Abstract: The present invention provides an apparatus for selectively micro pattern replication using ultrasonic waves, the apparatus including: (1) a to-be-processed substrate scheduled to be replicated with a first pattern in a first area which is a part of a predetermined area; (2) a mold provided with a second pattern at least in an area corresponding to the predetermined area, on which the to-be-processed substrate is fixed; (3) a masking layer provided to be contacted with the to-be-processed substrate on a side opposite to a side facing the mold and including a masking area in an area corresponding to the first area; and (4) a tool horn for transferring ultrasonic vibration to the masking layer. If the tool horn transfers the ultrasonic vibration to the masking layer, the to-be-processed substrate is pressed to the mold.