjun Liu, Heinz Loreck, Hemant D. Desai
  • Patent number: 8387464
    Abstract: A microelectromechanical systems (MEMS) sensor device (20) includes a substrate (22) having sensors (24, 26) disposed on the same side (28) of the substrate (22) and laterally spaced apart from one another. The sensor (26) includes a sense element (56), and the substrate (22) includes a cavity (58) extending through the substrate (22) from the backside (30) of the substrate (22) to expose the sense element (56) to an external environment (54). The sense element (56) is movable in response to a stimulus (52) from the environment (54) due to its exposure to the environment (54) via the cavity (58). Fabrication methodology (66) entails concurrently forming the sensors (24, 26) on substrate (22) by implementing MEMS process flow, followed by creating the cavity (58) through the substrate (22) to expose the sense element (56) to the environment (54).
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: March 5, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Andrew C. McNeil, Yizhen Lin, Woo Tae Park