Patents by Inventor Woon Chul CHOI

Woon Chul CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11605484
    Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: March 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
  • Patent number: 11069469
    Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: July 20, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
  • Patent number: 10998115
    Abstract: An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Woon Chul Choi
  • Publication number: 20210125766
    Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 m or more.
    Type: Application
    Filed: December 30, 2020
    Publication date: April 29, 2021
    Inventors: Woon Chul CHOI, Jung Hyuk JUNG, Woo Jin LEE, Han Wool RYU
  • Patent number: 10950380
    Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
  • Patent number: 10918166
    Abstract: An inductor includes a coil having a plurality of coil patterns and external electrodes connected thereto. An innermost coil pattern and an outermost coil pattern in the coil grow using first and second insulating wall as growth guides and the inductor has a structure in which there is no deviation in thickness and shape between the coil patterns.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Woon Chul Choi
  • Patent number: 10902988
    Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 ?m or more.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Jung Hyuk Jung, Woo Jin Lee, Han Wool Ryu
  • Patent number: 10861630
    Abstract: An inductor includes a body having a first magnetic portion above and below a coil, and a second magnetic portion above and below the first magnetic portion. The magnetic flux density of the magnetic substance in the first magnetic portion is higher than that of the magnetic substance in the second magnetic portion.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Wool Ryu, Jung Hyuk Jung, Hyo Chan Oh, Yoon Hee Kim, Woon Chul Choi, Jin Ho Ku, Il Jin Park
  • Publication number: 20200219640
    Abstract: An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Inventor: Woon Chul CHOI
  • Publication number: 20200194158
    Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 18, 2020
    Inventors: Woon Chul CHOI, Myung Jun PARK, Hye Min BANG, Jun AH, Myung Sam KANG, Jung Hyuk JUNG
  • Publication number: 20200154834
    Abstract: An inductor includes a coil having a plurality of coil patterns and external electrodes connected thereto. An innermost coil pattern and an outermost coil pattern in the coil grow using first and second insulating wall as growth guides and the inductor has a structure in which there is no deviation in thickness and shape between the coil patterns.
    Type: Application
    Filed: January 24, 2020
    Publication date: May 21, 2020
    Inventor: Woon Chul CHOI
  • Patent number: 10636554
    Abstract: An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Woon Chul Choi
  • Patent number: 10614943
    Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: April 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
  • Patent number: 10600546
    Abstract: An inductor includes a coil having a plurality of coil patterns and external electrodes connected thereto. An innermost coil pattern and an outermost coil pattern in the coil grow using first and second insulating wall as growth guides and the inductor has a structure in which there is no deviation in thickness and shape between the coil patterns.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Woon Chul Choi
  • Patent number: 10515752
    Abstract: A thin film inductor includes a body including a coil part disposed therein, wherein the coil part includes a patterned insulating film disposed on a substrate and a coil pattern formed between the patterned insulating films, the coil pattern having a lower height than the insulating film, such that the coil pattern may be formed in a structure with a high aspect ratio while having a uniform thickness, thereby increasing a cross-sectional area of the coil part and improving direct current resistance (Rdc) characteristics.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: December 24, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Sung Hee Kim, Jung Hyuk Jung
  • Publication number: 20190371508
    Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
    Type: Application
    Filed: August 14, 2019
    Publication date: December 5, 2019
    Inventors: Woon Chul CHOI, Ji Hye OH, Jung Hyuk JUNG, Han Wool RYU
  • Patent number: 10431368
    Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: October 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
  • Patent number: 10388447
    Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Hye Min Bang, Myung Jun Park, Jung Hyuk Jung
  • Patent number: 10332670
    Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Sung Hyun Kim, Hye Yeon Cha
  • Patent number: 10319515
    Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung hyuk Jung, Woon Chul Choi, Jun Ah, Myung Jun Park, Hye Min Bang