Patents by Inventor Woong Ku On

Woong Ku On has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a metal printed circuit board
    Patent number: 10178773
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: January 8, 2019
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
  • METHOD FOR MANUFACTURING A METAL PRINTED CIRCUIT BOARD
    Publication number: 20140338192
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Application
    Filed: December 24, 2012
    Publication date: November 20, 2014
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On