Abstract: An integrated photonic device for wavelength division multiplexing comprises: a wavelength-splitting/combining component configured to be re-used for both splitting a single signal to be split, wherein the signal to be split comprises plural wavelengths, to plural split signals, wherein each of the plural split signals is related to a unique wavelength band, and combining plural signals to be combined, wherein each of the plural signals to be combined is related to a unique wavelength band, to a single combined signal, wherein the wavelength-splitting/combining component comprises at least one output channel for providing an output signal and at least one response channel for receiving a response input signal from a light interaction induced by the output signal, wherein the output channel and the response channel are connected to different ports of the wavelength-splitting/combining component.

Abstract: An integrated photonic device for wavelength division multiplexing comprises: a wavelength-splitting/combining component configured to be re-used for both splitting a single signal to be split, wherein the signal to be split comprises plural wavelengths, to plural split signals, wherein each of the plural split signals is related to a unique wavelength band, and combining plural signals to be combined, wherein each of the plural signals to be combined is related to a unique wavelength band, to a single combined signal, wherein the wavelength-splitting/combining component comprises at least one output channel for providing an output signal and at least one response channel for receiving a response input signal from a light interaction induced by the output signal, wherein the output channel and the response channel are connected to different ports of the wavelength-splitting/combining component.

Abstract: A sensor comprises: a thin structure, which is configured to receive a force for deforming a shape of the thin structure and which is arranged above a substrate; and a waveguide for guiding an electro-magnetic wave comprising: a first waveguide part; and a second waveguide part; wherein the second waveguide part has a larger width than the first waveguide part; and wherein the first and the second waveguide parts are spaced apart by a gap which is sufficiently small such that the first and second waveguide parts unitely form a single waveguide, wherein one of the first and the second waveguide part is arranged at least partly on the thin structure and another of the first and the second waveguide part is arranged on the substrate.

Abstract: A waveguide for guiding an electro-magnetic wave comprises: a first waveguide part; and a second waveguide part; wherein the first waveguide part has a first width in a first direction (Y) perpendicular to the direction of propagation of the electro-magnetic wave and the second waveguide part has a second width in the first direction (Y), wherein the second width is larger than the first width; and wherein the first and the second waveguide parts are spaced apart by a gap in a second direction (Z) perpendicular to the first and second planes in which the waveguide parts are formed, wherein the gap has a size which is sufficiently small such that the first and second waveguide parts unitely form a single waveguide for guiding the electro-magnetic wave. The waveguide may be used in numerous applications, such as in a photonic integrated circuit, in a sensor or in an actuator.

Abstract: Embodiments relate to a sensor structure for an acoustical pressure sensor and an opto-mechanical sensor and system that may be used for detecting acoustical pressure waves. Embodiments of a sensor structure for an acoustical pressure sensor include an optical waveguide closed-loop resonator and a plurality of sensor elements. The individual sensor elements of the plurality of sensor elements are configured to be affected by an acoustical pressure wave such that a physical property of the individual sensor element is changed. The optical waveguide closed-loop resonator is arranged at the plurality of sensor elements and associated with each of the individual sensor elements such that a resonance frequency of the optical waveguide closed-loop resonator is shifted due to the affected physical properties of all individual sensor elements. The sensor structure provides a high sensitivity from each sensor element, which is advantageous in e.g.

Abstract: A method for manufacturing of a waveguide for guiding an electro-magnetic wave comprising: forming a first waveguide layer, a sacrificial layer and a protection layer on a first wafer, patterning to define a pattern of a first waveguide part and a supporting structure in the first waveguide layer; exposing the sacrificial layer on the first waveguide part while the protection layer still covers the sacrificial layer on the supporting structure; removing the sacrificial layer on the first waveguide part; removing the protection layer; bonding a second wafer to the sacrificial layer of the first wafer such that a second waveguide part is supported by the supporting structure and a gap corresponding to the thickness of the sacrificial layer is formed between the first and second waveguide parts.

Abstract: A sensor structure for an acoustical pressure sensor. The structure comprises an optical waveguide closed-loop resonator and a plurality of sensor elements, wherein the individual sensor elements of the plurality of sensor elements are configured to be affected by an acoustical pressure wave such that a physical property of the individual sensor element is changed. Further, the optical waveguide closed-loop resonator is arranged at said plurality of sensor elements and associated with each of the individual sensor elements of the plurality of sensor elements such that a resonance frequency of the optical waveguide closed-loop resonator is shifted due to the affected physical properties of all individual sensor elements of the plurality of sensor elements.

Abstract: A sensor comprises: a thin structure, which is configured to receive a force for deforming a shape of the thin structure and which is arranged above a substrate; and a waveguide for guiding an electro-magnetic wave comprising: a first waveguide part; and a second waveguide part; wherein the second waveguide part has a larger width than the first waveguide part; and wherein the first and the second waveguide parts are spaced apart by a gap which is sufficiently small such that the first and second waveguide parts unitely form a single waveguide, wherein one of the first and the second waveguide part is arranged at least partly on the thin structure and another of the first and the second waveguide part is arranged on the substrate.

Abstract: A waveguide for guiding an electro-magnetic wave comprises: a first waveguide part; and a second waveguide part; wherein the first waveguide part has a first width in a first direction (Y) perpendicular to the direction of propagation of the electro-magnetic wave and the second waveguide part has a second width in the first direction (Y), wherein the second width is larger than the first width; and wherein the first and the second waveguide parts are spaced apart by a gap in a second direction (Z) perpendicular to the first and second planes in which the waveguide parts are formed, wherein the gap has a size which is sufficiently small such that the first and second waveguide parts unitely form a single waveguide for guiding the electro-magnetic wave. A photonic integrated circuit component, a sensor and an actuator comprising the waveguide are disclosed.

Abstract: A method for manufacturing of a waveguide for guiding an electro-magnetic wave comprising: forming a first waveguide layer, a sacrificial layer and a protection layer on a first wafer, patterning to define a pattern of a first waveguide part and a supporting structure in the first waveguide layer; exposing the sacrificial layer on the first waveguide part while the protection layer still covers the sacrificial layer on the supporting structure; removing the sacrificial layer on the first waveguide part; removing the protection layer; bonding a second wafer to the sacrificial layer of the first wafer such that a second waveguide part is supported by the supporting structure and a gap corresponding to the thickness of the sacrificial layer is formed between the first and second waveguide parts.