Abstract: A coating composition, coating glass and a method for preparation thereof, and a cooking appliance including the coating class are described. The coating composition includes a coating material and a heat conductive oxide nano powder that is 5 to 10 wt % with respect to a weight of the coating material. The coating composition provides an excellent infrared reflective function, a high transmittance, and an excellent cleaning performance.

Abstract: A sterilization device includes a housing; a sterilization unit which emits germicidal light for sterilization of at least one target area to be sterilized; and a drive unit which moves at least a part of the sterilization unit between the outside and inside of the housing through an opening provided in the housing.

Abstract: Disclosed is a lower folding device for forming dumplings. The lower folding device for forming dumplings according to the present invention comprises: a dumpling skin pressing unit which includes a plurality of dumpling skin folding units that are simultaneously operated, and which drives the plurality of dumpling skin folding units at a preset position; a cam rail unit for folding which is arranged adjacent to the dumpling skin pressing unit and is connected to the dumpling skin pressing unit to move the dumpling skin folding units; and a movement unit for folding which is connected to the dumpling skin pressing unit and moves the dumpling skin pressing unit relative to the cam rail unit for folding.

Abstract: An in-line dumpling molding system is disclosed. The in-line dumpling molding system according to the present invention comprises: a dumpling wrapper cutting device, which cuts a supplied dough sheet to form dumpling wrappers; a dumpling-molding lower folding device, which is disposed below the dumpling wrapper cutting device, on which the cut dumpling wrappers are loaded, and which presses and folds the dumpling wrappers onto which dumpling fillings have been supplied; and a sealing device, which is disposed above the dumpling-molding lower folding device, and presses and seals the folded dumpling wrappers.

Abstract: A sterilization apparatus includes a housing; a sterilization unit for irradiating, with sterilization light, at least one region to be sterilized; and a driving unit for moving the sterilization unit into and out of the housing via an opening of the housing and rotating the sterilization unit about a rotation axis.

Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.

Abstract: Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A semiconductor memory device includes a substrate, a bit line on the substrate, word lines provided on the bit line and spaced apart in a first direction parallel to a top surface of the substrate, a back gate electrode provide between a pair of adjacent word lines among the word lines, active patterns provided between the back gate electrode and the pair of adjacent word lines, contact patterns respectively provided on the active patterns, a first back gate insulating pattern provided between the bit line and the back gate electrode, and a second back gate insulating pattern and a third back gate insulating pattern which are provided on the back gate electrode, where the back gate upper insulating pattern includes a material having a first dielectric constant and the back gate lower insulating pattern includes a material having a second dielectric constant that is greater than the first dielectric constant.

Abstract: An image encoding/decoding method, device and recording medium based sed on multiple compression levels disclosure may include extracting a region of interest for machine vision from an input image, determining a compression level of the region of interest, and encoding the compression level of the region of interest.

Abstract: An object-based image encoding/decoding method and device of the present disclosure may include an image partition step which partitions an image to obtain a first object region, a region scaling step which scales the first object region based on a scaling factor of the first object region to obtain a second objection region, a region merging step which merges the second object region with at least one of an object region different from the second object region or a non-object region to obtain a merged image, and an image reconstruction step which reconstructs the merged image.

Abstract: A transparent display device comprises: a first substrate including a display area and first to fourth bezel areas surrounding the display area, wherein the display area includes a plurality of pixel regions each including an emitting portion and a transparent portion; a second substrate facing the first substrate; a transparent dam between the first and second substrates and in the first to fourth bezel areas; a first pad electrode on the first substrate and in the first bezel area; and a first color filter pattern on the second substrate and in the first bezel area.

Abstract: A method of a first terminal may include: identifying first RB set(s) to be used for SL communication among consecutive RB sets through an LBT procedure; identifying a first subchannel group included in the first RB set(s) and a second subchannel group including a first PRB in the first RB set(s), the first PRB being not included in the first subchannel group; configuring the first PRB within the second subchannel group as an SL communication resource; and transmitting, to a second terminal, control information indicating that the first PRB is configured as the SL communication resource.

Abstract: A vehicle lamp for emitting light at various locations adjacent to a vehicle while having a simplified configuration is provided. A vehicle lamp includes a light-emitting unit that emits light to form a road surface pattern, and a movable unit on which the light-emitting unit is mounted. The light generated by the light-emitting unit enables the road surface pattern to be formed on different locations of a road surface adjacent to the vehicle as the movable unit rotates.

Abstract: A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. The one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. The socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.

Abstract: A method for configuring an observable object as a digital twin in a digital twin system of any one domain is provided. The method for configuring a digital twin includes defining a purpose for expressing the observable as a digital twin in the domain, organizing data based on a role of the observable object in the domain, configuring the observable object into the digital twin based on the data for the purpose, and synchronizing the observable object and the digital twin.

Abstract: Provided is a method for generating an initial guess for simulating a semiconductor device. The method includes; (a) setting 1D direction for a 3D semiconductor device to be simulated and 2D cross sections perpendicular to the 1D direction; (b) setting a charge intensity-gate voltage model for the 2D cross sections; (c) numerically solving an electron or hole continuity equation along the 1D direction to detect integrated electron charge density and quasi-Fermi potential for the 2D cross sections; and (d) calculating a physical quantity for each position of the 2D cross sections by applying the integrated electron charge density and the quasi-Fermi potential for the 2D cross sections to the charge density-gate voltage model, and providing the calculated physical quantity as the initial guess for the semiconductor device simulation. Therefore, the initial solution according to the present invention can accelerate the speed of the semiconductor device simulation.

Abstract: A coating composition, coating glass and a method for preparation thereof, and a cooking appliance including the coating class are described. The coating composition includes a coating material and a heat conductive oxide nano powder that is 5 to 10 wt % with respect to a weight of the coating material. The coating composition provides an excellent infrared reflective function, a high transmittance, and an excellent cleaning performance.

Abstract: A computing system configured to verify design of an integrated circuit (IC) includes a memory and a processor. The memory is configured to store computer executable instructions. The processor is configured to generate a first coverage model for at least two high-level parameters from the Institute of Electrical and Electronics Engineers (IEEE) 802.11 standard or hardware description language (HDL) code by executing the computer executable instructions, generate a second coverage model for low-level internal signals from the HDL code by executing the computer executable instructions, and generate a plurality of test packets for a regression test by using at least one of the first coverage model or the second coverage model by executing the computer executable instructions.

Abstract: An organic light emitting display device is disclosed. One inventive aspect includes a plurality of pixels provided at a region sectioned by scan lines and data lines and an initialization power unit. The plurality of pixels are configured to control the amount of a current flowing from a first power source to a second power source through an organic light emitting diode in response to a data signal. The initialization power unit supplies initialization power to a driving transistor within each pixel circuit. The initialization power unit further controls the voltage of the initialization power supply to maintain a substantially constant voltage difference between the second power source and the initialization power.