Abstract: A method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes forming a semiconductor pattern including a first layer and a second layer on a substrate, forming a coating layer on a surface of the first layer, forming a dyeing substance in which one of an antibody or a protein is combined with a fluorophore, attaching the dyeing substance to a surface of the coating layer to form a dyeing layer, and photographing the fluorophore with an ultra-high resolution microscope to detect the semiconductor pattern.

Abstract: A optical measurement apparatus includes: an optical system which generates a pupil image of a measurement target, using light; a polarization generator which generates a polarized light from the light; a self-interference generator which generates a plurality of beams divided from the pupil image, using the polarized light, and causes the plurality of beams to interfere with each other to generate a self-interference image; and an image analysis unit configured to extract phase data from the self-interference image, and to move the measurement target to a focus position on the basis of the phase data.

Abstract: An optical measurement apparatus includes a light source unit generating and outputting light, a polarized light generating unit generating polarized light from the light, an optical system generating a pupil image of a measurement target, using the polarized light, a self-interference generating unit generating multiple beams that are split from the pupil image, and a detecting unit detecting a self-interference image generated by interference of the multiple beams with each other.

Abstract: Systems and methods related to a structured illumination (SI)-based inspection apparatus are described. The SI-based inspection apparatus may be capable of accurately inspecting an inspection object in real time with high resolution, while reducing the loss of light. Also described are an inspection method, and a semiconductor device fabrication method including the SI-based inspection method. The inspection apparatus may include a light source configured to generate and output a light beam, a phase shifting grating (PSG) configured to convert the light beam from the light source into the SI, a beam splitter configured to cause the SI to be incident on an inspection object and output a reflected beam from the inspection object, a stage capable of moving the inspection object and on which the inspection object is arranged, and a time-delayed integration (TDI) camera configured to capture images of the inspection object by detecting the reflected beam.

Abstract: Systems and methods related to a structured illumination (SI)-based inspection apparatus are described. The SI-based inspection apparatus may be capable of accurately inspecting an inspection object in real time with high resolution, while reducing the loss of light. Also described are an inspection method, and a semiconductor device fabrication method including the SI-based inspection method. The inspection apparatus may include a light source configured to generate and output a light beam, a phase shifting grating (PSG) configured to convert the light beam from the light source into the SI, a beam splitter configured to cause the SI to be incident on an inspection object and output a reflected beam from the inspection object, a stage capable of moving the inspection object and on which the inspection object is arranged, and a time-delayed integration (TDI) camera configured to capture images of the inspection object by detecting the reflected beam.

Abstract: Provided are a plasma light source capable of solving a problem occurring when an arc discharge lamp is used and an inspection apparatus capable of providing uniform and high-brightness plasma light. The plasma light source includes a pulse laser generator configured to generate a pulse laser beam, a continuous wave (CW) laser generator configured to generate an infrared ray (IR) CW laser beam, a first dichroic mirror configured to transmit or reflect the pulse laser beam and reflect or transmit the IR CW laser beam, a chamber configured to receive the pulse laser beam to ignite plasma and the IR CW laser beam to maintain the plasma in an ignited state, and discharge plasma light generated by the plasma, and a second dichroic mirror configured to transmit the pulse laser beam and the IR CW laser beam and reflect the plasma light.

Abstract: A plasma light source apparatus includes a first laser generator configured to generate a first laser. A second laser generator is configured to generate a second laser. A chamber is configured to accommodate and seal a medium material for plasma ignition and to allow plasma to be ignited by the first laser and to be maintained by the second laser. An inner surface of the chamber includes two curved mirrors that face each other.

Abstract: A method of inspecting a surface of an object includes providing a laser beam irradiated in a first direction substantially parallel to the surface of the object, adjusting a diameter of the annular laser beam, reflecting the annular laser beam toward the surface of the object in a second direction substantially perpendicular to the first direction, in a primary reflection, and reflecting the primarily reflected laser toward an inspection region of the object, in a secondary reflection. An incident angle of the annular laser beam with respect to the surface of the object may be determined by the diameter of the annular laser beam.

Abstract: A plasma light source apparatus includes a first laser generator configured to generate a first laser. A second laser generator is configured to generate a second laser. A chamber is configured to accommodate and seal a medium material for plasma ignition and to allow plasma to be ignited by the first laser and to be maintained by the second laser. An inner surface of the chamber includes two curved mirrors that face each other.

Abstract: A rod lens for a lighting apparatus and a lighting apparatus including the rod lens are disclosed. The rod lens having a rectangular rod structure extends lengthwise and includes a first end and a second end opposing each other. The first end is a light incident surface and formed of one continuous surface. The second end is a light exit surface and formed of a plurality of separated surfaces.

Abstract: Provided are a light source device and a semiconductor manufacturing apparatus including the same. The light source device includes a light-emitting lamp. The light source device includes a laser generator configured to generate and direct a laser beam to the light-emitting lamp. The light source device includes a recycling optical element configured to redirect the laser beam to the light-emitting lamp. The recycling optical element includes a first recycling optical modulator configured to change the phase of the laser beam.

Abstract: A plasma light source apparatus is provided. The plasma light source apparatus includes a chamber, a laser generating part, and a curved mirror. The chamber includes a plasma source gas for generating laser induced plasma. The laser generating part is spaced apart from the chamber and generates a hollow laser beam. The curved mirror is disposed between the chamber and the laser generating part. The curved mirror is configured to reflect and to condense the generated hollow laser beam into the chamber to generate the laser induced plasma in the chamber, and to reflect light emitted from the generated laser induced plasma.

Abstract: Provided are a plasma light source capable of solving a problem occurring when an arc discharge lamp is used and an inspection apparatus capable of providing uniform and high-brightness plasma light. The plasma light source includes a pulse laser generator configured to generate a pulse laser beam, a continuous wave (CW) laser generator configured to generate an infrared ray (IR) CW laser beam, a first dichroic mirror configured to transmit or reflect the pulse laser beam and reflect or transmit the IR CW laser beam, a chamber configured to receive the pulse laser beam to ignite plasma and the IR CW laser beam to maintain the plasma in an ignited state, and discharge plasma light generated by the plasma, and a second dichroic mirror configured to transmit the pulse laser beam and the IR CW laser beam and reflect the plasma light.

Abstract: A plasma light source includes a chamber having an ionizable medium therein, an ignition source configured to provide first electromagnetic radiation to the chamber, a sustaining source configured to separately provide second electromagnetic radiation to the chamber, a first curved mirror positioned adjacent the chamber, and a second curved mirror positioned opposite the first mirror and arranged to direct the first electromagnetic radiation toward the chamber. The second electromagnetic radiation may be different than the first electromagnetic radiation. Related devices and methods of operation are also discussed.

Abstract: A method of inspecting a surface of an object includes providing a laser beam irradiated in a first direction substantially parallel to the surface of the object, adjusting a diameter of the annular laser beam, reflecting the annular laser beam toward the surface of the object in a second direction substantially perpendicular to the first direction, in a primary reflection, and reflecting the primarily reflected laser toward an inspection region of the object, in a secondary reflection. An incident angle of the annular laser beam with respect to the surface of the object may be determined by the diameter of the annular laser beam.

Abstract: A plasma light source includes a chamber having an ionizable medium therein, an ignition source configured to provide first electromagnetic radiation to the chamber, a sustaining source configured to separately provide second electromagnetic radiation to the chamber, a first curved mirror positioned adjacent the chamber, and a second curved mirror positioned opposite the first mirror and arranged to direct the first electromagnetic radiation toward the chamber. The second electromagnetic radiation may be different than the first electromagnetic radiation. Related devices and methods of operation are also discussed.

Abstract: An objective lens assembly includes a catadioptric group, a first refractive lens axially aligned with the catadioptric group, and a focusing lens axially aligned with and between the catadioptric group and the first refractive lens. The focusing lens is an aspheric lens.

Abstract: A rod lens for a lighting apparatus and a lighting apparatus including the rod lens are disclosed. The rod lens having a rectangular rod structure extends lengthwise and includes a first end and a second end opposing each other. The first end is a light incident surface and formed of one continuous surface. The second end is a light exit surface and formed of a plurality of separated surfaces.

Abstract: A plasma light source apparatus is provided. The plasma light source apparatus includes a chamber, a laser generating part, and a curved mirror. The chamber includes a plasma source gas for generating laser induced plasma. The laser generating part is spaced apart from the chamber and generates a hollow laser beam. The curved mirror is disposed between the chamber and the laser generating part. The curved mirror is configured to reflect and to condense the generated hollow laser beam into the chamber to generate the laser induced plasma in the chamber, and to reflect light emitted from the generated laser induced plasma.

Abstract: Provided are a light source device and a semiconductor manufacturing apparatus including the same. The light source device includes a light-emitting lamp. The light source device includes a laser generator configured to generate and direct a laser beam to the light-emitting lamp. The light source device includes a recycling optical element configured to redirect the laser beam to the light-emitting lamp. The recycling optical element includes a first recycling optical modulator configured to change the phase of the laser beam.