Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks arc then displaced to a desired curvature on the spline plate.

Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks arc then displaced to a desired curvature on the spline plate.

Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.

Abstract: Disclosed herein are devices and methods for delivering agents to a solid tissue.

Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.

Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.

Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: Apparatus are disclosed for securing an implement to a rigid longitudinally extended lifting member. A representative embodiment comprises a clamp that can be mounted to a forklift implement and/or socket for receiving a lifting member. A working surface engages the lifting surface of the lifting member. A cam is pivotably mounted on an axis transverse to and displaced from the working surface. The cam has an outwardly radiating spiraled engagement lobe that presses against the under-surface of the lifting member so as to press the lifting member between the working surface and the cam. Thus, the cam allows the clamp to be moved rearwardly but not forwardly on the lifting member. The cam, which is biased, can be characterized by having a fixed axis, being self-locking, and/or having a constant contact angle with the underside of the lifting member.

Abstract: Semiconductor wafers within a supporting vertical wafer tower are positioned within a vertical process chamber through a lower gate valve fixed to a supporting framework. The gate valve is sealed to a similar gate valve at the upper end of a movable load lock on the framework, within which the wafers are subjected to pre-treatment and post-treatment processes. Two load locks are alternately used in conjunction with the process chamber and a wafer loading station on the framework. In addition, a cleaning element is movably mounted on the framework for periodically maintaining the interior surfaces of the process tube within the process chamber.

Abstract: A raise bit (10) is constructed with a plurality of housings (30) secured to cutter carrier frame (14) and disposed about drive stem (12). Housings (30) include a rectangularly-shaped mounting box (48) for rotatably supporting an outboard roller cutter (28). Each housing (30) also includes an upright wall (34) having an upwardly tapered lug (40) extending along the upper edge portion thereof for seating within a correspondingly shaped groove (82) formed along the underside of shoulder section (78) of an L-shaped hanger bracket (68). A roller shell (72) is antifrictionally mounted on a spindle (70) extending outwardly from an upright section (76) of hanger bracket (68). Bracket (68) is held in hooked relationship over lug (40) by a pair of capscrews (74) extending downwardly through clearance holes formed in upright section (76) and engaging within a lower portion of upright wall (34).