Patents by Inventor Wooi Aun Tan

Wooi Aun Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Providing a metal layer in a semiconductor package
    Patent number: 7332823
    Abstract: In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some embodiments, the mold layer is substantially coplanar with the metal layer to improve package performance. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: February 19, 2008
    Assignee: Intel Corporation
    Inventors: Lee Peng Khaw, Chee Koang Chen, Wooi Aun Tan, Tze Yang Hin