Abstract: A method and apparatus for evaluating the adhesion strength of a thin film are capable of quantitatively and qualitatively evaluating the adhesion strength of thin films that were difficult to evaluate with conventional methods. The method of evaluating the adhesion strength of a thin film includes: a step of placing an ultrasonic vibration needle in contact with one of an edge portion in a planar direction of a thin film formed on a substrate and a periphery of the edge portion, and applying ultrasonic vibration; a step of detecting occurrences of detachment at the edge portion of the thin film after application of the ultrasonic vibration; and a step of evaluating the adhesion strength of the thin film on the substrate according to the occurrences of detachment.

Abstract: The method for testing a characteristic of a magnetic head is performed in the form of a wafer, especially in a heating state and a cooling state. The method for testing a characteristic of a magnetic head, in which a wafer including a dummy read-element having a size equal to that of a completed read-element, a product read-element and a heat conductive section being provided in the vicinity of the dummy read-element is tested as a test sample, comprises the steps of: applying an external magnetic field to the test sample; bringing a heat conducting member into contact with the heat conductive section so as to heat or cool the dummy read-element via the heat conductive section; and testing an electromagnetic conversion characteristic of the dummy read-element in a heating state or a cooling state.