Patents by Inventor WooSeong JANG

WooSeong JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240275387
    Abstract: A logic device includes a substrate; at least one first insulating layer on the substrate; a second insulating layer on the at least one first insulating layer; and a capacitor portion in the at least one first insulating layer and the second insulating layer, wherein the at least one first insulating layer includes a plurality of through-holes, the capacitor portion includes a capacitor structure including a lower electrode, a dielectric film, and an upper electrode, and the capacitor structure continuously extends along the inside of the plurality of through-holes and along an upper surface of the at least one first insulating layer around the plurality of through-holes.
    Type: Application
    Filed: August 16, 2023
    Publication date: August 15, 2024
    Inventors: Won Ji PARK, Sunoo KIM, Jaehee OH, Hyungwon KIM, WooSeong JANG, Taekyung KIM, Youngbin HYUN
  • Publication number: 20230154894
    Abstract: A three-dimensional integrated circuit structure including: a first die including a first power delivery network, a first substrate, a first device layer, and a first metal layer; a second die on the first die, the second die including a second power delivery network, a second substrate, a second device layer, and a second metal layer; a first through electrode extending from the first power delivery network to a top surface of the first metal layer; and a first bump on the first through electrode, the second power delivery network including: lower lines to transfer power to the second device layer; and a pad connected to a lowermost one of the lower lines, the first bump is interposed between and connects the first through electrode and the pad, and the first power delivery network is connected to the second power delivery network through the first bump and the first through electrode.
    Type: Application
    Filed: July 12, 2022
    Publication date: May 18, 2023
    Inventors: Jegwan HWANG, Jihyung KIM, Jeong Hoon AHN, Jaehee OH, Shaofeng DING, Won Ji PARK, WooSeong JANG, Seokjun HONG