Patents by Inventor Woon Ha Choi
Woon Ha Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10748828Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.Type: GrantFiled: September 17, 2018Date of Patent: August 18, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ha Yong Jung, Jae Kul Lee, Ji Hye Shim, Han Sang Cho, Woon Ha Choi, Jae Min Choi, Dong Jin Kim, Sung Taek Woo
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Patent number: 10615212Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.Type: GrantFiled: May 17, 2018Date of Patent: April 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ha Yong Jung, Jae Kul Lee, Sung Taek Woo, Ji Hye Shim, Dong Jin Kim, Han Sang Cho, Woon Ha Choi, Jae Min Choi
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Patent number: 10438927Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.Type: GrantFiled: May 22, 2018Date of Patent: October 8, 2019Assignee: SAMSUNG ELECTRONICS CO, LTD.Inventors: Ha Yong Jung, Jae Min Choi, Jae Kul Lee, Dong Jin Kim, Sung Taek Woo, Ji Hye Shim, Woon Ha Choi, Han Sang Cho
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Publication number: 20190237375Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.Type: ApplicationFiled: September 17, 2018Publication date: August 1, 2019Inventors: Ha Yong JUNG, Jae Kul LEE, Ji Hye SHIM, Han Sang CHO, Woon Ha CHOI, Jae Min CHOI, Dong Jin KIM, Sung Taek WOO
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Publication number: 20190189589Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.Type: ApplicationFiled: May 22, 2018Publication date: June 20, 2019Inventors: Ha Yong JUNG, Jae Min CHOI, Jae Kul LEE, Dong Jin KIM, Sung Taek WOO, Ji Hye SHIM, Woon Ha CHOI, Han Sang CHO
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Publication number: 20190189667Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.Type: ApplicationFiled: May 17, 2018Publication date: June 20, 2019Inventors: Ha Yong JUNG, Jae Kul LEE, Sung Taek WOO, Ji Hye SHIM, Dong Jin KIM, Han Sang CHO, Woon Ha CHOI, Jae Min CHOI
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Patent number: 6560047Abstract: Disclosed is an image module having a function of an automatic focus adjustment based on a COB system for miniaturization and unification. The image module includes an image packaging unit, which comprises a sensor for sensing a picture image, a substrate including the sensor, a sensor cover for covering the sensor and the substrate at the outside and a sensor filter for blocking an outer environment and passing light between the sensor cover and the sensor only; and a lens blade unit, which comprises a lens blade having a lens to transmit the light at a center and a driving coil on a surface thereof, an elastic means for supplying a current to the driving coil of the lens blade and supporting the lens blade, and a magnet for forming a magnetic field to enable the lens blade to shift up and down due an electromagnetic force, and thereby lowering power consumption and production cost and improving reliability on a product thereof.Type: GrantFiled: October 11, 2001Date of Patent: May 6, 2003Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Woon Ha Choi, Young Jun Kim
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Publication number: 20030043478Abstract: Disclosded an image module having a function of an automatic focus adjustment based on a COB system for miniaturization and unification. The image module includes an image packaging unit, which comprises a sensor for sensing a picture image, a substrate including the sensor, a sensor cover for covering the sensor and the substrate at the outside and a sensor filter for blocking an outer environment and passing light between the sensor cover and the sensor only; and a lens blade unit, which comprises a lens blade having a lens to transmit the light at a center and a driving coil on a surface thereof, an elastic means for supplying a current to the driving coil of the lens blade and supporting the lens blade, and a magnet for forming a magnetic field to enable the lens blade to shift up and down due an electromagnetic force, and thereby lowering power consumption and production cost and improving reliability on a product thereof.Type: ApplicationFiled: October 11, 2001Publication date: March 6, 2003Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Woon Ha Choi, Young Jun Kim