Patents by Inventor Woong Cha
Woong Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250144975Abstract: A thermal management system for a vehicle may adjust the temperature of a battery module by using one chiller where the refrigerant and the coolant heat-exchange with each other and a battery heater for selectively heating the coolant, perform heating of the vehicle interior by using the coolant heated by the battery heater, simplify a layout of the system, and reduce manufacturing costs by forming a plurality of coolant flowing lines by two valves according to a selected mode of the vehicle.Type: ApplicationFiled: May 6, 2024Publication date: May 8, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Seong-Bin Jeong, Yong Woong Cha
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Publication number: 20250137399Abstract: A reservoir tank assembly and a heat pump system including the same are disclosed. The reservoir tank assembly may include a reservoir tank configured to remove air contained in a coolant and an adapter fluidly connecting the reservoir tank and a coolant line along which the coolant flows. A part of the coolant flowing along the coolant line is introduced into any one degassing chamber among a plurality of degassing chambers through the adapter. The coolant passing through the plurality of degassing chambers is discharged to the coolant line through the adapter.Type: ApplicationFiled: April 17, 2024Publication date: May 1, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Yong Woong Cha, Jae-Eun Jeong, Hyunjae Lee, Seong-Bin Jeong, ChanWoong Jo
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Publication number: 20250128569Abstract: In order to efficiently perform heating of a vehicle interior in a state in which the external temperature is low and heat generated by a heating element is not sufficient in an early stage of driving the vehicle, a heat pump system for a vehicle is provided. The heat pump system utilizes various heat sources in a general heating mode of the vehicle interior, and at the same time, maximizes the system performance by increasing flow of the refrigerant. The heat pump system may include: a compressor, a heating, ventilating, and air conditioning (HVAC) module; a heat-exchanger; a first expansion valve; a first connection line; a chiller; a second expansion valve; a second connection line; a third connection line; and a fourth connection line.Type: ApplicationFiled: March 25, 2024Publication date: April 24, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Tae Hee Kim, Yong Woong Cha, Wan Je Cho, Seong-Bin Jeong, Hyunsub Lee, Hyunjae Lee, Minseob Shin, Doyoung Kim, Chunkyu Kwon, Jae-Eun Jeong
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Publication number: 20250128571Abstract: A heat pump system for a vehicle is provided to improve cooling and heating performance by applying a gas injection device selectively operating during air conditioning of a vehicle interior by increasing a flow rate of the refrigerant circulating in a refrigerant line of the heat pump system. The heat pump system for a vehicle may include: a compressor, a first condenser, a receiver dryer, a second condenser, an evaporator, a gas injection device, a refrigerant connection line, and a chiller. The flow of the refrigerant is controlled according to at least one mode for adjusting a temperature of a vehicle interior or adjusting a temperature of a battery module.Type: ApplicationFiled: March 21, 2024Publication date: April 24, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Jeawan Kim, Yong Woong Cha, Hochan An, Wan Je Cho, Seong-Bin Jeong, Gwi Taek Kim, Hoyoung Jeong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Yeonho Kim
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Publication number: 20250125384Abstract: A structure for increasing durability of an ion filter, which includes a reservoir configured to store cooling water discharged from a fuel cell stack, an ion filter configured to remove ions from the cooling water discharged from the fuel cell stack, a flow rate adjustment valve disposed between the ion filter and the fuel cell stack, a first pipe which flows the cooling water from the ion filter to the reservoir, and a second pipe that is a passage through which air or the cooling water is moved between the reservoir and the ion filter according to a change in level of the cooling water inside the ion filter.Type: ApplicationFiled: January 25, 2024Publication date: April 17, 2025Inventors: Myung Hyuk Kim, Yong Woong Cha, Ho Chan An, Wan Je Cho, Hae Lee Lee, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Dong Nyeok Park
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Publication number: 20250115093Abstract: A heat pump system for a vehicle is provided to efficiently perform heating of a vehicle interior in a state in which the external temperature is low and heat generated by a heating element is not sufficient in an early stage of driving the vehicle. The heat pump system may include: a compressor; a heat, ventilation, and air condition (HVAC) module; a heat-exchanger; a first expansion valve; an accumulator; a first connection line; a chiller; and a second expansion valve.Type: ApplicationFiled: March 25, 2024Publication date: April 10, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Yeonho Kim, Yong Woong Cha, Hochan An, Taehan Kim, Wan Je Cho, Hyunsub Lee, Jeawan Kim, Hoyoung Jeong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Tae Hee Kim
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Publication number: 20250100347Abstract: A heat pump system for a vehicle may include: a compressor configured to compress a refrigerant; and a heat, ventilation, and air condition (HVAC) module including an internal condenser, an evaporator connected to the compressor via a refrigerant line, and an opening/closing door configured to adjust air having passed through the evaporator to be selectively introduced into the internal condenser depending on a cooling mode or a heating mode of the vehicle. The heat pump system may also include: a heat-exchanger connected to the internal condenser via the refrigerant line; a first expansion valve provided in the refrigerant line between the heat-exchanger and the evaporator; a first connection line; a chiller provided in the first connection line so as to adjust the temperature of a coolant by exchanging heat between the refrigerant and the coolant introduced selectively; and a sub-heat-exchanger provided in the refrigerant line.Type: ApplicationFiled: April 2, 2024Publication date: March 27, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Seong-Bin Jeong, Dongseok Oh, Jae-Eun Jeong, Yong Woong Cha, Wan Je Cho
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Publication number: 20250101902Abstract: A reservoir tank assembly may include a housing in which a degassing chamber configured to store coolant is formed, an inlet piping formed in the housing and into which coolant flows, an outlet piping formed in the housing and through which coolant is discharged, and a connection duct fluidly connecting the inlet piping and the outlet piping. The connection duct is disposed through the degassing chamber. Some coolant flowing through the inlet piping flows into the connection duct after passing through the degassing chamber, and remaining coolant is discharged outside of the housing without passing through the degassing chamber.Type: ApplicationFiled: November 22, 2023Publication date: March 27, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Hyunjae Lee, Seong-Bin Jeong, Chan Woong Jo, Bugyeom Kim, Yong Woong Cha, Myunghwan Kim
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Patent number: 12255197Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.Type: GrantFiled: November 18, 2022Date of Patent: March 18, 2025Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
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Publication number: 20250085038Abstract: An accumulator includes a body having an upper body and a lower body. The upper body and lower body are coupled with each other to have a chamber in the body. The accumulator includes: a refrigerant inlet port disposed on the upper body and allowing a mixed refrigerant of a liquid refrigerant and a gaseous refrigerant to flow into the chamber; a refrigerant outlet port disposed on the upper body and allowing the gaseous refrigerant separated from the liquid refrigerant to flow out; and a baffle assembly having a vertical baffle being vertically disposed in the chamber to impede a horizontal flow of the liquid refrigerant, a suction pipe guiding the gaseous refrigerant separated from the liquid refrigerant to the refrigerant outlet port, and a horizontal baffle being horizontally disposed in the chamber to impede a vertical flow of the liquid refrigerant.Type: ApplicationFiled: November 29, 2023Publication date: March 13, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Yong Woong Cha, Jungha Park, Seong-Bin Jeong
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Publication number: 20250074140Abstract: A vehicular thermal management module includes a low-temperature-side manifold having a low-temperature refrigerant passage, a high-temperature-side manifold having a high-temperature refrigerant passage, and facing the low-temperature-side manifold, a compressor disposed between the low-temperature-side manifold and the high-temperature-side manifold, and an accumulator connected to an inlet of the compressor through a refrigerant line.Type: ApplicationFiled: November 15, 2023Publication date: March 6, 2025Inventors: Chun Kyu Kwon, Jong Woo Nam, Yong Woong Cha, Hyun Sub Lee
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Patent number: 12230661Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.Type: GrantFiled: April 12, 2024Date of Patent: February 18, 2025Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
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Publication number: 20250042221Abstract: A cooling apparatus may include an electric water pump to pump coolant, a coolant channel in fluid communication with a cooling target and the electric water pump, and a thermoelectric device including a higher-temperature part and a lower-temperature part. The thermoelectric device may cool the coolant flowing into the coolant channel. The cooling apparatus may include a first heat sink disposed adjacent to the higher-temperature part, a second heat sink disposed adjacent to the coolant channel, and a cooling fan provided adjacent to the first heat sink. The cooling apparatus may include an air duct forming a first fluid line where air passes through only the first heat sink and is then discharged by operation of the cooling fan and forming a second fluid line where air passes through the first heat sink and the second heat sink and is then discharged by the operation of the cooling fan.Type: ApplicationFiled: October 25, 2023Publication date: February 6, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Tae Hee Kim, Wan Je Cho, Seong-Bin Jeong, Hyunjae Lee, Minseob Shin, Yong Woong Cha, Jae-Eun Jeong
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Publication number: 20250035350Abstract: A refrigerant module for a vehicle includes: a heat exchanger for exchanging heat between a refrigerant introduced therein and a working fluid; a valve manifold connected to the heat exchanger and having a refrigerant flow path formed inside to supply the refrigerant to the heat exchanger or to bypass the refrigerant; and a plurality of valve assemblies mounted on the valve manifold to control a flow of the refrigerant flowing in the refrigerant flow path.Type: ApplicationFiled: November 7, 2023Publication date: January 30, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.Inventors: Seong-Bin Jeong, Dong Seok Oh, Wan Je Cho, Woojin Lee, Jae-Eun Jeong, Yong Woong Cha, DongJu Ko, Shin Ryu, Kyoung Tai Park
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Publication number: 20250018767Abstract: An embodiment heat pump system includes a valve module for controlling a flow of a coolant, a first line connected to the valve module, an electrical component on the first line, a second line connected to the first line and the valve module, a radiator on the second line, a third line connected to the valve module, wherein the battery module is on the third line, a fourth line connected to the valve module and the third line, a fifth line connected to the valve module, a chiller on the fifth line, a sixth line connected to the first line, and a seventh line connected to the third line, wherein an end of the sixth line and an end of the seventh line are respectively connected to the chiller such that the sixth line and the seventh line may be connected to the fifth line through the chiller.Type: ApplicationFiled: October 24, 2023Publication date: January 16, 2025Inventors: Seong-Bin Jeong, Jae-Eun Jeong, Yong Woong Cha, Wan Je Cho
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Publication number: 20240363470Abstract: A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.Type: ApplicationFiled: July 8, 2024Publication date: October 31, 2024Inventors: Yeong Beom Ko, Dong Jin Kim, Se Woong Cha
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Publication number: 20240347575Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.Type: ApplicationFiled: April 12, 2024Publication date: October 17, 2024Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
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Publication number: 20240246396Abstract: A heat pump system for a vehicle is configured by including a valve, a first cooling apparatus, a second cooling apparatus, and a flow control line, to be configured for adjusting a temperature of a battery module by use of a single chiller where a refrigerant and a coolant are heat-exchanged, selectively recollecting waste heat of the electrical component and the battery module and using the same for heating of the vehicle interior, and forming a plurality of coolant flowing lines by a single valve according to selected mode of the vehicle.Type: ApplicationFiled: June 13, 2023Publication date: July 25, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Seong-Bin JEONG, Dong Seok OH, Namho PARK, Wan Je CHO, Seung Hyun WON, Jungha PARK, ChangMin PARK, Ji Wan SON, Yeonho KIM, ByeongGu KANG, Jong Il PARK, Hyunjae LEE, JInsung PARK, Jae Yeon KIM, Yong Woong CHA
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Patent number: 12033910Abstract: A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.Type: GrantFiled: September 22, 2020Date of Patent: July 9, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Yeong Beom Ko, Dong Jin Kim, Se Woong Cha
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Publication number: 20240190211Abstract: An embodiment heat pump system of a vehicle includes a valve controlling a flow of a coolant, a first line having ends connected to the valve, a radiator and an electrical component on the first line, a second line having ends connected to the valve, a battery module on the second line, a first connection line including a first end connected to the valve, a chiller on the first connection line, a second connection line including ends connected to the second and first connection lines, and a third connection line including a first end connected to a second end of the first connection line and a second end connected to the first line between the radiator and the electrical component, wherein the valve operates such that the first, second, or first connection line is connected to another line or to itself depending on the selected mode.Type: ApplicationFiled: June 7, 2023Publication date: June 13, 2024Inventors: Yong Woong Cha, Wan Je Cho, Jungha Park, Eon Soo Yun, ByeongGu Kang, Seongjae Lee, Jong Il Park, Jai Young An, Seong-Bin Jeong