Patents by Inventor World Properties, Inc.

World Properties, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM
    Publication number: 20130034725
    Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
    Type: Application
    Filed: October 11, 2012
    Publication date: February 7, 2013
    Applicant: WORLD PROPERTIES, INC.
    Inventor: World Properties, Inc.