Abstract: A multilayer electronic component includes: a body including a dielectric layer, and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. A composite layer containing Sn and Ni is disposed at an interface between the internal electrode and the dielectric layer. The internal electrode includes an interface portion between the composite layer and a central portion of the internal electrode. The interface portion includes a ceramic additive.

Abstract: A method for forming through-via metal wiring is disclosed. According to the method, through-via metal wiring can be formed with excellent plating quality without an expensive sputtering process by bonding a metal foil to one side of a substrate having a through-via formed therein and using the foil as a metal seed layer.

Abstract: Disclosed is a method of forming an area-selective thin film, the method comprising supplying a nuclear growth retardant to the inside of the chamber in which the substrate is placed, so that the nuclear growth retardant is adsorbed to a non-growth region of the substrate; purging the interior of the chamber; supplying a precursor to the inside of the chamber, so that the precursor is adsorbed to a growth region of the substrate; purging the interior of the chamber; and supplying a reaction material to the inside of the chamber, so that the reaction material reacts with the adsorbed precursor to form the thin film.

Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on the insulating layer; and a protective layer disposed on the insulating layer and the circuit pattern, and including first and second regions having different heights; wherein the circuit pattern includes: a first-first circuit pattern corresponding to the first region of the protective layer; and a first-second circuit pattern corresponding to the second region of the protective layer, wherein a height of the first region of the protective layer is lower than a height of the first-first circuit pattern, wherein a height of the second region of the protective layer is higher than a height of the first-second circuit pattern, wherein a surface of the first-first circuit pattern includes: a first portion in contact with the first region of the protective layer, and a second portion excluding the first portion, and wherein a surface roughness Ra of the first portion is different from a surface roughness Ra of t

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.

Abstract: A circuit board according to an embodiment includes an insulating layer including first to third regions; an outer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer, and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer circuit pattern includes a first trace disposed on an upper surface of the first region of the insulating layer; a first pad disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace; and a height of the first trace is different from a height of the first pad.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.

Abstract: A circuit board according to an embodiment includes: an insulating layer including first to third regions; an outer layer circuit pattern disposed on an upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer layer circuit pattern includes: a first trace disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein a height of the first trace is different from a height of the second trace; and an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace.

Abstract: A circuit board according to an embodiment includes: an insulating layer including a first region and a second region; a plurality of outer layer circuit patterns disposed on upper surfaces of the first region and the second region of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer and a second part disposed on the second region of the insulating layer; wherein the first part includes an upper surface having a curved surface and exposes an upper surface of an outer layer circuit pattern disposed on the first region of the insulating layer, wherein the second part covers an upper surface of an outer layer circuit pattern disposed on the second region of the insulating layer, and wherein at least a part of the upper surface of the first part is positioned lower than the upper surface of the outer layer circuit pattern.

Abstract: A circuit board according to an embodiment comprises: an insulating layer including first to third regions; an outer layer circuit pattern disposed on the upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed in the first region of the insulating layer, a second part disposed in the second region, and a third part disposed in the third region, wherein the outer layer circuit pattern has a first height, the third part of the solder resist is disposed on the upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first part includes a first sub-part disposed in the first sub-region and a second sub-part disposed in the second sub-region, the upper surface of the first sub-part is located to be higher than the upper surface of the outer layer circuit pattern and lower than the upper surface of the third part, the upper surface of the second sub-part is loc

Abstract: A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective l

Abstract: A compression release type engine brake includes a first opening unit and a second opening unit each including an exhaust rocker arm, an adjusting screw provided at an end portion of the exhaust rocker arm, a brake module in which brake oil is selectively and a brake piston mount portion is formed therein, a brake piston which is selectively protruded according to the oil supply inside the brake module, a reset member selectively exhausting the oil in the brake module, and a valve bridge connected to the brake piston and provided with an exhaust valve, and wherein a rocker arm protrusion is formed in the exhaust rocker arm of at least one of the first opening unit and the second opening unit, and the shaft spring presses the rocker arm protrusion and adjusts a distance between the first opening unit and the second opening unit.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and surrounding the second circuit pattern; and a protective layer disposed on an upper surface of the second insulating layer, wherein the second insulating layer has at least one recess formed on its upper surface, and wherein the protective layer is disposed in the recess formed on the upper surface of the second insulating layer.

Abstract: A compression release type engine brake includes a first opening unit and a second opening unit each including an exhaust rocker arm, an adjusting screw provided at an end portion of the exhaust rocker arm, a brake module in which brake oil is selectively and a brake piston mount portion is formed therein, a brake piston which is selectively protruded according to the oil supply inside the brake module, a reset member selectively exhausting the oil in the brake module, and a valve bridge connected to the brake piston and provided with an exhaust valve, and wherein a rocker arm protrusion is formed in the exhaust rocker arm of at least one of the first opening unit and the second opening unit, and the shaft spring presses the rocker arm protrusion and adjusts a distance between the first opening unit and the second opening unit.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.

Abstract: The printed circuit board according to the embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface of the first insulating layer or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and to surround the second circuit pattern; wherein the second circuit pattern is an outermost circuit pattern, wherein the second circuit pattern and the second insulating layer are disposed to protrude on the upper surface of the first insulating layer, and wherein a height of the second circuit pattern is greater than a height of the second insulating layer.

Abstract: An engine includes: a crankshaft pulley; a motor/generator mounted to a side of the engine and including a motor pulley; an auxiliary driving device pulley; a dual tensioner including a tensioner arm of which a first idler pulley is mounted to a first end of the tension arm and a second idler pulley is mounted to a second end of the tension arm, and the tensioner arm rotatable around a center of the motor/generator and a belt connecting the crankshaft pulley, the motor pulley, the auxiliary driving device pulley, the first idler pulley, and second idler pulley.

Abstract: A compression release type engine brake includes an exhaust rocker arm including a roller which is mounted at one end portion thereof, and the exhaust rocker arm rotating around a rocker arm shaft by the rotation of the exhaust cam, a valve bridge disposed on the other end portion of the exhaust rocker arm and connected to an exhaust valve, a brake module mounted between the exhaust rocker arm and the valve bridge, contacting with the roller and the brake cam lobe according to inflow of selectively supplied operation oil to open the exhaust valve by the exhaust cam, and the brake module including a reset valve closing operation oil inside therein, and a reset piston slidably mounted on the second end portion of the exhaust rocker arm and protruding out of the second end portion of the exhaust rocker arm according to the supply of reset oil to push the reset valve to expel the operation oil in the brake module outwards.

Abstract: A compression release type engine brake includes an exhaust rocker arm including a roller which is mounted at one end portion thereof, and the exhaust rocker arm rotating around a rocker arm shaft by the rotation of the exhaust cam, a valve bridge disposed on the other end portion of the exhaust rocker arm and connected to an exhaust valve, a brake module mounted between the exhaust rocker arm and the valve bridge, contacting with the roller and the brake cam lobe according to inflow of selectively supplied operation oil to open the exhaust valve by the exhaust cam, and the brake module including a reset valve closing operation oil inside therein, and a reset piston slidably mounted on the second end portion of the exhaust rocker arm and protruding out of the second end portion of the exhaust rocker arm according to the supply of reset oil to push the reset valve to expel the operation oil in the brake module outwards.

Abstract: A multilayer electronic component includes: a body including a dielectric layer, and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. A composite layer containing Sn and Ni is disposed at an interface between the internal electrode and the dielectric layer. The internal electrode includes an interface portion between the composite layer and a central portion of the internal electrode. The interface portion includes a ceramic additive.