Abstract: Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Abstract: Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.