Abstract: A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

Abstract: A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

Abstract: A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

Abstract: A signal capture system for capturing a signal and storing the captured signal in a storage apparatus in real time, and a test apparatus including the signal capture system. The signal capture system includes a printed circuit board; a socket that is connected to the printed circuit board and on which a reference memory component is mounted; and an interposer that is mounted on the printed circuit board, is connected to the socket, an external apparatus, and a storage apparatus, receives first signals from the reference memory component and transmits the received first signals to the external apparatus and the storage apparatus, and receives second signals from the external apparatus and transmits the received second signals to the reference memory component and the storage apparatus, wherein a shape of the socket is defined according to a type of the reference memory component.

Abstract: A field mounting-type test apparatus and method for enhancing competitiveness of a product by simulating various test conditions including a mounting environment for improving quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment thus reducing testing time and cost. The field mounting-type test apparatus includes a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT using the logic data.

Abstract: A signal capture system for capturing a signal and storing the captured signal in a storage apparatus in real time, and a test apparatus including the signal capture system. The signal capture system includes a printed circuit board; a socket that is connected to the printed circuit board and on which a reference memory component is mounted; and an interposer that is mounted on the printed circuit board, is connected to the socket, an external apparatus, and a storage apparatus, receives first signals from the reference memory component and transmits the received first signals to the external apparatus and the storage apparatus, and receives second signals from the external apparatus and transmits the received second signals to the reference memory component and the storage apparatus, wherein a shape of the socket is defined according to a type of the reference memory component.

Abstract: An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.

Abstract: Provided are a field mounting-type test apparatus and method, which can enhance competitiveness of a product by simulating various test conditions including a mounting environment so as to improve quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment so as to reduce testing time and cost. In accordance with example embodiments, the field mounting-type test apparatus may include a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT by using the logic data.

Abstract: An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.