Patents by Inventor Wook Ji

Wook Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8530258
    Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 10, 2013
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
  • Patent number: 8314984
    Abstract: An optical deflection device for a display application includes a semiconductor substrate comprising an upper surface region defining an upper surface plane. The optical deflection device also includes one or more electrode devices provided overlying the upper surface region and a hinge device including a silicon material and coupled to the upper surface region at a predetermined height above the upper surface plane. The optical deflection device further comprises a plurality of landing pads including a silicon material and coupled to the upper surface region at the predetermined height from the upper surface plane and a mirror structure. The mirror structure includes a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: November 20, 2012
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Ye Wang, Yuxiang Wang, Justin Payne, Wook Ji
  • Publication number: 20120199970
    Abstract: A semiconductor device includes a substrate having a via region and a circuit region, an insulation interlayer formed on a top surface of the substrate, a through electrode having a first surface and a second surface, wherein the through electrode penetrates the via region of the substrate and the second surface is substantially coplanar with a bottom surface of the substrate, a first upper wiring formed on a portion of the first surface of the through electrode, a plurality of via contacts formed on a portion of a top surface of the first upper wiring, and a second upper wiring formed on the plurality of via contacts.
    Type: Application
    Filed: January 30, 2012
    Publication date: August 9, 2012
    Inventors: Ki-Young Yun, Yeong-Lyeol PARK, Ki-Soon BAE, Woon-Seob LEE, Sung-Dong CHO, Sin-Woo KANG, Sang-Wook JI, Eun-Ji KIM
  • Publication number: 20120171623
    Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
    Type: Application
    Filed: March 12, 2012
    Publication date: July 5, 2012
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
  • Patent number: 8159740
    Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: April 17, 2012
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
  • Patent number: 8119432
    Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: February 21, 2012
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
  • Publication number: 20120034724
    Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.
    Type: Application
    Filed: October 18, 2011
    Publication date: February 9, 2012
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
  • Patent number: 8105736
    Abstract: A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: January 31, 2012
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Ye Wang, Justin Payne, Wook Ji
  • Publication number: 20110059565
    Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.
    Type: Application
    Filed: November 12, 2010
    Publication date: March 10, 2011
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
  • Patent number: 7863697
    Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: January 4, 2011
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
  • Publication number: 20100188351
    Abstract: An apparatus for playing a multimedia item includes a display unit which outputs an operation unit that includes a wheel area and generates an input signal according to a touch event generated in the wheel area in selecting or generating the multimedia item. A storage unit stores functional setting information defining a function according to at least one multimedia item and the input signal generated in the operation unit. A controller generates a control signal for playing the multimedia item based on the input signal generated in the operation unit and the function setting information.
    Type: Application
    Filed: January 20, 2010
    Publication date: July 29, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bong Won LEE, Joong Sam YUN, Sung Wook JI
  • Publication number: 20100112492
    Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
    Type: Application
    Filed: January 20, 2010
    Publication date: May 6, 2010
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
  • Patent number: 7675670
    Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300 ° C. to maintain a state of the planarizing material.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: March 9, 2010
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
  • Publication number: 20090233244
    Abstract: A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 17, 2009
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Ye Wang, Justin Payne, Wook Ji
  • Publication number: 20090231671
    Abstract: An optical deflection device for a display application includes a semiconductor substrate comprising an upper surface region defining an upper surface plane. The optical deflection device also includes one or more electrode devices provided overlying the upper surface region and a hinge device including a silicon material and coupled to the upper surface region at a predetermined height above the upper surface plane. The optical deflection device further comprises a plurality of landing pads including a silicon material and coupled to the upper surface region at the predetermined height from the upper surface plane and a mirror structure. The mirror structure includes a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion.
    Type: Application
    Filed: February 14, 2008
    Publication date: September 17, 2009
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Ye Wang, Yuxiang Wang, Justin Payne, Wook Ji
  • Patent number: 7522330
    Abstract: An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: April 21, 2009
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, William Spencer Worley, III, Dongmin Chen, Howard Woo
  • Publication number: 20090002805
    Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.
    Type: Application
    Filed: September 12, 2008
    Publication date: January 1, 2009
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, William Spencer Worley, III, Dongmin Chen, Howard Woo
  • Patent number: 7453624
    Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: November 18, 2008
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, William Spencer Worley, III, Dongmin Chen, Howard Woo
  • Publication number: 20080164542
    Abstract: A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality of encapsulated structures. The method also includes depositing a first capping layer on the substrate and forming one or more release hole patterns in the first capping layer. The method further includes removing the encapsulant material and depositing a second capping layer.
    Type: Application
    Filed: January 4, 2008
    Publication date: July 10, 2008
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Justin Payne, Yuxiang Wang, Wook Ji, Ye Wang
  • Publication number: 20080150647
    Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.
    Type: Application
    Filed: December 4, 2007
    Publication date: June 26, 2008
    Applicant: Miradia Inc.
    Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji