Patents by Inventor Woon Yau Lim

Woon Yau Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10155657
    Abstract: The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: December 18, 2018
    Assignee: Infineon Technologies AG
    Inventors: Matthias Steiert, Kok Yau Chua, Chu Hua Goh, Woon Yau Lim, Christina Yeong
  • Publication number: 20170081175
    Abstract: The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 23, 2017
    Applicant: Infineon Technologies AG
    Inventors: Matthias Steiert, Kok Yau Chua, Chu Hua Goh, Woon Yau Lim, Christina Yeong