Abstract: Several embodiments disclosed herein relate to apparatus and methods for tissue gathering. In some examples, disclosed is a tissue gathering device that includes a basket and a cylindrical shaft. The basket can include a plurality of tines and the cylindrical shaft can include a lumen that is disposed about a portion of the proximal end of the basket. In some examples, the basket can include 4, 6, 7, or 8 tines. The tines of the basket can have a plurality of different configurations.

Abstract: Several embodiments disclosed herein relate to apparatus and methods for treating a diverticulum. In some examples, disclosed is a clip placement device for diverticulum inversion. The clip placement device can include a tubular body, a clip attachment structure, and a pusher structure. In some examples, the clip attachment structure has a distal end that is attachable to a clip and wherein the clip attachment structure is configured to engage with the distal end of the tubular body. In some examples, the pusher structure is configured to removeably connect to the clip attachment structure.

Abstract: Several embodiments disclosed herein relate to apparatus and methods for treating a diverticulum. In some examples, disclosed is a device for inverting a diverticulum including a device body, a pushing apparatus that includes a rod and a blunt end, and a user actuated structure that provides control of the pushing apparatus. Also disclosed is a method for inverting a diverticulum. The method can include positioning a device along an outer wall of a colon at a diverticulum, inverting the outer surface of the diverticulum with the distal end of the device, and then actuating the user actuated structure such that the pushing apparatus interacts with the diverticulum to further invert the diverticulum.

Abstract: One or more conductors within a transducer or element are anodized and/or electrochemically etched for electrical isolation. Anodization allows for simultaneous creation of many insulation layers on a selective basis. Electrochemical etching allows for simultaneous creation of many electrode gaps on a selective basis, which can be later filled with insulating material such as epoxy. Conductors may then be plated over the anodized material for interconnecting other conductors or electrodes together.

Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.

Abstract: In k31 mode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perpendicular to the face of the array, such as along the sides of the elements. Piezoelectric material is poled along a dimension parallel with the face of the transducer and perpendicular to the direction of acoustic energy propagation. Using elements designed for k31 resonant mode operation may provide for a better electrical impedance match, such as where small elements sizes are provided for a multi-dimensional transducer arrays. For additional impedance matching, the elements may be made from multiple layers of piezoelectric ceramic. Since the elements operate from a k31 mode, the layers are stacked along the poling direction or perpendicular to a face of the transducer array for transmitting or receiving acoustical energy.

Abstract: Electrical connection is provided in a transducer stack through a backing block. A flexible circuit is sandwiched between pieces of acoustic attenuating material. For example, 2 to 200 or more flexible circuits are stacked in alternating layers with pieces of acoustically attenuating material. The alternating layers are then connected together to form a backing block with Z-axis electrical connection. The top surface of the connected backing block includes a plurality of exposed electrical traces from the flex circuit. Since flex circuits are used, the electrical traces are precisely aligned along one dimension. Since pre-formed acoustic attenuating material pieces are used, precise alignment is provided along a second or orthogonal dimension. The substrate holding the electrical traces in the flexible circuits provides more stability and allows for easier connection to circuit boards as compared to individual strips of metal.

Abstract: An ultrasound transducer assembly is disclosed having a housing, a transducer array mounted in the housing and an electronics assembly mounted in the housing, the electronics assembly including one or more sub-assemblies having heat generating components disposed thereon. The electronics sub-assemblies further include thermal conducting features which conduct heat generated by the heat generating components out of the electronics assembly where it can be further removed by other thermal management techniques. These other thermal management techniques may include techniques utilized to cool the transducer array.

Abstract: Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.