Abstract: An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component.

Abstract: A compact LED lighting unit, (1) for camera flash applications, comprising a reflective housing having (14) having a reflective base (15) and an open top (51); an LED (10) mounted within the reflective housing (14) and a beam shaping foil stack (12) provided over the open top of the housing (14); wherein, the foil stack (12) comprises first and second microstructured sheets (50, 52), each having an array of elongate locally parallel ridges (41) facing away from the LED, wherein the ridges of one sheet locally cross the ridges of the other sheet by an angle in the range 30 to 150 degrees.

Abstract: A lighting device is disclosed, which comprises a light transmitting element extending along a perimeter such that a hollow is defined by the light transmitting element. The light transmitting element comprises a light in-coupling surface adapted to couple light emitted by at least one light emitting element into the light transmitting element, and a light out-coupling surface adapted to couple light out of the light transmitting element. The lighting device is combined with a light reflecting envelope arranged to enclose the lighting device such that light emitted from the light out-coupling surface is reflected at an inner surface of the envelope. Thereby a reflected image may be produced, having an appearance resembling a candle flame.

Abstract: A compact LED lighting unit, (1) for camera flash applications, comprising a reflective housing having (14) having a reflective base (15) and an open top (51); an LED (10) mounted within the reflective housing (14) and a beam shaping foil stack (12) provided over the open top of the housing (14); wherein, the foil stack (12) comprises first and second microstructured sheets (50, 52), each having an array of elongate locally parallel ridges (41) facing away from the LED, wherein the ridges of one sheet locally cross the ridges of the other sheet by an angle in the range 30 to 150 degrees.

Abstract: An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component.

Abstract: A lighting device is disclosed, which comprises a light transmitting element extending along a perimeter such that a hollow is defined by the light transmitting element. The light transmitting element comprises a light in-coupling surface adapted to couple light emitted by at least one light emitting element into the light transmitting element, and a light out-coupling surface adapted to couple light out of the light transmitting element. The lighting device is combined with a light reflecting envelope arranged to enclose the lighting device such that light emitted from the light out-coupling surface is reflected at an inner surface of the envelope. Thereby a reflected image may be produced, having an appearance resembling a candle flame.

Abstract: An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of light emitting units (OELD) is provided. The second layer (D2) is arranged between the first die (D1) and the third die (D3). The first, second and third array are aligned such that light emitted from the first array of light emitting units (OLED) passed through the second array of via holes (VH) and is detected by the third array of light detecting units (PD). The first array of light emitting units and/or the third array of light detecting units are manufactured based on standard semiconductor manufacturing processes.

Abstract: An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of light emitting units (OELD) is provided. The second layer (D2) is arranged between the first die (D1) and the third die (D3). The first, second and third array are aligned such that light emitted from the first array of light emitting units (OLED) passed through the second array of via holes (VH) and is detected by the third array of light detecting units (PD). The first array of light emitting units and/or the third array of light detecting units are manufactured based on standard semiconductor manufacturing processes.

Abstract: An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of light emitting units (OELD) is provided. The second layer (D2) is arranged between the first die (D1) and the third die (D3). The first, second and third array are aligned such that light emitted from the first array of light emitting units (OLED) passed through the second array of via holes (VH) and is detected by the third array of light detecting units (PD). The first array of light emitting units and/or the third array of light detecting units are manufactured based on standard semiconductor manufacturing processes.

Abstract: A nozzle for jetting devices is described comprising e.g. one patterned silicon substrate enabling semiconductor mass production. The method of manufacturing the nozzle is characterized by using one mask layer deposited on the silicon substrate. The etching of the silicon substrate is done by means of a first isotropic etching step and a second anisotropic etching step through the mask layer, resulting in a perfectly aligned nozzle.

Abstract: An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of light emitting units (OELD) is provided. The second layer (D2) is arranged between the first die (D1) and the third die (D3). The first, second and third array are aligned such that light emitted from the first array of light emitting units (OLED) passed through the second array of via holes (VH) and is detected by the third array of light detecting units (PD). The first array of light emitting units and/or the third array of light detecting units are manufactured based on standard semiconductor manufacturing processes.