Abstract: A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of or in the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

Abstract: A circuit comprising a first regulator coupled to a voltage input, a second regulator coupled to a voltage output and a switch coupled to the first regulator and the second regulator, wherein the switch is configured to provide voltage to a load from the voltage input when the voltage input is greater than a first predetermined voltage, and to provide voltage to the load from the voltage output when the voltage input is lower than a second predetermined voltage.