Abstract: A semiconductor memory device includes a peripheral circuit structure including a peripheral circuit and a first bonding pad, the first bonding pad connected to the peripheral circuit, a cell structure on the peripheral circuit structure, the cell structure including a second bonding pad bonded to the first bonding pad, and a pad structure on the cell structure. The cell structure includes a cell substrate having a first face, a second face opposite to the first face, a first contact plug extending through the cell substrate and connected to an electrode layer, and a second contact plug extending through the cell substrate and connected to the cell substrate. Each of the first contact plug and the second contact plug is connected to the pad structure, and a bypass via is in contact with the pad structure on the second face.

Abstract: A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

Abstract: A double-facing cooling-type power module has coolers on both sides. The power module includes: a first switch having the coolers on both sides; a second switch disposed independently from the first switch and having the coolers on both sides; and a common electrode coupled to both the first switch and the second switch.

Abstract: Disclosed herein are a double-side cooling type power module and a producing method thereof. The double-side cooling type power module includes a pair of semiconductor chips disposed between an upper substrate and a lower substrate. The double-side cooling type power module includes output terminal leads configured to be disposed on a lower surface of the upper substrate and each connected to the pair of semiconductor chips, respectively; a plus terminal lead configured to be disposed at one side of an upper surface of the lower substrate to be connected to any one semiconductor chip selected from the pair of semiconductor chips; and a minus terminal lead configured to be disposed at the other side of the upper surface of the lower substrate to be connected to the other semiconductor chip of the pair of semiconductor chips.

Abstract: A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

Abstract: A signal block and a double-faced cooling power module that uses the signal block is provided. The signal block includes a plurality of signal clips that are formed in a ribbon shape to connect a first signal pad formed on a semiconductor chip and a second signal pad formed on a signal lead frame. An insulator fixes the position of the plurality of signal clips while spacing the signal clips apart from each other.

Abstract: Disclosed herein are a double-side cooling type power module and a producing method thereof. The double-side cooling type power module includes a pair of semiconductor chips disposed between an upper substrate and a lower substrate. The double-side cooling type power module includes output terminal leads configured to be disposed on a lower surface of the upper substrate and each connected to the pair of semiconductor chips, respectively; a plus terminal lead configured to be disposed at one side of an upper surface of the lower substrate to be connected to any one semiconductor chip selected from the pair of semiconductor chips; and a minus terminal lead configured to be disposed at the other side of the upper surface of the lower substrate to be connected to the other semiconductor chip of the pair of semiconductor chips.

Abstract: Disclosed is a power module with double-sided cooling, comprising a semiconductor chip disposed between an upper substrate and a lower substrate; a first power lead disposed between the upper substrate and the semiconductor chip; a signal lead disposed between the upper substrate and the semiconductor chip, and spaced apart from the first power lead; a second power lead disposed between the lower substrate and the semiconductor chip; and a separation plate disposed between the first power lead, the signal lead, and the semiconductor chip; wherein the separation plate connects the first power lead with the semiconductor chip via a first hole formed through the separation plate, and connects the signal lead and the semiconductor chip via a second hole formed through the separation plate.

Abstract: An input terminal of a power module of double-side cooling includes: a plus plate which is divided into a plurality of first terminal areas coupled with any one or more of the plurality of semiconductor chips and is connected with an anode of a battery, wherein a first bridge area connects the plurality of first terminal areas with each other; a minus plate which is divided into a plurality of second terminal areas coupled with any one or more of the plurality of semiconductor chips which are not coupled with the plus plate and is connected with a cathode of the battery, wherein a second bridge area connects the plurality of second terminal areas with each other and is disposed adjacent to the first bridge area; and a separator which is made of an insulation material and disposed between the plus plate and the minus plate.

Abstract: A signal block and a double-faced cooling power module that uses the signal block is provided. The signal block includes a plurality of signal clips that are formed in a ribbon shape to connect a first signal pad formed on a semiconductor chip and a second signal pad formed on a signal lead frame. An insulator fixes the position of the plurality of signal clips while spacing the signal clips apart from each other.

Abstract: A double-facing cooling-type power module has coolers on both sides. The power module includes: a first switch having the coolers on both sides; a second switch disposed independently from the first switch and having the coolers on both sides; and a common electrode coupled to both the first switch and the second switch.

Abstract: A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process.

Abstract: A double-sided cooling power module may include a lower-end terminal, at least one pair of power semiconductor chips mounted on the lower-end terminal, at least one pair of horizontal spacers mounted on the at least one pair of power semiconductor chips, an upper-end terminal mounted on the at least one pair of horizontal spacers, and at least one pair of vertical spacers disposed between the upper-end terminal and the lower-end terminal.

Abstract: A double-sided cooling power module may include a lower-end terminal, at least one pair of power semiconductor chips mounted on the lower-end terminal, at least one pair of horizontal spacers mounted on the at least one pair of power semiconductor chips, an upper-end terminal mounted on the at least one pair of horizontal spacers, and at least one pair of vertical spacers disposed between the upper-end terminal and the lower-end terminal

Abstract: An integrated power converting apparatus for a vehicle is provided. The apparatus includes an inverter configured to drive a motor and a converter configured to output a low voltage. The inverter and the converter are disposed on an inner bottom surface of a housing. A shield plate is mounted at a predetermined height from the inner bottom surface of the housing. In addition, an integrated control board configured to operate the inverter and the converter is disposed on a top surface of the shield plate.

Abstract: A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (DBMs) are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs. Faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion.

Abstract: A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (DBMs) are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs. Faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion.

Abstract: The present invention provides a method for compensating nonlinearity of a resolver to control a motor in hybrid and fuel cell vehicles, thereby stably controlling the motor current during high-torque and high-speed operation. In preferred aspects, the present invention provides a method for compensating nonlinearity of a resolver to control a motor in hybrid and fuel cell vehicles, the method including collecting resolver position data; determining whether to perform resolver position correction in the corresponding vehicle; and compensating nonlinearity of the resolver based on the collected resolver position data, if it is determined that the resolver position correction is not performed.

Abstract: The present invention is directed to methods for forming an inverter circuit for operating a drive motor of an electric vehicle, which can more effectively reduce the switching noise generated by a power module during the operation of an inverter.

Abstract: The present invention provides an apparatus for effectively cooling electric modules such as an inverter and an LDC installed in a hybrid electric vehicle or an electric vehicle. The cooling apparatus for electric modules of a hybrid electric vehicle or an electric vehicle secures a uniform cooling efficiency and achieves an excellent heat radiating efficiency at the same time by realizing a new type of cooling system adapted to separately manage heat transfer in the cooling water passages of first and second electric modules by separating an upper passage of the first electric module and a lower passage of the second electric module using a cooling separator.