Abstract: The present invention relates to a quantum dot-containing nanoparticle comprising: a core part; a quantum dot part bound to a surface of the core part; a shell part for protecting the core part and the quantum dot part; and a support part for supporting the binding of the core part and the shell part, wherein the nanoparticle exhibits a high occupied area and stable binding, thereby exhibiting improved luminous efficiency (QY) and brightness when detecting a biological sample (biomolecule).

Abstract: Disclosed is a low-altitude unmanned aerial vehicle surveillance system. According to an embodiment, monitoring is performed using a balloon main body filled with gas and staying in the air; radar; camera units being provided outside the balloon main body, and including a camera taking an image of a subject; radio frequency detectors; and sound detectors and correspondingly, interceptor means is included. As interceptor means, a jammer, a jamming gun, and a spoofing device corresponding to jamming are disclosed.

Abstract: The present invention relates to a standard material composition for verifying a bio-analysis equipment, comprising quantum dot-containing nanoparticles. Through a standard strip and/or a standard tray, which are made of the standard material composition, the present invention may increase the analysis accuracy of a bio-analysis equipment.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A semiconductor device has a semiconductor die and an encapsulant around the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The fan-in interconnect structure includes an insulating layer and a conductive layer formed over the semiconductor die. The conductive layer remains within a footprint of the semiconductor die. A portion of encapsulant is removed from over the semiconductor die. A backside protection layer is formed over a non-active surface of the semiconductor die after depositing the encapsulant. The backside protection layer is formed by screen printing or lamination. The backside protection layer includes an opaque, transparent, or translucent material. The backside protection layer is marked for alignment using a laser. A reconstituted panel including the semiconductor die is singulated through the encapsulant to leave encapsulant disposed over a sidewall of the semiconductor die.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: The present invention provides a biological use including a bioplatform and a method for detecting a high-sensitivity biomolecule by providing improved quantum yield (QY) and brightness when detecting biomolecules by preparing nanoparticles, which are doped in multiple quantum dots and have a structure of inorganic core particles, a quantum dot buried layer and a silica/quantum dot composite shell, while maintaining a high occupancy and stable bonding.

Abstract: A cleaner includes a case which includes an inlet for suctioning in rubbish on a surface to be cleaned, a driver which is provided inside the case and includes a motor which generates power, a drum body which is provided in the inlet and configured to receive the power from the driver and rotate, and a drum blade arranged in an outer circumferential direction of the drum body and formed with a blade air current hole through which air suctioned in through the inlet passes.

Abstract: A robot cleaner including: a main body, a driving unit configured to move the main body, and a suction device provided in the main body and configured to suction outside foreign substances, and the suction device may include a first suction member having a suction port provided at a bottom surface of the main body and configured to suction the foreign substances, and at least one second suction member formed to move relative to the first suction member and having a suction port configured to suction the foreign substances.

Abstract: An aerosol generating device includes a cartridge configured to generate aerosol from an aerosol generating material; and a main body comprising an accommodation space for accommodating the cartridge, wherein an airflow passage for introducing external air is formed between a wall of the main body adjoining the accommodation space and a wall of the cartridge when the cartridge is accommodated in the accommodation space of the main body.

Abstract: An image forming apparatus including a user interface device, a communication interface, a processor, and a memory storing instructions executable by the processor is provided. The processor may execute the instructions stored in the memory to, when an additional application that is not a default application basically installed in the image forming apparatus is included in a workform that is to be shared with an external apparatus, the workform being selected via the user interface device, transmit, to the external apparatus via the communication interface, installation file information of the additional application with the workform that is to be shared.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: A display device is provided. The display device includes a pixel array including a plurality of pixels arranged in a matrix, a sensor under the pixel array, and a refracting layer over the pixel array. The pixel array includes a first region having a first resolution and overlapping the sensor and a second region having a second resolution higher than the first resolution and adjacent to the first region. The refracting layer includes a first refracting portion having a first refractive index and a second refracting portion having a second refractive index lower than the first refractive index.

Abstract: An electronic device and method for transmitting and receiving a wireless power are provided. An electronic device for transmitting and receiving wireless power may include a resonator configured to operate, based on a plurality of operating modes of the electronic device including a power reception mode, a relay mode, and a power transmission mode, wherein: (i) in the power reception mode, the resonator is configured to receive power from a wireless power transmitter, (ii) in the relay mode, the resonator is configured to relay power received from the wireless power transmitter to a wireless power receiver, and (iii) in the power transmission mode, the resonator is configured to transmit power to the wireless power receiver; and a path controller configured to control at least one electrical pathway of electronic device based on the operating mode.

Abstract: An aerosol generating system includes an aerosol generating device including an induction coil that performs a heating operation for heating a susceptor arranged in a cigarette insertion portion and a charging operation for receiving electric power from the outside to charge a power supply, and a charging device including a transmission coil that transmits electric power to the induction coil.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: By improving a structure of a discharge flow path of a robot cleaner, it may be possible to minimize a loss of a suction force, thereby reducing a noise without deteriorating cleaning efficiency. The robot cleaner includes a fan motor configured to generate a suction force, a first housing in which the fan motor is accommodated, a second housing in which the first housing is accommodated, and a chamber positioned between the first housing and the second housing, wherein a plurality of slits are formed in the chamber.

Abstract: Provided is an oxide semiconductor gas sensor with improved performance that senses selectively methylbenzene gases with high sensitivity. The gas sensor includes a gas sensing layer composed of palladium (Pd)-loaded cobalt oxide (Co3O4) nanostructures. The response of the gas sensor according to the present invention to xylene gas at a concentration as low as 5 ppm is at least 150 times higher than that to ethanol gas. The response of the gas sensor to toluene gas at a concentration as low as 5 ppm is at least 100 times higher than that to ethanol gas. In addition, the oxide semiconductor gas sensor has the ability to selectively detect methylbenzene gases, including xylene and toluene (with at least 30-fold higher response to xylene and at least 15 times higher response to toluene than that to ethanol gas).

Abstract: A cleaning robot having an improved structure capable of improving a user convenience and method for controlling the same are disclosed herein. A cleaning robot includes a main body to form an outer appearance and having an inlet port provided to suck a foreign matter present in a cleaning area, an operation unit detachably coupled to the main body and provided to be gripped, at least one motion sensor provided to detect a motion of the operation unit, and a control unit electrically connected to the at least one motion sensor to drive a driving motor of the main body based on the motion of the operation unit detected by the at least one motion sensor.

Abstract: A cartridge includes a storage configured to store an aerosol generating material; a heater configured to heat the aerosol generating material to generate aerosol; and at least one terminal configured to transfer power from an external battery to the heater and comprising a conductive structure surrounding a wire connected to the heater, wherein the conductive structure takes a compressed form in which the wire is in contact with the conductive structure.