Abstract: There is provided a camera module including a housing having a lens part installed therein; a flexible circuit board having an extension part on which a lamp is installed, the extension part being coupled to the housing such that the lamp is disposed to be adjacent to the lens part; and a shield can having first and second through-holes formed therein such that the lens part and the lamp are exposed therethrough.

Abstract: There is provided a camera module including a housing having a lens part installed therein; a flexible circuit board having an extension part on which a lamp is installed, the extension part being coupled to the housing such that the lamp is disposed to be adjacent to the lens part; and a shield can having first and second through-holes formed therein such that the lens part and the lamp are exposed therethrough.

Abstract: A print circuit board and a camera module having the same are disclosed. A printed circuit board of the present invention that is thermally coupled to an electronic device includes: a binding part, which has a binding pad coupled to the electronic device; a first ground, which is arrayed in an area heated at the time of thermal binding; and a second ground, which is connected to the first ground and arrayed adjacent to the binding pad. A multi-layered printed circuit board that is thermally coupled can be formed by forming a heat transfer path that is connected from the heating area to the binding pad through a ground.

Abstract: A camera module is disclosed. The camera module in accordance with an embodiment of the present invention includes a lens, an actuator that moves the lens in a direction of optical axis, and an image sensor that converts an image incident through the lens to an electrical signal and has extended depth of field.

Abstract: A print circuit board and a camera module having the same are disclosed. A printed circuit board of the present invention that is thermally coupled to an electronic device includes: a binding part, which has a binding pad coupled to the electronic device; a first ground, which is arrayed in an area heated at the time of thermal binding; and a second ground, which is connected to the first ground and arrayed adjacent to the binding pad. A multi-layered printed circuit board that is thermally coupled can be formed by forming a heat transfer path that is connected from the heating area to the binding pad through a ground.