Abstract: A semiconductor package includes a redistribution substrate having a first surface including first and a second regions and a second surface opposite to the first surface, and including a first redistribution layer, first and second semiconductor chips positioned in a first direction on the first region the redistribution substrate, each of the first and second semiconductor chips being electrically connected to the first redistribution layer, a first molding layer on the first region on the first and second semiconductor chips, a redistribution structure on the first molding layer and including a second redistribution layer, conductive posts on the first region and electrically connecting the first redistribution layer to the second redistribution layer, third and fourth semiconductor chips positioned in a second direction, intersecting the first direction, and each electrically connected to the second redistribution layer, and a second molding layer on the second region the redistribution substrate and on t

Abstract: A semiconductor package includes a first redistribution wiring layer having a first surface and a second surface opposite to the first surface, the first redistribution wiring layer having protrusions protruding from the first surface and a plurality of first bonding pads provided on the protrusions, a first semiconductor device mounted on the first redistribution wiring layer via conductive bumps, a plurality of conductive structures respectively extending from the first bonding pads around the first semiconductor device, and a second redistribution wiring layer disposed on the conductive structures and electrically connected to the first redistribution wiring layer.