Patents by Inventor Wook-yeol Ryu

Wook-yeol Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor package containing cylindrical type bump grid array
    Patent number: 6352915
    Abstract: A method for manufacturing a semiconductor package comprising the steps of (a) forming a plurality of bumps on a metal frame and a bridge for connecting and supporting the bumps, (b) coating liquid solder on the bumps, (c) aligning the frame with respect to a semiconductor substrate where patterns are formed so that the bumps are positioned on the patterns, (d) soldering the bumps on the patterns, and (e) separating the bumps from the frame by breaking a connecting portion of the bumps and the bridge.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: March 5, 2002
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Young-rae Cho, Wook-yeol Ryu, Sang-kyun Lee