Abstract: The present invention provides a method for fabricating metal foil chip resistors, comprising: providing an insulator substrate; forming a conductor layer pattern as a terminal electrode on said insulator substrate; adhering a metal foil having specific resistivity to said insulator substrate; applying the resistor wiring pattern upon said metal foil by employing the resist; and patterning the resistor wiring by a chemical etching method. Then said metal foil resistor layer is cut or otherwise processed by employing a laser method or other similar methods, thus a predetermined resistance value is obtained. Subsequently, further steps are performed to finish the process of fabricating metal foil chip resistors.