Patents by Inventor Woon Chul CHOI
Woon Chul CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11605484Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: GrantFiled: February 27, 2020Date of Patent: March 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
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Patent number: 11069469Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.Type: GrantFiled: August 14, 2019Date of Patent: July 20, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
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Patent number: 10998115Abstract: An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.Type: GrantFiled: March 18, 2020Date of Patent: May 4, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Woon Chul Choi
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Publication number: 20210125766Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 m or more.Type: ApplicationFiled: December 30, 2020Publication date: April 29, 2021Inventors: Woon Chul CHOI, Jung Hyuk JUNG, Woo Jin LEE, Han Wool RYU
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Patent number: 10950380Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.Type: GrantFiled: August 14, 2019Date of Patent: March 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
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Patent number: 10918166Abstract: An inductor includes a coil having a plurality of coil patterns and external electrodes connected thereto. An innermost coil pattern and an outermost coil pattern in the coil grow using first and second insulating wall as growth guides and the inductor has a structure in which there is no deviation in thickness and shape between the coil patterns.Type: GrantFiled: January 24, 2020Date of Patent: February 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Woon Chul Choi
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Patent number: 10902988Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 ?m or more.Type: GrantFiled: May 4, 2016Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Jung Hyuk Jung, Woo Jin Lee, Han Wool Ryu
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Patent number: 10861630Abstract: An inductor includes a body having a first magnetic portion above and below a coil, and a second magnetic portion above and below the first magnetic portion. The magnetic flux density of the magnetic substance in the first magnetic portion is higher than that of the magnetic substance in the second magnetic portion.Type: GrantFiled: April 28, 2017Date of Patent: December 8, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Wool Ryu, Jung Hyuk Jung, Hyo Chan Oh, Yoon Hee Kim, Woon Chul Choi, Jin Ho Ku, Il Jin Park
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Publication number: 20200219640Abstract: An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.Type: ApplicationFiled: March 18, 2020Publication date: July 9, 2020Inventor: Woon Chul CHOI
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Publication number: 20200194158Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: ApplicationFiled: February 27, 2020Publication date: June 18, 2020Inventors: Woon Chul CHOI, Myung Jun PARK, Hye Min BANG, Jun AH, Myung Sam KANG, Jung Hyuk JUNG
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Publication number: 20200154834Abstract: An inductor includes a coil having a plurality of coil patterns and external electrodes connected thereto. An innermost coil pattern and an outermost coil pattern in the coil grow using first and second insulating wall as growth guides and the inductor has a structure in which there is no deviation in thickness and shape between the coil patterns.Type: ApplicationFiled: January 24, 2020Publication date: May 21, 2020Inventor: Woon Chul CHOI
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Patent number: 10636554Abstract: An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.Type: GrantFiled: August 11, 2017Date of Patent: April 28, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Woon Chul Choi
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Patent number: 10614943Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: GrantFiled: February 23, 2016Date of Patent: April 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
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Patent number: 10600546Abstract: An inductor includes a coil having a plurality of coil patterns and external electrodes connected thereto. An innermost coil pattern and an outermost coil pattern in the coil grow using first and second insulating wall as growth guides and the inductor has a structure in which there is no deviation in thickness and shape between the coil patterns.Type: GrantFiled: January 9, 2018Date of Patent: March 24, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Woon Chul Choi
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Patent number: 10515752Abstract: A thin film inductor includes a body including a coil part disposed therein, wherein the coil part includes a patterned insulating film disposed on a substrate and a coil pattern formed between the patterned insulating films, the coil pattern having a lower height than the insulating film, such that the coil pattern may be formed in a structure with a high aspect ratio while having a uniform thickness, thereby increasing a cross-sectional area of the coil part and improving direct current resistance (Rdc) characteristics.Type: GrantFiled: December 21, 2016Date of Patent: December 24, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Ji Hye Oh, Sung Hee Kim, Jung Hyuk Jung
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Publication number: 20190371508Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.Type: ApplicationFiled: August 14, 2019Publication date: December 5, 2019Inventors: Woon Chul CHOI, Ji Hye OH, Jung Hyuk JUNG, Han Wool RYU
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Patent number: 10431368Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.Type: GrantFiled: August 31, 2016Date of Patent: October 1, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
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Patent number: 10388447Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.Type: GrantFiled: September 9, 2015Date of Patent: August 20, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Ji Hye Oh, Hye Min Bang, Myung Jun Park, Jung Hyuk Jung
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Patent number: 10332670Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.Type: GrantFiled: October 9, 2017Date of Patent: June 25, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Sung Hyun Kim, Hye Yeon Cha
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Patent number: 10319515Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.Type: GrantFiled: February 18, 2016Date of Patent: June 11, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung hyuk Jung, Woon Chul Choi, Jun Ah, Myung Jun Park, Hye Min Bang