Patents by Inventor Woon-young BAEK

Woon-young BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
    Patent number: 10446471
    Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JaeHong Park, Hanhong Lee, Sungwoo Joo, Woon-young Baek
  • SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT FROM ONE OR MORE ENDS OF THE PACKAGE
    Publication number: 20190096786
    Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
    Type: Application
    Filed: November 29, 2018
    Publication date: March 28, 2019
    Inventors: JaeHong PARK, Hanhong LEE, Sungwoo JOO, Woon-young BAEK
  • Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
    Patent number: 10177072
    Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: January 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JaeHong Park, Hanhong Lee, Sungwoo Joo, Woon-young Baek
  • Semiconductor Packages
    Publication number: 20180096913
    Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
    Type: Application
    Filed: July 12, 2017
    Publication date: April 5, 2018
    Inventors: JaeHong Park, Hanhong LEE, Sungwoo JOO, Woon-young BAEK