Abstract: A memory device includes a first strobe delay circuit delaying a first data strobe signal to generate a delayed first data strobe signal, a first write leveling circuit sampling a first delay clock in synchronization with the delayed first data strobe signal, a second strobe delay circuit delaying a second data strobe signal to generate a delayed second data strobe signal, a replica second strobe delay circuit delaying the first data strobe signal by a delay value obtained by replicating the second strobe delay circuit to generate a replica delayed second data strobe signal; and a second write leveling circuit sampling a second delay clock in synchronization with the delayed second data strobe signal in a first I/O mode, and sampling the second delay clock in synchronization with the replica delayed second data strobe signal in a second I/O mode.

Abstract: A repair information storage circuit may include a fuse block, a controller, and a fuse latch array. The fuse block provides a boot-up enable signal and repair information. The controller generates a voltage control signal in response to the boot-up enable signal. The fuse latch array stores repair information provided from the fuse block. The voltage control signal, which is used as a bulk bias of a transistor formed in the fuse latch array, is adjustable.

Abstract: A voltage generator may include: an internal voltage generation unit suitable for generating an internal voltage by pumping an external voltage in response to a pumping cycle signal; and a capacitance adjusting unit comprising a capacitive element which receives and transmits the pumping cycle signal to the internal voltage generation unit, and is suitable for adjusting a capacitance of the capacitive element based on the external voltage.

Abstract: The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality of first and second through electrodes that pass through the semiconductor chip body and one ends thereof are electrically connected to the bonding pads, an insulating layer formed over the second surface of the semiconductor chip body such that the other ends of the first and second through electrodes are not covered by the insulating layer, and a first heat spreading layer formed over the insulating layer.

Abstract: A repair information storage circuit may include a fuse block, a controller, and a fuse latch array. The fuse block provides a boot-up enable signal and repair information. The controller generates a voltage control signal in response to the boot-up enable signal. The fuse latch array stores repair information provided from the fuse block. The voltage control signal, which is used as a bulk bias of a transistor formed in the fuse latch array, is adjustable.

Abstract: A repair information storage circuit may include a fuse block, a controller, and a fuse latch array. The fuse block provides a boot-up enable signal and repair information. The controller generates a voltage control signal in response to the boot-up enable signal. The fuse latch array stores repair information provided from the fuse block. The voltage control signal, which is used as a bulk bias of a transistor formed in the fuse latch array, is adjustable.

Abstract: The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality of first and second through electrodes that pass through the semiconductor chip body and one ends thereof are electrically connected to the bonding pads, an insulating layer formed over the second surface of the semiconductor chip body such that the other ends of the first and second through electrodes are not covered by the insulating layer, and a first heat spreading layer formed over the insulating layer.