Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: A semiconductor package according to an exemplary embodiment of the present disclosure may comprise a semiconductor chip comprising a chip pad; a redistribution layer electrically connected to the chip pad of the semiconductor chip; an external connection terminal electrically connected to the redistribution layer; a sealing material covering the semiconductor chip and configured to fix the semiconductor chip and the redistribution layer; an adhesive film positioned on the upper surface of the sealing material; and a heat sink formed on the upper surface of the adhesive film and having a stepped portion at the periphery thereof.

Abstract: Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.

Abstract: A semiconductor package according to an exemplary embodiment of the present disclosure may comprise a semiconductor chip comprising a chip pad; a redistribution layer electrically connected to the chip pad of the semiconductor chip; an external connection terminal electrically connected to the redistribution layer; a sealing material covering the semiconductor chip and configured to fix the semiconductor chip and the redistribution layer; an adhesive film positioned on the upper surface of the sealing material; and a heat sink formed on the upper surface of the adhesive film and having a stepped portion at the periphery thereof.

Abstract: A technical concept of the present disclosure provides a method of producing a semiconductor package, the method including operations of: arranging a plurality of wafers on a tray, forming an interconnect structure on the tray and the plurality of wafers, and separating the plurality of wafers from the tray.

Abstract: A technical concept of the present disclosure provides a method of producing a semiconductor package, the method including operations of: arranging a plurality of wafers on a tray, forming an interconnect structure on the tray and the plurality of wafers, and separating the plurality of wafers from the tray.

Abstract: Provided are an apparatus and method for managing digital rights. An agent unit manages application programs to which DRM is to be applied and rights to contents processed by the application programs to which DRM is to be applied, and encrypt and decrypt the contents processed by the application programs. A rights management unit authenticates a user and manages a user right to the contents processed by the application programs. A kernel API hooking unit monitors input/output of a file through hooking kernel native APIs, requests the rights management unit to verify the user right to the contents to be processed, and requests the agent unit to encrypt or decrypt the contents when the user right to the contents to be processed is verified.

Abstract: Provided are an apparatus and method for managing digital rights. An agent unit manages application programs to which DRM is to be applied and rights to contents processed by the application programs to which DRM is to be applied, and encrypt and decrypt the contents processed by the application programs. A rights management unit authenticates a user and manages a user right to the contents processed by the application programs. A kernel API hooking unit monitors input/output of a file through hooking kernel native APIs, requests the rights management unit to verify the user right to the contents to be processed, and requests the agent unit to encrypt or decrypt the contents when the user right to the contents to be processed is verified.

Abstract: Provided are apparatus and method for selectively decrypting and transmitting DRM contents. A policy storing unit stores information on devices allowed for decryption of contents. A policy processing unit determines whether a target device, to which an encrypted content is transmitted, is a device allowed for decryption based on the information stored in the policy storing unit. A decryption unit decrypts the encrypted content. And a control unit controls the decryption unit to decrypt the encrypted content when the target device is the device allowed for decryption.

Abstract: Disclosed are a method and a device for offering a packet data service during to a handover of a user terminal from one radio network controller to another. To avoid the loss of data during SRNS relocation, there is provided a method for checking the validity of the next expected receive PDCP sequence number sent from a receiver PDCP layer with the send PDCP sequence number of the first transmitted but not yet acknowledged PDCP SDU and the send PDCP sequence number first unsent PDCP SDU of the sender PDCP layer. A PDCP protocol structure is reconstructed to support a lossless SRNS relocation in the packet service domain, and control information and operational procedure therefore are newly defined. As a result, the lossless SRNS relocation is achieved in the packet service domain and the mobility of data communication is ensured.

Abstract: A method for re-transmitting data or control information in a radio link control layer relates to determining whether re-transmission will be ended by comparing a number of transmission with a critical value when the transmission of data or control information has successively failed. The retransmission cycle is comprised of the steps in the order of transmitting information, checking the transmission failure with exit, and counting the transmission number with exit. Therefore, the present invention makes any transmission be checked and prevents wasting radio resource which can occur in re-transmitting data or control information in UMTS mobile communication system.

Abstract: The present invention discloses a bump for a semiconductor package, a semiconductor package applying the bump, and a method for fabricating the semiconductor package. As a second bump unit contacting an electrode terminal of a PCB has a smaller width than a first bump unit contacting an electrode pad of a semiconductor chip through a metal adhering layer, even if a pitch between the electrode pads of the semiconductor chip does not correspond to the pitch between the electrode terminals of the PCB, contact reliability is improved by the bump. In addition, the bump does not contact lines adjacent to the electrode terminal of the PCB, thereby preventing a mis-operation of the semiconductor package. Accordingly, the pitch between the electrode pads of the semiconductor chip and the pitch between the bumps can be minimized.

Abstract: Disclosed is a method for transmitting data from an RLC layer in a radio communication system. The method includes the steps of storing RLC SDUs transferred from an upper layer in a transmission buffer, transmitting RLC PDUs on which the RLC SDUs stored in the transmission buffer are loaded to a receiving side in order, discarding the RLC SDUs stored in the transmission buffer, checking whether a transmission mode indicator is configured, and transmitting discard information about the discarded RLC SDUs to the receiving side entirely or in part in accordance with whether the transmission MRW mode indicator is configured.

Abstract: A method for controlling the transmission of signals in a communications system uses a polling trigger which prevents a deadlock condition from occurring between a transmitter and receiver. The method includes selecting a protocol data unit from a buffer, determining whether the data unit is located at a predetermined position within a transmission window, and then transmitting polling information with the data unit if the data unit is determined to be at the predetermined position of the transmission window. The predetermined position is preferably a last position of the window. If the data unit is not in a last position of the transmission window, additional steps of the method include determining whether the data unit is a last-stored data unit in a transmission buffer. If so, polling information is transmitted with the data unit. If neither polling trigger is satisfied, the data unit is transmitted without polling information.

Abstract: The present invention discloses a bump for a semiconductor package, a semiconductor package applying the bump, and a method for fabricating the semiconductor package. As a second bump unit contacting an electrode terminal of a PCB has a smaller width than a first bump unit contacting an electrode pad of a semiconductor chip through a metal adhering layer, even if a pitch between the electrode pads of the semiconductor chip does not correspond to the pitch between the electrode terminals of the PCB, contact reliability is improved by the bump. In addition, the bump does not contact lines adjacent to the electrode terminal of the PCB, thereby preventing a mis-operation of the semiconductor package. Accordingly, the pitch between the electrode pads of the semiconductor chip and the pitch between the bumps can be minimized.

Abstract: An encoder that includes a sensing device that senses encoding marks on a sensing surface that also includes one or more reference marks. The sensing device generates first and second encoder signals when the encoding marks pass the sensing device. The encoding signals define the direction of motion and degree of movement of the sensing surface. A register stores the position of the encoding surface relative to the sensing device. A controller receives the first and second encoder signals and increments or decrements the digital register based on the received first and second encoder signals. The encoder also includes a reference mark detector that generates a first reference mark signal when the first reference mark passes the reference mark detector. The controller resets the digital value to a first reference value when the encoder receives the first reference mark signal.